Fastening device for mounting thermal module to electronic component
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
F28F-007/00
출원번호
US-0964905
(2007-12-27)
등록번호
US-7489510
(2009-02-10)
발명자
/ 주소
Hung,Jui Wen
Liang,Cheng Jen
출원인 / 주소
Foxconn Technology Co., Ltd.
인용정보
피인용 횟수 :
7인용 특허 :
9
초록▼
A thermal module includes a heat sink (400), a heat pipe (200) and a fastening device (300). The heat pipe (200) includes an evaporator (240) and a condenser (220) connected with the heat sink. The fastening device includes a base member (320) and a spring member (340). The base member includes a co
A thermal module includes a heat sink (400), a heat pipe (200) and a fastening device (300). The heat pipe (200) includes an evaporator (240) and a condenser (220) connected with the heat sink. The fastening device includes a base member (320) and a spring member (340). The base member includes a contacting plate (322) and two locating pins (324). Each locating pin includes a head portion (3240) and a neck portion (3244). The spring member includes a pressing portion (342) pressing the evaporator towards the contacting plate. Two locating holes (348) are defined in the pressing portion. The spring member is mounted on the base member via engagement of the locating holes with the locating pins. The spring member has a thickness smaller than a length of each of the neck portions and is movable along the neck portions to suit for a size of the evaporator.
대표청구항▼
What is claimed is: 1. A fastening device configured for mounting a heat pipe to a heat-generating component, the fastening device comprising: a base member comprising a contacting plate for contacting with the heat-generating component, and two locating pins extending upwardly from the contacting
What is claimed is: 1. A fastening device configured for mounting a heat pipe to a heat-generating component, the fastening device comprising: a base member comprising a contacting plate for contacting with the heat-generating component, and two locating pins extending upwardly from the contacting plate in such a manner that the heat pipe is disposed on the contacting plate with the locating pins clamping at opposite lateral sides of the heat pipe, respectively, each pin having a head portion and a neck portion below the head portion; and a spring member comprising two ends configured for being attached to a board with the heat-generating component mounted thereon, and a middle portion having two locating holes aligning with the locating pins, respectively; wherein the spring member is held at the neck portions after the head portions of the locating pins extend through the locating holes of the spring member; thereby sandwiching the heat pipe between the middle portion of the spring member and the contacting plate. 2. The fastening device as described in claim 1, wherein the spring member is detachably mounted on the base member. 3. The fastening device as described in claim 1, wherein the contacting plate includes a heat-absorbing plate and two wings intercrossed with the heat-absorbing plate, and the locating pins are formed at diagonal corners of the heat-absorbing plate with the two wings each neighboring one of the locating pins. 4. The fastening device as described in claim 3, wherein the wings and the heat-absorbing plate together define a road between the locating pins to support the heat pipe thereon. 5. The fastening device as described in claim 1, wherein each end of the spring member has an arm slantways extending upwardly from an end of the middle portion. 6. The fastening device as described in claim 5, wherein an L-shaped ear is formed at an end of each of the arms. 7. The fastening device as described in claim 1, wherein the spring member is made of a material which has a rigidity larger than that of the base member. 8. The fastening device as described in claim 1, wherein a layer of solder is spread on the contacting plate, and the heat pipe is mounted on the base member via soldering. 9. The fastening device as described in claim 1, wherein the spring member has a thickness smaller than a length of each of the neck portions along an extension direction of the locating pins, so that the spring member is movable along the neck portions. 10. A thermal module comprising: a heat sink; a heat pipe comprising an evaporator configured for thermally connecting with a heat-generating component mounted on a top side of a printed circuit board, and a condenser connected with the heat sink; and a fastening device configured for mounting the evaporator to the heat-generating component, comprising: a base member comprising a contacting plate and two locating pins; the contacting plate having a bottom surface for contacting with the heat-generating component and a top surface for supporting the evaporator thereon; the locating pins extending upwardly from the contacting plate and the evaporator being positioned between the locating pins; each locating pin comprising a head portion and a neck portion; and a spring member comprising a pressing portion directly pressing the evaporator towards the contacting plate, and two ears formed on ends of the spring member, the ears configured for attaching the spring member to the printed circuit board; two locating holes defined in the pressing portion and aligning with the locating pins respectively; wherein the locating holes each have a diameter larger than that of the neck portion but smaller than that of the head portion, and the spring member is detachably mounted on the base member via engagement of the locating holes with the locating pins; and wherein the spring member has a thickness smaller than a length of each of the neck portions along an extension direction of the locating pins, so that the spring member is movable along the neck portions to suit for a size of the evaporator. 11. The thermal module as described in claim 10, wherein the contacting plate includes a heat-absorbing plate and two wings intercrossed with the heat-absorbing plate, and the locating pins are formed at diagonal corners of the heat-absorbing plate with the two wings each neighboring one of the locating pins. 12. The thermal module as described in claim 11, wherein the wings and the heat-absorbing plate together define a road between the two locating pins to support the evaporator. 13. The thermal module as described in claim 10, wherein the spring member is made of a material which has a rigidity larger than that of the base member. 14. The thermal module as described in claim 10, wherein a layer of solder is spread on the contacting plate, and the evaporator is mounted on the base member via soldering. 15. The thermal module as described in claim 10, further comprising a base plate attached to a bottom side of the printed circuit board, the base plate having a plurality of mounting ears for attaching the base plate to the printed circuit board. 16. The thermal module as described in claim 15, wherein two of the mounting ears align with the ears of the spring member, and fasteners are extended through the ears of the spring member and the printed circuit board to engage with the two of the mounting ears. 17. The thermal module as described in claim 10, wherein the heat sink is disposed at a lateral side of the printed circuit board. 18. The thermal module as described in claim 10, wherein the ears of the spring member having an L-shaped profile.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (9)
Homer, Steven S.; Lev, Jeffery A., Computer system having removable processor and modular thermal unit.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.