IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0524112
(2006-09-19)
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등록번호 |
US-7479857
(2009-01-20)
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발명자
/ 주소 |
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출원인 / 주소 |
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대리인 / 주소 |
Brinks Hofer Gilson & Lione
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인용정보 |
피인용 횟수 :
1 인용 특허 :
39 |
초록
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Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Particular
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Particular embodiments include clusters of small vias that effectively function as one large via, thereby increasing stop band bandwidth and maximizing parallel plate capacitance. Cluster vias can be configured to additionally provide a shielded and impedance matched route within the interior area of the cluster through which signal vias can connect transmission lines disposed in planes lying above and below the PPW. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.
대표청구항
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What is claimed: 1. A cluster resonator, comprising: a first conducting plane; a second substantially parallel conducting plane; a cluster of vias of essentially uniform length oriented substantially normal to the conducting planes and interposed therebetween, each via in the cluster comprising a f
What is claimed: 1. A cluster resonator, comprising: a first conducting plane; a second substantially parallel conducting plane; a cluster of vias of essentially uniform length oriented substantially normal to the conducting planes and interposed therebetween, each via in the cluster comprising a first end and a second end; a first conducting pad disposed in a third plane substantially parallel and proximate the first conducting plane and connected to the vias of the cluster of vias proximate their first ends; a second conducting pad disposed in a fourth plane substantially parallel and proximate the second conducting plane and connected to the vias of the cluster of vias proximate their second ends, wherein the vias are physically connected to only the first and second conducting pads; wherein the first and second conducting pad is internal relative to the first and second conducting planes; and wherein the cluster resonator forms a physically isolated electrically conductive structure having a preselected reactance that provides an electromagnetically resonant shunt circuit between the conducting planes over a desired frequency band. 2. A cluster resonator, comprising: a first conducting plane; a second substantially parallel conducting plane; a cluster of vias of essentially uniform length oriented substantially normal to the conducting planes and interposed therebetween, each via in the cluster comprising a first end and a second end; first ends of first ones of vias in the cluster of vias connected to the first conducting plane; a first conducting pad disposed in a third plane internal to the region between the first and the second conducting planes and physically connected to the first ones of vias in the cluster of vias proximate their second ends; wherein the first ones of vias of the cluster of vias are disposed along a perimeter that defines a first interior region; and wherein one or more interior vias are routed within the first interior region of the cluster of vias, and the first conducting pad is separated from the second conducting plane by a non-conductive layer, and the first conducting pad is capacitively coupled to the second conducting plane. 3. The cluster resonator of claim 2 comprising second ones of vias disposed along a perimeter that defines a second interior region and physically connected proximate their first ends to the second conducting plane and proximate their second ends to a second conducting pad disposed in a fourth plane parallel to and proximate the first conducting plane, and the second conductive pad is separated from the first conducting plane by a non-conductive layer. 4. The cluster resonator of claim 2 comprising second ones of vias disposed along a perimeter that defines a second interior region that includes the first interior region and physically connected proximate their first ends to the second conducting plane and proximate their second ends to a second conducting pad disposed in a fourth plane parallel to and proximate to the first conducting pad. 5. The cluster resonator of claim 2, claim 3, or claim 4 wherein the interior vias comprise portions of transmission lines passing electrical signals vertically through the cluster resonator. 6. The cluster resonator of claim 1, claim 2, claim 3, or claim 4 wherein the topology comprises a mechanically balanced structure. 7. A cluster resonator comprising: a first conducting plane; a second substantially parallel conducting plane; a first conducting pad disposed in a third substantially parallel plane internal to the region between the first and second conducting planes; a first cluster of vias oriented substantially normal to the first conducting plane and the first conducting pad and disposed therebetween, each via of the cluster having a first end and a second end, wherein the first and second ends are physically connected respectively to the first conducting plane and first conducting pad; and a second conducting pad disposed in a fourth substantially parallel plane internal to the region between the first and second conducting planes; a second cluster of vias oriented substantially normal to the second conducting plane and second conducting pad and disposed therebetween, each via of the cluster having a first end and a second end, wherein the first and second ends are physically connected respectively to the second conducting plane and second conducting pad; and wherein the first and the second conducting pads are proximate and capacitively coupled to each other; and wherein the vias of the first cluster of vias are disposed along a perimeter such that an external electromagnetic field is substantially excluded from a region interior to the perimeter. 