Semiconductor apparatus and fabrication method of the same
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-029/04
H01L-029/02
H01L-031/036
H01L-031/0376
H01L-031/20
H01L-031/18
출원번호
US-0206000
(2005-08-18)
등록번호
US-7495256
(2009-02-24)
우선권정보
JP-2002-305084(2002-10-18)
발명자
/ 주소
Yamazaki,Shunpei
Takayama,Toru
Maruyama,Junya
Ohno,Yumiko
출원인 / 주소
Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
Fish & Richardson P.C.
인용정보
피인용 횟수 :
28인용 특허 :
14
초록▼
It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal displ
It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity.
대표청구항▼
What is claimed is: 1. A semiconductor apparatus comprising: a plastic substrate or a plastic base material each of which has thermal conductivity of from 2 to 30 W/mK as a support medium; an adhesive in contact with the plastic substrate or the plastic base material; an insulating film in contact
What is claimed is: 1. A semiconductor apparatus comprising: a plastic substrate or a plastic base material each of which has thermal conductivity of from 2 to 30 W/mK as a support medium; an adhesive in contact with the plastic substrate or the plastic base material; an insulating film in contact with the adhesive; and a device over the insulating film, wherein the plastic substrate or the plastic base material comprises a resin and a metal fiber provided in the resin. 2. An apparatus according to claim 1, wherein the device is a thin-film transistor, a light-emitting device including a light-emitting layer containing an organic compound, a liquid crystal device, a memory device, a pin-junction silicon photoelectric converter, or a silicon resistance element. 3. An apparatus according to claim 1, wherein the adhesive has thermal conductivity. 4. An apparatus according to claim 1, wherein each the plastic substrate or the plastic base material has higher thermal conductivity than that of the adhesive. 5. An apparatus according to claim 1, wherein the plastic substrate or the plastic base material each of which has thermal conductivity is formed of a mixture oflow-melting metals, ceramics, and synthetic resin, the synthetic resin comprising a material selected from the group consisting of polypropylene, polypropylene sulfide, polycarbonate, polyetherimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, and polyphthalamide. 6. An apparatus according to claim 1, wherein the adhesive contains powder or filler comprising a material selected from the group consisting of silver, nickel, aluminum, and aluminum nitride. 7. An apparatus according to claim 1, wherein the semiconductor apparatus is incorporated into one selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation, a personal computer, and a portable information terminal. 8. A semiconductor apparatus comprising: a plastic substrate or a plastic base material each of which has thermal conductivity of from 2 to 30 W/mK as a support medium; an adhesive in contact with the plastic substrate or the plastic base material; an insulating film in contact with the adhesive; a cathode and an anode provided over the insulating film; and a film containing an organic compound provided between the cathode and the anode. 9. An apparatus according to claim 8, wherein the adhesive has thermal conductivity. 10. An apparatus according to claim 8, wherein each the plastic substrate or the plastic base material has higher thermal conductivity than that of the adhesive. 11. An apparatus according to claim 8, wherein the plastic substrate or the plastic base material each of which has thermal conductivity is formed of a mixture of low-melting metals, ceramics, and synthetic resin, the synthetic resin comprising a material selected from the group consisting of polypropylene, polypropylene sulfide, polycarbonate, polyetherimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, and polyphthalamide. 12. An apparatus according to claim 8, wherein the adhesive contains powder or filler comprising a material selected from the group consisting of silver, nickel, aluminum, and aluminum nitride. 13. An apparatus according to claim 8, wherein the semiconductor apparatus is incorporated into one selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation, a personal computer, and a portable information terminal. 14. An apparatus according to claim 8 wherein the film containing the organic compound comprises a light-emitting layer. 15. A semiconductor apparatus comprising: a plastic substrate or a plastic base material each of which has thermal conductivity of from 2 to 30 W/mK as a support medium; an adhesive in contact with the plastic substrate or the plastic base material; an insulating film in contact with the adhesive; and a device over the insulating film. 16. An apparatus according to claim 15, wherein the device is a thin-film transistor, a light-emitting device including a light-emitting layer containing an organic compound, a liquid crystal device, a memory device, a pin-junction silicon photoelectric converter, or a silicon resistance element. 17. An apparatus according to claim 15, wherein the adhesive has thermal conductivity. 18. An apparatus according to claim 15, wherein each the plastic substrate or the plastic base material has higher thermal conductivity than that of the adhesive. 19. An apparatus according to claim 15, wherein the plastic substrate or the plastic base material each of which has thermal conductivity is formed of a mixture of low-melting metals, ceramics, and synthetic resin, the synthetic resin comprising a material selected from the group consisting of polypropylene, polypropylene sulfide, polycarbonate, polyetherimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, and polyphthalamide. 20. An apparatus according to claim 15, wherein the adhesive contains powder or filler comprising a material selected from the group consisting of silver, nickel, aluminum, and aluminum nitride. 21. An apparatus according to claim 15, wherein the semiconductor apparatus is incorporated into one selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation, a personal computer, and a portable information terminal.
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이 특허에 인용된 특허 (14)
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Andros Frank E. (Binghamton NY) Bupp James R. (Endwell NY) DiPietro Michael (Vestal NY) Hammer Richard B. (Apalachin NY), Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate an.
Yamazaki Shunpei,JPX ; Arai Yasuyuki,JPX ; Teramoto Satoshi,JPX, Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bo.
Tatsuya Shimoda JP; Satoshi Inoue JP; Wakao Miyazawa JP, Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method.
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