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A semiconductor-based pressure sensor adapted for enhanced operation with controls electronics includes a pressure transducer having an output formed on a silicon die and an amplifier having an input and an output and fabricated on the silicon die next to the pressure transducer. The pressure trans

A semiconductor-based pressure sensor adapted for enhanced operation with controls electronics includes a pressure transducer having an output formed on a silicon die and an amplifier having an input and an output and fabricated on the silicon die next to the pressure transducer. The pressure transducer's output is provided to the amplifier's input via electrical connection. Output from the amplifier is connectable to a controller such as an ASIC.

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The invention claimed is: 1. A semiconductor-based pressure sensor adapted for enhanced operation with control electronics, comprising: a pressure transducer having an output formed on a silicon die; and an amplifier having an input and an output and fabricated on the silicon die next to the pressu

The invention claimed is: 1. A semiconductor-based pressure sensor adapted for enhanced operation with control electronics, comprising: a pressure transducer having an output formed on a silicon die; and an amplifier having an input and an output and fabricated on the silicon die next to the pressure transducer; wherein the pressure transducer's output is provided to the amplifier's input via electrical connection. 2. The semiconductor-based pressure sensor of claim 1 wherein the amplifier further comprises a differential amplifier. 3. The semiconductor-based pressure sensor of claim 1 wherein the output from the amplifier is connectable to a controller. 4. The semiconductor-based pressure sensor of claim 3 wherein the amplifier further comprises a differential amplifier. 5. The semiconductor-based pressure sensor of claim 2 wherein the output from the amplifier is connectable to a controller. 6. The semiconductor-based pressure sensor of claim 1 wherein output from the amplifier is routed to at least one output pad associated with the die wherefrom external measurement and control electronics are connectable. 7. The semiconductor-based pressure sensor of claim 6 wherein external measurement and control electronics are connected to at least one output pad. 8. The semiconductor-based pressure sensor of claim 6 wherein an ASIC is connected to the at least one output pad to calibrate the sensor's output over temperature and pressure. 9. The semiconductor-based pressure sensor of claim 2 wherein output from the amplifier is routed to at least one output pad associated with the die wherefrom external measurement and control electronics are connectable. 10. The semiconductor-based pressure sensor of claim 9 wherein external measurement and control electronics are connected to at least one output pad. 11. The semiconductor-based pressure sensor of claim 9 wherein an ASIC is connected to the at least one output pad to calibrate the sensors output over temperature and pressure. 12. A method, using a semiconductor-based pressure sensor device to measure pressure comprising: a semiconductor-based pressure sensor device including a pressure diaphragm adapted to generate electrical signals in response to pressure and signal amplifier electrically connected to the pressure diaphragm and fabricated with the pressure diaphragm on the same semiconductor wafer; and exposing the pressure diaphragm to a fluidic media, wherein the pressure experienced by the diaphragm is used as a reference pressure to generate an electrical signal representing measurement of the media pressure; and amplifying the electrical signal generated by the diaphragm with the amplifier. 13. The method of claim 12 wherein the amplifier comprises a differential amplifier. 14. The method of claim 12 wherein the output from the amplifier is connectable to a controller. 15. The method of claim 12 wherein output from the amplifier is routed to at least one output pad associated with the wafer wherefrom external measurement and control electronics are connectable. 16. The method of claim 15 wherein external measurement and control electronics are connectable to at least one output pad. 17. The method of claim 15 wherein an ASIC is connectable to the at least one output pad to calibrate the sensor's output over temperature and pressure. 18. A semiconductor-based pressure sensor adapted for enhanced operation with control electronics, comprising: a pressure transducer having an output formed on a silicon die; and a differential amplifier having an input and an output and fabricated on the silicon die next to the pressure transducer; wherein the pressure transducer's output is provided to the differential amplifier's input via electrical connection and the differential amplifier's output is connected to a controller. 19. The semiconductor-based pressure sensor of claim 18, said pressure transducer further comprising a pressure diaphragm adapted to generate electrical signals in response to pressure and signal said differential amplifier electrically connected to the pressure transducer. 20. The semiconductor-based pressure sensor of claim 18 wherein said pressure diaphragm is fabricated with the differental amplifier on the same semiconductor wafer.