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A system and method of dissipating heat form electronic components in an electronic device is disclosed. The apparatus includes a retaining device having a cavity extending upwardly a predetermined distance from a lower surface of the casing. A spring is seated within the cavity such that a lower po

A system and method of dissipating heat form electronic components in an electronic device is disclosed. The apparatus includes a retaining device having a cavity extending upwardly a predetermined distance from a lower surface of the casing. A spring is seated within the cavity such that a lower portion of the spring protrudes outwardly a predetermined distance from the lower surface of the casing. A heatsink is positioned below a heat generating component such that the spring of the retaining device forces the heat generating component against the heatsink.

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What is claimed is: 1. An apparatus, comprising: electronic circuitry including a component structured to generate heat during operation; a heatsink structured to dissipate at least a portion of the heat generated by the component; a spring including a first end portion opposite a second end portio

What is claimed is: 1. An apparatus, comprising: electronic circuitry including a component structured to generate heat during operation; a heatsink structured to dissipate at least a portion of the heat generated by the component; a spring including a first end portion opposite a second end portion; and a retaining device including a cavity receiving the first end portion of the spring, the retaining device being positioned in an overlapping relationship with the component and fixed in relation to the heatsink to bias the spring and position the second end portion of the spring to clamp the component in a thermally coupled relationship with the heatsink, wherein the cavity extends from an opening to an engagement seat opposite the opening, and the engagement seat is shaped and sized to engage the first end portion of the spring in a press-fit coupled relationship. 2. The apparatus of claim 1, wherein the retaining device includes a base portion and an offset base portion, wherein the cavity is defined in the offset base portion. 3. The apparatus of claim 2, wherein the spring is of a coil type and protrudes outwardly from the offset base portion. 4. The apparatus of claim 1, wherein the component is a semiconductor component and the heatsink includes a thermally conductive block thermally coupled to a plate defining a passageway structured to flow a cooling fluid therethrough. 5. The apparatus of claim 1, wherein the retaining device defines a plurality of other cavities each receiving a corresponding one of a number of other springs, the electronic circuitry includes a number of heat emitting semiconductors, and the other springs each apply a clamping force to a respective one of the semiconductors to maintain thermal coupling to the heatsink. 6. The apparatus of claim 1, further comprising means for fixing the retaining device to the heatsink. 7. The apparatus of claim 1, wherein: the retaining device is a unitary piece of metal and a thermally conductive adhesive layer is positioned between the component and the heatsink, and the thermally conductive adhesive layer is in contact with each of the component and the heatsink. 8. A method, comprising: positioning electronic circuitry including a component structured to generate heat during operation on a portion of a heatsink structured to dissipate at least a portion of the heat generated by the component; providing a spring comprising a first end portion opposite a second end portion; providing a retaining device comprising a cavity that extends from an opening to an engagement seat opposite the opening; connecting the first end portion of the spring in the engagement seat of the retaining device with the second end portion protruding from the opening in an uncompressed state; and after the connecting of the first end portion of the spring, positioning the retaining device in an overlapping relationship with the component and in fixed relation to the heatsink to bias the spring to clamp the component in a thermally coupled relationship with the heatsink. 9. The method of claim 8, further comprising: connecting the heatsink to a cold plate; and circulating a cooling fluid through the cold plate. 10. The method of claim 9, which includes providing the electronic circuitry in power generation system for a vehicle. 11. The method of claim 9, wherein the retaining device is coupled to the heatsink using a stud and a nut. 12. The method of claim 8, further comprising positioning a thermally-conductive and electrical insulating material between the heatsink and the component, the material being in contact with the heatsink and the component. 13. The method of claim 8, wherein the connecting of the first end portion includes fixing the first end portion in the engagement seat in a press-fit coupled relationship. 14. An apparatus, comprising: electronic circuitry including a component structured to generate heat during operation; a heatsink structured to dissipate at least a portion of the heat generated by the component; a coil spring including a first end portion; and a retaining device including a cavity receiving the first end portion of the spring, fixed in relation to the heatsink, to hold the spring between the retaining device and the component in a compressed state to exert a force to maintain thermal coupling between the component and the heatsink, and wherein the cavity extends from an opening to an engagement seat opposite the opening, and the engagement seat is shaped and sized to engage the first end portion of the spring in a fixed relationship. 15. The apparatus of claim 14, wherein the retaining device includes a base portion and an offset base portion, and wherein the cavity is located in the offset base portion. 16. The apparatus of claim 15, wherein the spring is seated in an upwardly facing cavity in the lower surface of the retaining device. 17. The apparatus of claim 14, further comprising a cold plate engaged with a lower surface of the heatsink and wherein the cold plate includes a tubing inside the cold plate to convey a cooling fluid. 18. The apparatus of claim 17, further comprising a vehicle carrying a power generation system, the electronic circuitry being included in the power generation system. 19. The apparatus of claim 14, further comprising a stud positioned in apertures in the heatsink and the retaining device, wherein a nut is placed on an end of the stud to maintain the spring in forcible engagement with the component. 20. The apparatus of claim 14, further comprising a thermally-conductive and electrically insulating material between the heatsink and the component.