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Computer chassis frame support 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • A47B-097/00
출원번호 US-0803474 (2004-03-17)
등록번호 US-7484818 (2009-02-03)
우선권정보 TW-92204073 U(2003-03-17)
발명자 / 주소
  • Cheng,Stan
출원인 / 주소
  • Shuttle Inc.
대리인 / 주소
    Muncy, Geissler, Olds, & Lowe, PLLC
인용정보 피인용 횟수 : 1  인용 특허 : 52

초록

A computer chassis frame includes a support structure on a load-bearing surface of the frame to support a computer chassis cover installed over the frame. The support structure may comprise a plurality of rounded portions on the load-bearing surface of the computer chassis frame, which provide multi

대표청구항

I claim: 1. A computer chassis apparatus comprising: a chassis frame comprising a plurality of load-bearing rails extending from a front frame to a rear frame and located on edges of the frame; a chassis cover for fitting over the chassis frame; a plurality of dome-shaped protrusions formed on tops

이 특허에 인용된 특허 (52)

  1. Bhatia Rakesh, Apparatus for cooling electronic components within a computer system enclosure.
  2. Gonsalves Daniel D. ; Antonuccio Robert S. ; Carney James M. ; Montagna Joseph J., Apparatus for dissipating heat from a circuit board having a multilevel surface.
  3. Liu, Jefferson, Buckling device of a heat dissipating module.
  4. Shen Tsan-Jung (3F. ; No. 52 ; Lane 280 ; Min Chuan E. Rd. ; Sec. 6 Taipei TWX), CPU heat dissipating apparatus.
  5. Cook Stephen ; Jeffries John ; Steffes Karl, Computer access panel having a biased cover latching mechanism and method.
  6. Radloff Timothy ; Cook Stephen, Computer access panel having single point release interlock mechanism.
  7. Rolf A. Konstad, Computer assembly for cooling high powered microprocessors.
  8. Chang, Je-Young, Computer assembly providing cooling for more than one electronic component.
  9. Su, Chih-Min, Computer case having pull bar structure for removing front panel.
  10. Wang, Liang-Chin; Hu, Jian, Computer enclosure incorporating drive bracket.
  11. Lin, WanCheng; Gan, Li Yun, Computer enclosure incorporating drive brackets.
  12. Liao, Nien Chiang; Lin, Chiu-Chen, Computer enclosure incorporating pivotable drive bracket.
  13. Chen, Yun-Lung, Computer enclosure incorporating support frame for motherboard.
  14. Chen, Yun Lung, Computer enclosure with drive bracket.
  15. Ho Hsin Chien,TWX, Computer mainframe housing.
  16. Chang Lien-Sheng (No. 297 ; Chungshan Yi Rd. Lu Chu Hsiang ; Taipei Hsien TWX), Computer mainframe housing assembled with hooks and notches.
  17. Dewey Doug ; Radloff Timothy ; Scholder Erica, Computer power supply mounting apparatus and method.
  18. Cook Stephen ; Jeffries John ; Steffes Karl, Computer system access panel having a biased cover latching mechanism.
  19. Gebara Ghassan R. ; Bolognia David F., Configuring a computer system.
  20. Shibasaki Kazuya,JPX, Cooling unit for cooling a heat-generating component and electronic apparatus having the cooling unit.
  21. Ishikawa, Kenichi, Cooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit.
  22. Chen, Yun-Lung; Su, Gang; Ai, LiXin, Drive bracket assembly.
  23. Chen, Wan-Tien, Fastener for a heat-radiator.
  24. Chen, Yun Lung, Fastening device for securing a data storage device.
  25. Liu, Yu Tai; Lin, Kuo Chih; Liu, Alvin, Fixing apparatus for data storage devices.
  26. Wei, Wen-Chen, Flexible heat pipe.
  27. McAnally Andrew ; Cook Stephen ; West Blake, Hard disk drive mounting bracket.
  28. Sheu, Young-Kwang, Heat dissipation of low flow resistance in a notebook computer.
  29. Werner Richard W. (San Ramon CA) Hoffman Myron A. (Davis CA granted to U.S. Department of Energy under the provisions of 42 U.S.C. 2182), Heat pipes for use in a magnetic field.
  30. Wei Ta Lo CN, Heat removal system.
  31. Blomquist Michael L. (451 Constitution Ave. ; Unit E Camarillo CA 93010), Heat sink and retainer for electronic integrated circuits.
  32. Tsung-Lung Lee TW; Cheng-Tien Lai TW; Zili Zhang CN, Heat sink assembly.
  33. Liu, HeBen, Heat sink clip.
  34. Yu Shu-Jen,TWX, Heat-radiating structure for CPU.
  35. Herman W. Chu ; Rakesh Bhatia, High performance notebook PC cooling system.
  36. Bookhardt Gary L. ; McEuen Shawn S., Integrated heat dissipation apparatus.
  37. Mroz Steven M., Locking bracket for a drive housing and method of assembly.
  38. Ho Hsin C. (20F-1 ; 268 ; Sec. 1 ; Wen-Hua Road Pan Chiao City ; Taipei TWX), Mainframe housing of a personal computer.
  39. Johnson Robert W. ; Cook Stephen T., Mounting bracket assembly for system components in a computer.
  40. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  41. Toor John, Personal computer and chassis having interchangeable trim plates for horizontal model and tower model configuration, one.
  42. Tanaka, Wataru; Tatsukami, Ikki; Iijima, Takashi, Portable electronic device capable of efficiently cooling heat-generation electronic component.
  43. Inoue, Koichi, Radiator mechanism and electronic apparatus.
  44. Chao-Hsuan Yu TW, Screwless disk drive frame positioning structure.
  45. Kristina L Mann, Single piece heat sink for computer chip.
  46. Ho Hsin Chien,TWX, Sliding case mounting structure.
  47. Kyu-Yeob Jeong KR, Structure for mounting electronic devices to a computer main body.
  48. Hsu Kai (1st Fl. ; No. 42 ; Lane 103 ; Sec. 1 ; Hsin Sheng S. Road Taipei TWX), Structure of computer housing.
  49. Navia Jaimie A. (West Linn OR) Kuzmanich Gregory M. (Beaverton OR), Support member that couples an electronic card to a chassis.
  50. Nicolai Walter,DEX ; Munch Udo,DEX ; Strackbein Heinrich,DEX, Switching cabinet.
  51. Shiaw-Jong S. Chen ; Roger J. Hooey, Top mounted cooling device using heat pipes.
  52. Foster Alan D. (Los Altos CA) August Mark P. (Los Gatos CA), Unitary heat sink for integrated circuits.

이 특허를 인용한 특허 (1)

  1. Lee, Cheng-Huang, Electronic device and case assembling method for electronic device.
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