8. A cluster resonator comprising: a first conducting pad; a second substantially parallel conducting pad; and a cluster of vias of essentially uniform length disposed between and oriented substantially normal to the conducting pads, each via of the cluster of vias having a first end and a second end, wherein the first and second ends are physically connected respectively to the first and second conducting pads; wherein the vias of the cluster of vias are disposed along a perimeter such that an external electromagnetic field is substantially excluded from a region interior to the perimeter; and wherein one or more electrically isolated interior vias traverse the interior region of the cluster of vias, the interior vias comprising portions of transmission lines for passing electrical signals therethrough, and the first conductive pad and the second conductive pad are disposed so as to be capacitively coupled to a first conductive plane and a substantially parallel second conductive plane, respectively. 9. A cluster resonator comprising: a first conducting plane; a first substantially parallel conducting pad; a cluster of vias oriented substantially normal to the first conducting plane and first conducting pad and disposed therebetween, each via of the cluster having a first end and a second end, wherein the first and second ends are physically connected respectively to the first conducting plane and first conducting pad; wherein the vias of the cluster of vias are disposed along a perimeter such that an external electromagnetic field is substantially excluded from a region interior to the perimeter; and wherein one or more electrically isolated interior vias traverse the interior region of the cluster of vias, the interior vias comprising portions of transmission lines for passing electrical signals therethrough. and the first conducting pad is capacitively coupled to a second conducting plane. 10. The cluster resonator of, claim 7, claim 8, or claim 9, wherein a spacing of the vias of the cluster of vias in relation to the interior vias is selected to effect a predetermined line impedance in the interior vias. 11. The cluster resonator of, claim 7, claim 8, or claim 9, wherein a diameter of the vias of the cluster of vias is selected to effect a predetermined inductance. 12. The cluster resonator of, claim 7, claim 8, or claim 9, wherein a shape and area of the interior region of the vias of the cluster of vias is selected to effect a predetermined inductance. 13. The cluster resonator of claim 2, claim 7, claim 8, or claim 9, wherein the cluster of vias is disposed along a circular path. 14. The cluster resonator of claim 2, claim 7, claim 8, or claim 9, wherein the cluster of vias is disposed along an elliptical path. 15. The cluster resonator of claim 2, claim 7, claim 8, or claim 9, wherein the cluster of vias is disposed along a polygonal path. 16. The cluster resonator of claim 1, claim 2, claim 7, claim 8, or claim 9, wherein the first conducting pad is a metallic layer incorporated within a multilayered panel circuit. 17. The cluster resonator of claim 16, wherein the multi-layered panel circuit is a multi-layered printed circuit board and the cluster resonator comprises an array of plated through holes. 18. The cluster resonator of claim 16, wherein the multi-layered panel circuit is a multi-chip module. 19. The cluster resonator of claim 16, wherein the multi-layered panel circuit is a semiconductor chip. 20. The cluster resonator of claim 9 further comprising a second conducting plane substantially parallel to the first conducting plane wherein the first conducting pad is external to the region between the first and second conducting planes and capacitively coupled to the second conducting plane. 21. The cluster resonator of claim 9 further comprising a second conducting plane substantially parallel to the first conducting plane wherein the first conducting pad is internal to the region between the first and second conducting planes and capacitively coupled to the second conducting plane. 22. The cluster resonator of claim 1, claim 2, claim 7, claim 20, or claim 21 disposed in a periodic array, wherein preselected reactances of the cluster resonators effect a particular electromagnetic stop band for electromagnetic waves propagating within a waveguide comprising the first and second conducting planes. 23. The cluster resonator of claim 22 wherein a quantity, periodicity, inductance, and capacitance of the cluster resonators effect a particular electromagnetic stop band within the waveguide. 24. The cluster resonator of claim 1, claim 2, claim 7, claim 20, or claim 21, wherein preselected reactances of the cluster resonators form, over desired frequency ranges, electromagnetic shunt circuits between the first and second conducting planes. 25. The cluster resonator of claim 5, wherein a spacing of the vias of the cluster of vias in relation to the interior vias is selected to effect a predetermined line impedance in the interior vias. 26. The cluster resonator of claim 5, wherein a diameter of the vias of the cluster of vias is selected to effect a predetermined inductance. 27. The cluster resonator of claim 5, wherein a shape and area of the interior region of the vias of the cluster of vias is selected to effect a predetermined inductance.
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