Method for manufacturing a product sensor, and a product sensor
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01R-027/02
G01R-003/00
출원번호
US-0121274
(2005-05-03)
등록번호
US-7492164
(2009-02-17)
우선권정보
FI-20021964(2002-11-04)
발명자
/ 주소
Hanhikorpi,Marko
Str��mberg,Samuli
출원인 / 주소
UPM Kymmene Corporation
대리인 / 주소
Fitch, Even, Tabin & Flannery
인용정보
피인용 횟수 :
5인용 특허 :
15
초록▼
The invention relates to a method for manufacturing a product sensor (2), and a product sensor (2). In the manufacturing method, a circuitry pattern is formed in the product sensor (2) for achieving an antenna circuit (L, C1, C2). In addition, the product sensor (2) is provided with at least one mea
The invention relates to a method for manufacturing a product sensor (2), and a product sensor (2). In the manufacturing method, a circuitry pattern is formed in the product sensor (2) for achieving an antenna circuit (L, C1, C2). In addition, the product sensor (2) is provided with at least one measuring means (13), whose at least one electrical property is affected by at least one condition. Product control is performed by measuring the at least one measuring means (13) formed in the product sensor (2), which means is affected by at least one condition, at least one electrical condition. In order to form a product sensor, at least a first (3) and a second module (5) are formed, the first of the modules (3) being provided with at least a part of said antenna circuit, and the second module (5) being provided with said at least one measuring means (13). Said at least two modules (3, 5) are connected to each other.
대표청구항▼
What is claimed is: 1. A method for the manufacture of a product sensor effective for use in product control, the product sensor having an antenna circuit and at least one measuring device having at least one electrical property affected by at least one condition, the method comprising: applying a
What is claimed is: 1. A method for the manufacture of a product sensor effective for use in product control, the product sensor having an antenna circuit and at least one measuring device having at least one electrical property affected by at least one condition, the method comprising: applying a conductor on a first continuous flexible web to provide at least part of antenna circuits and form a first module web with the at least part of the antenna circuits in spaced relation along the first web; applying measuring devices on a second flexible continuous web to provide a measuring device web and form a second module web with measuring devices in spaced relation along the second web; and bonding the first module web with the second module web to provide a product sensor web with product sensors in side by side relation, the at least part of the antenna circuits on the first web and the measuring devices on the second web, the bonded modules and configured to effect at least one of the following: (a) the first module and second bonded to each other to electrically couple the first and second module and form a resonance circuit common to both modules and (b) the second module arranged in the product sensor to electrically alter properties of an electric resonance circuit within the first module. 2. The method according to claim 1, wherein the electrical property is selected from the group consisting of electrical resistance, electrical capacitance and the first module web bonded with the second module web to electrically couple the at least part of the antenna circuits with the measuring devices, the electrical coupling selected from the group consisting of capacitive coupling and inductive coupling. 3. The method according to claim 2, wherein the electrical property of the measuring devices change, and the change in the electrical property is measured by measuring the resonance frequency of the resonance circuit. 4. The method according to claims 1 or 2, wherein the electric resonance circuit includes a coil which is in the first module web. 5. The method according to claim 4, wherein the measuring devices have an impedance and the at least one condition affects the impedance, and wherein the at least one condition has a normal status and an abnormal status, the method further including setting the impedance of the measuring devices in such a manner that in the normal status the measuring devices causes a short circuit in the antenna circuit and in the abnormal status the impedance of the measuring devices increases to remove the short circuit. 6. The method according to claim 4, wherein the resonance circuits have a quality value, the electric property of the measuring devices change and the change in the electrical property is measured by measuring the quality value. 7. The method according to claim 6, wherein the resonance circuits have a resonance frequency which changes as the electrical property changes, and the change in the electrical property is measured by measuring the resonance frequency of the resonance circuit. 8. The method according to claim 1 wherein the electrical property of the measuring device changes, and the change in the electrical property is measured by measuring the resonance frequency of the resonance circuit. 9. The method in accordance with claim 1, wherein the method further includes forming the measuring devices from a metal selected from the group consisting of silver, copper, iron and aluminum. 10. The method in accordance with claim 1, wherein the bonding of the first module web with the second module web includes bonding the first and second web with a connector selected from the group consisting of thermoplastic film, an isotropic paste, an anisotropic paste, an isotropic glue and an anisotropic glue. 11. The method according to claim 1, wherein the method further includes providing the product sensor with a memory for storing information from the measuring device about the electrical property which is related to the condition, and configuring the product sensor to measure the information about the electrical property of the measuring device and storing the information in the memory. 12. The method according to claim 11, wherein the information about the electrical property stored in the memory is compared to information about the electrical property being measured, the comparison being used to determine a change in the electrical property and condition. 13. The method according to claim 11 or 12, wherein the information stored in the memory is transferred from the product sensor by the antenna circuit. 14. The method according to claim 1, wherein the product sensor is configured to determine a characteristic curve of the measuring device in relation to a measured condition, in which case the product sensor is configured to determine a change in the measured condition by comparing the measurement result with the characteristic curve. 15. The method according to claim 1, wherein electric energy is directed to the product sensor by the antenna circuit. 16. The method according to claim 1 wherein the product sensor further includes an RFID device comprising and RFID circuit to electrically alter properties of a resonance circuit within the first module, and wherein the measuring device is configured to be in communication with the RFID device to send signals to the RFID device and the RFIF device configured to send signals responsive to the signals from the measuring device. 