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Semiconductor apparatus and fabrication method of the same

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/04
  • H01L-029/02
  • H01L-031/036
  • H01L-031/0376
  • H01L-031/20
  • H01L-031/18
출원번호 US-0206000 (2005-08-18)
등록번호 US-7495256 (2009-02-24)
우선권정보 JP-2002-305084(2002-10-18)
발명자 / 주소
  • Yamazaki,Shunpei
  • Takayama,Toru
  • Maruyama,Junya
  • Ohno,Yumiko
출원인 / 주소
  • Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
    Fish & Richardson P.C.
인용정보 피인용 횟수 : 28  인용 특허 : 14

초록

It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal displ

대표청구항

What is claimed is: 1. A semiconductor apparatus comprising: a plastic substrate or a plastic base material each of which has thermal conductivity of from 2 to 30 W/mK as a support medium; an adhesive in contact with the plastic substrate or the plastic base material; an insulating film in contact

이 특허에 인용된 특허 (14)

  1. Yamazaki Shunpei,JPX ; Takemura Yasuhiko,JPX ; Nakajima Setsuo,JPX ; Arai Yasuyuki,JPX, Display device and method of fabricating involving peeling circuits from one substrate and mounting on other.
  2. Yamazaki, Shunpei; Koyama, Jun; Yamamoto, Kunitaka; Konuma, Toshimitsu, Electro-optical device and electronic device.
  3. Andros Frank E. (Binghamton NY) Bupp James R. (Endwell NY) DiPietro Michael (Vestal NY) Hammer Richard B. (Apalachin NY), Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device.
  4. Andros Frank E. (Binghamton NY) Bupp James R. (Endwell NY) DiPietro Michael (Vestal NY) Hammer Richard B. (Apalachin NY), Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device.
  5. Andros Frank Edward ; Bupp James Russell ; DiPietro Michael ; Hammer Richard Benjamin, Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device.
  6. Esterberg Dennis R. ; Smith Mark A. ; Rubens Paul A. ; Lang Tracy A., Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink.
  7. Yamazaki, Shunpei, Light emitting device comprising a partition layer having an overhang shape.
  8. Yamazaki Shunpei,JPX ; Nakajima Setsuo,JPX ; Arai Yasuyuki,JPX, Method for producing display device.
  9. Andros Frank E. (Binghamton NY) Bupp James R. (Endwell NY) DiPietro Michael (Vestal NY) Hammer Richard B. (Apalachin NY), Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate an.
  10. Yamazaki Shunpei,JPX ; Arai Yasuyuki,JPX ; Teramoto Satoshi,JPX, Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bo.
  11. Shunpei Yamazaki JP; Yasuyuki Arai JP; Satoshi Teramoto JP, Method of manufacturing flexible display with transfer from auxiliary substrate.
  12. Yamazaki, Shunpei, Semiconductor device with light emitting elements and an adhesive layer holding color filters.
  13. Tatsuya Shimoda JP; Satoshi Inoue JP; Wakao Miyazawa JP, Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method.
  14. Muta Shigeki,JPX ; Ohura Masahiro,JPX ; Yoshikawa Takao,JPX, Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same.

이 특허를 인용한 특허 (28)

  1. Hatano, Kaoru; Seo, Satoshi; Nagata, Takaaki; Okano, Tatsuya, Display device including light-emitting layer.
  2. Hatano, Kaoru; Seo, Satoshi; Nagata, Takaaki; Okano, Tatsuya, Film and light-emitting device.
  3. Hatano, Kaoru; Seo, Satoshi; Nagata, Takaaki; Okano, Tatsuya, Flexible light-emitting device.
  4. Nomura, Ryoji, Light emitting device with a plurality of circuits connected in parallel.
  5. Matsukura, Hideki, Light-emitting device.
  6. Hatano, Kaoru; Seo, Satoshi; Nagata, Takaaki; Okano, Tatsuya, Light-emitting device and electronic device including substrate having flexibility.
  7. Momma, Yohei; Suganoya, Tomohiko; Obana, Saki, Light-emitting device and manufacturing method thereof.
  8. Hatano, Kaoru; Nagata, Takaaki; Sugisawa, Nozomu; Okano, Tatsuya; Chida, Akihiro; Inoue, Tatsunori, Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device.
  9. Hatano, Kaoru, Light-emitting device, flexible light-emitting device, electronic device, lighting apparatus, and method of manufacturing light-emitting device and flexible-light emitting device.
  10. Yamazaki, Shunpei; Hatano, Kaoru; Katayama, Masahiro; Eguchi, Shingo; Oikawa, Yoshiaki; Nakamura, Ami, Light-emitting device, lighting device, and electronic device.
  11. Nomura, Ryoji, Lighting device having plural light emitting layers which are separated.
  12. Nomura, Ryoji, Lighting device having plural light emitting layers with carrier generation layer therebetween.
  13. Nomura, Ryoji, Lighting device with plural light emitting elements.
  14. Nomura, Ryoji, Lighting device with plural light emitting elements.
  15. Ishitani, Tetsuji; Kubota, Daisuke, Liquid crystal display device.
  16. Sugiyama, Eiji; Dozen, Yoshitaka; Ohtani, Hisashi; Tsurume, Takuya, Manufacturing method of semiconductor device.
  17. Eguchi, Shingo; Monma, Yohei; Tani, Atsuhiro; Hirosue, Misako; Hashimoto, Kenichi; Hosaka, Yasuharu, Method for manufacturing semiconductor device.
  18. Goto, Yuugo; Fukumoto, Yumiko; Takayama, Toru; Maruyama, Junya; Tsurume, Takuya, Method for manufacturing semiconductor device.
  19. Yamazaki, Shunpei; Suzuki, Yukie; Nishi, Kazuo, Photoelectric conversion device and method for manufacturing the same.
  20. Yamazaki, Shunpei; Takayama, Toru; Maruyama, Junya; Ohno, Yumiko, Semiconductor apparatus and fabrication method of the same.
  21. Yamazaki, Shunpei; Takayama, Toru; Maruyama, Junya; Ohno, Yumiko, Semiconductor apparatus and fabrication method of the same.
  22. Yamazaki, Shunpei; Takayama, Toru; Maruyama, Junya; Ohno, Yumiko, Semiconductor apparatus and fabrication method of the same.
  23. Yamazaki, Shunpei; Takayama, Toru; Maruyama, Junya; Ohno, Yumiko, Semiconductor apparatus and fabrication method of the same.
  24. Koyama, Jun; Yamazaki, Shunpei, Semiconductor device.
  25. Chida, Akihiro, Semiconductor device and manufacturing method thereof.
  26. Sugiyama, Eiji; Dozen, Yoshitaka; Ohtani, Hisashi; Tsurume, Takuya, Semiconductor device and manufacturing method thereof.
  27. Sugiyama, Eiji; Dozen, Yoshitaka; Ohtani, Hisashi; Tsurume, Takuya, Semiconductor device with antenna.
  28. Yasumoto, Seiji; Sato, Masataka; Nomura, Masafumi; Miyamoto, Toshiyuki, Separation method, light-emitting device, module, and electronic device.
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