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In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are f

In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are fitted is formed in the circuit board 11, and a housing recess portion 18 in which the semiconductor devices 11 are housed is provided to both heat radiation plates 12a, 12b fitted to both surfaces of the circuit board 11 respectively and a fitting edge portion 25 is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means 20 for fixing both heat radiation plates 12a, 12b to the circuit board 11 by caulking to align with the fitting hole is provided to fitting edge portions 25 integrally with the heat radiation plates 12a, 12b.

대표청구항 ▼

What is claimed is: 1. A semiconductor module comprising: a circuit board; semiconductor devices mounted on both surfaces of the circuit board; and heat radiation plates provided to the both surfaces of the circuit board to cover the semiconductor devices, wherein the circuit board has a fitting ho

What is claimed is: 1. A semiconductor module comprising: a circuit board; semiconductor devices mounted on both surfaces of the circuit board; and heat radiation plates provided to the both surfaces of the circuit board to cover the semiconductor devices, wherein the circuit board has a fitting hole through which the heat radiation plates are fitted, and wherein each of the heat radiation plates has a fitting edge portion in a position of the heat radiation plate that overlaps with a position in which the fitting hole is formed, and each of the heat radiation plates has a fixing member, which is provided at the fitting edge portion and integrally with the heat radiation plate, for fixing both of the heat radiation plates to the circuit board by caulking to align with the fitting hole, wherein each of the fixing members is received in said fitting hole, and wherein the fixing member formed on one of the heat radiation plates includes a fitting projection and the fixing member formed on the other of the heat radiation plates defines a fitted hole; and wherein the fitting projection has a first projection inserted into the fitting hole and a second projection extending from an end surface of the first projection and received in said fitted hole. 2. A semiconductor module comprising: a circuit board; semiconductor devices mounted on both surfaces of the circuit board; and heat radiation plates provided to the both surfaces of the circuit board to cover the semiconductor devices, wherein the circuit board has a fitting hole through which the heat radiation plates are fitted, and wherein each of the heat radiation plates has a fitting edge portion in a position of the heat radiation plate that overlaps with a position in which the fitting hole is formed, and each of the heat radiation plates has a fixing member, which is provided at the fitting edge portion and integrally with the heat radiation plate, for fixing both the heat radiation plates to the circuit board by caulking to align with the fitting hole, wherein the fitting hole is formed in plural as a paired arrangement in which arrangement positions are common on front and back surfaces of the circuit board, and the fixing member formed to correspond to one fitting hole as the paired arrangement and the fixing member formed to correspond to other fitting hole as the paired arrangement are formed on both heat radiation plates as paired structures that are fitted mutually and fixed by caulking. 3. The semiconductor module according to claim 2, wherein the fitting hole is formed as a notch in both end edges of the circuit board in a longitudinal direction respectively. 4. The semiconductor module according to claim 2, wherein one of the fixing members is formed as a fitting projection and other of the fixing members is formed as a fitted hole that is combined with the fitting projection. 5. The semiconductor module according to claim 1, wherein the fitted hole is formed to have a diameter dimension through which the second projection is inserted into a projected portion that is inserted into the fitting hole, and then fixed by caulking, and wherein a height sum of the first projection and a level difference portion of the projected portion coincides with a thickness of the circuit board. 6. The semiconductor module according to claim 1, wherein the fitted hole is formed to have a diameter dimension through which the second projection is inserted and then fixed by caulking, and wherein a height of a level difference portion of the first projection coincides with a thickness of the circuit board. 7. A semiconductor module heat radiation plate used in assembling the semiconductor module in which a fitting hole formed in a circuit board is formed in plural as a paired arrangement in which arrangement positions are common on front and back surfaces of the circuit board, the heat radiation plate comprising: a first fixing member formed to correspond to one fitting hole as the paired arrangement; and a second fixing member formed to correspond to other fitting hole as the paired arrangement, wherein the first and second fixing members are formed on the heat radiation plate as paired structures with the other heat radiation plate with the same structure so that the first and second fixing members of the heat radiation plate are fitted mutually and fixed by caulking to those of the other heat radiation plate. 8. The semiconductor module heat radiation plate according to claim 7, wherein the first fixing member is formed as a fitting projection and the second fixing member is formed as a fitted hole that is combined with the fitting projection. 9. The semiconductor module according to claim 1, wherein each of the heat radiation plates has a housing recess portion in which the semiconductor device is housed. 10. The semiconductor module according to claim 1, wherein the fitting edge portions are provided within a board plane of the circuit board on an outside of the housing recess portion. 11. The semiconductor module according to claim 2, wherein each of the heat radiation plates has a housing recess portion in which the semiconductor device is housed. 12. The semiconductor module according to claim 2, wherein the fitting edge portions are provided within a board plane of the circuit board on an outside of the housing recess portion.