17. The method according to claim 16 wherein the RFID device further include memory in communication with the RFID circuit and which memory stores information. 18. A product sensor comprising: at least one first flexible substrate; an antenna circuit which includes at least part of a circuitry pattern on the first substrate, the at least part of the circuitry pattern and the first substrate comprising a first module; at least one second flexible substrate; at least one measuring device on the second substrate which has at least one electric property which is affected by at least one condition, the at least one measuring device and second substrate comprising a second module, the product sensor including the first module and the second module bonded to each other and configured to effect at least one of the following: (a) the first module and second module bonded to each other to form a resonance circuit common to both modules and (b) the second module arranged in the product sensor to electrically alter properties of a resonance circuit within the first module. 19. The product sensor according to claim 18, wherein the measuring device includes a property selected from the group consisting of resistance and capacitance which property changes when the condition changes. 20. The product sensor according to claim 18 or 19, wherein the antenna circuit comprises the electric resonance circuit, the antenna circuit including a coil, the coil of the electrical resonance circuit being in the first module. 21. The product sensor according to claim 18 or 19, wherein the measuring device is in the electric resonance circuit. 22. The product sensor according to claim 18, wherein the measuring device includes a metal selected from the group consisting of silver, copper, iron and aluminum. 23. The product sensor according to claim 22, wherein the at least two modules are bonded to each other by a connector selected from the group consisting of thermoplastic film, an isotropic paste, an anisotropic paste, an isotropic glue and an anisotropic glue. 24. The product sensor according to claim 23, wherein the modules are configured so that the condition is measured, wherein the condition is at least one parameter selected from the group consisting of hydrogen sulphite, moisture, water, oxygen, temperature, light, ultraviolet radiation, infrared radiation, pressure and acceleration. 25. The product sensor according to claim 18, wherein the antenna circuit comprises an antenna, the antenna comprising at least one conductor formed in said first module. 26. The product sensor according to claim 18, wherein the product sensor further comprises a memory for storing information. 27. The product sensor according to claim 18, wherein one module of the product sensor includes a power supply for supplying voltage and power to the product sensor. 28. The product sensor according to claim 18 wherein the second module is arranged in the product sensor to electrically alter properties of a resonance circuit within the first module, and wherein the product sensor further includes an RFID device comprising and RFID circuit partially in the first module and partially in the second module and coupled to the resonance circuit, and the measuring device is configured to be in communication with the RFID device to send signals to the RFID device and the RFID device configured to send signals responsive to the signals from the measuring device. 29. The product sensor according to claim 28 wherein the RFID device further includes memory in communication with the RFID circuit and which memory stores information. 30. A product sensor comprising: at least one first flexible substrate; an antenna circuit which includes at least part of a circuitry pattern which is a conductor on the first substrate, the at least part of the circuitry pattern and the first substrate comprising a first module; at least one second flexible substrate; at least one measuring device on the second substrate which has at least one electric property selected from the group consisting of electrical resistance, electrical impedance, and electrical capacitance which is affected by at least one condition, the at least one measuring device and second substrate comprising a second module, the product sensor including the first module and the second module bonded to each other with a connecting material, the bonded modules forming a resonance circuit which changes frequency when the electrical property of the measuring device changes, first module bonded with the second module to electrically couple the at least part of the antenna circuitry pattern on the first substrate with the measuring device on the second substrate, the connector material selected from the group consisting of thermoplastic film, an isotropic paste, an anisotropic paste, an isotropic glue and an anisotropic glue. 31. The product sensor according to claim 30, wherein the electrical coupling of the at least part of the antenna on the first substrate with the measuring device on the second substrate is a capacitive coupling. 32. The product sensor according to claim 30, wherein the antenna circuit includes a coil in the first module. 33. The product sensor according to claim 30, wherein the product sensor further comprises a memory which stores stored information about the electrical property stored in the memory which stored information is compared to information about the electrical property of the measuring device which changes, the comparison being used to determine a change in the electrical property and condition. 34. A method for the manufacture of a product sensor effective for use in product control, the product sensor having an antenna circuit and at least one measuring having at least one electrical property affected by at least one condition, the method comprising: applying a conductor on a first continuous flexible web to provide at least part of antenna circuits and form a first module web with the at least part of the antenna circuits in spaced relation along the first web; applying measuring devices on a second continuous flexible web to provide a measuring device web and form a second module web with measuring devices in spaced relation along the second web; and bonding the first module web with the second module web with a connector material selected from the group consisting of thermoplastic film, an isotropic paste, an anisotropic paste, an isotropic glue and an anisotropic glue to provide a continuous flexible product sensor web with product sensors in side by side relation, the at least part of the antenna circuits on the first web arid the measuring devices on the second web electrically coupled and configured to form electrical resonance circuits which change frequency when the electrical property of the measuring device. 35. The method according to claim 34, wherein the bonding of the first module web with the second module web provides a capacitive coupling between the first and second modules to complete the resonance circuits.
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