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Disclosed is a method for packaging an organic light emitting display having a reinforcing member formed between a first substrate and a second substrate by dipping non-pixel regions of unit display panels in a liquid curable material. Organic light emitting pixel arrays are formed at a plurality of

Disclosed is a method for packaging an organic light emitting display having a reinforcing member formed between a first substrate and a second substrate by dipping non-pixel regions of unit display panels in a liquid curable material. Organic light emitting pixel arrays are formed at a plurality of pixel regions of a first mother substrate. A frit is formed at a position of the second mother substrate corresponding to non-pixel regions of the first mother substrate. The first and second mother substrates are coalesced to each other and sealed by the frit. The mother substrates are cut into unit display panels. The unit display panels are aligned. Non-pixel regions of the unit display panels are dipped in the liquid curable material and the material is cured to form the reinforcing member.

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What is claimed is: 1. A method for making an organic light emitting display device, the method comprising: providing first and second devices, each device comprising: a first substrate comprising a first side surface and a front surface, a second substrate comprising a first side surface and a rea

What is claimed is: 1. A method for making an organic light emitting display device, the method comprising: providing first and second devices, each device comprising: a first substrate comprising a first side surface and a front surface, a second substrate comprising a first side surface and a rear surface and opposing the first substrate, wherein the front and rear surfaces face away from each other, an array of organic light emitting pixels interposed between the first and second substrates, a display surface configured to display an image thereon, wherein the display surface is at least part of at least one of the front and rear surfaces, a frit seal interposed between the first substrate and the second substrate while surrounding the array, wherein the frit seal, the first substrate and the second substrate together define an enclosed space in which the array is located, the frit seal comprising a first side surface, and a first side comprising the first side surfaces of the first substrate, the second substrates and the frit seal; arranging the first and second devices such that the front surface of the first device opposes the front or rear surface of the second device and that the first sides of the first and second devices face substantially the same direction; contacting a curable material on both the first sides of the first and second devices, whereby forming the curable material on both the first sides of the first and second devices; and curing the curable material formed on the first sides of the first and second devices, thereby forming a first structure contacting the first side of the first device and a second structure contacting the first side of the second device. 2. The method of claim 1, wherein arranging comprises: holding the first and second devices such that the front surface of the first device faces the front or rear surface of the second device and that the first sides of the first and second devices face substantially the same direction. 3. A method for making an organic light emitting display device, the method comprising: providing first and second devices, each device comprising: a first substrate comprising a first side surface, a second substrate comprising a first side surface and opposing the first substrate, an array of organic light emitting pixels interposed between the first and second substrates, a frit seal interposed between the first substrate and the second substrate while surrounding the array, wherein the frit seal, the first substrate and the second substrate together define an enclosed space in which the array is located, the frit seal comprising a first side surface, and a first side comprising the first side surfaces of the first substrate, the second substrates and the frit seal; arranging the first and second devices such that the first substrate of the first device faces the first or second substrate of the second device and that the first sides of the first and second devices face substantially the same direction; contacting a curable material on both the first sides of the first and second devices, whereby forming the curable material on both the first sides of the first and second devices; and curing the curable material formed on the first sides of the first and second devices, thereby forming a first structure contacting the first side of the first device and a second structure contacting the first side of the second device, wherein contacting comprises: holding the first and second devices together; and dipping the first and second devices as a whole into the curable material such that at least part of the first side of the first device contacts the curable material and that at least part of the first side of the second device contacts the curable material. 4. The method of claim 3, wherein dipping comprises: moving the first and second devices together toward the curable material comprising a top surface; and adjusting facing of the first sides of the first and second devices such that the first side surface of the first substrate of the first or second device are generally parallel to the top surface immediately before the first side surface of the first substrate contacts the top surface. 5. The method of claim 1, wherein the first substrate, the second substrate and the frit seal in combination form a gap space outside the enclosed space in each of the first and second devices, and wherein at least part of the curable material enters into the gap space. 6. The method of claim 5, wherein contacting the curable material comprises causing the curable material to enter into the gap space. 7. The method of claim 6, wherein at least part of the curable material entering into the gap space spontaneously moves toward the frit seal. 8. The method of claim 5, wherein the gap space has a depth from the first side surface of the first substrate to the first side surface of the frit seal, and wherein the depth is from about 0.3 to about 0.7 mm. 9. The method of claim 5, wherein the distance between the first substrate and the second substrate in the gap space is from about 2 to about 30 μm. 10. A method for making an organic light emitting display device, the method comprising: providing first and second devices, each device comprising: a first substrate comprising a first side surface, a second substrate comprising a first side surface and opposing the first substrate, an array of organic light emitting pixels interposed between the first and second substrates, a frit seal interposed between the first substrate and the second substrate while surrounding the array, wherein the frit seal, the first substrate and the second substrate together define an enclosed space in which the array is located, the frit seal comprising a first side surface, and a first side comprising the first side surfaces of the first substrate, the second substrates and the frit seal; arranging the first and second devices such that the first substrate of the first device faces the first or second substrate of the second device and that the first sides of the first and second devices face substantially the same direction; contacting a curable material on both the first sides of the first and second devices, whereby forming the curable material on both the first sides of the first and second devices; and curing the curable material formed on the first sides of the first and second devices, thereby forming a first structure contacting the first side of the first device and a second structure contacting the first side of the second device, wherein the first substrate, the second substrate and the frit seal in combination form a gap space outside the enclosed space in each of the first and second devices, and wherein at least part of the curable material enters into the gap space by capillary phenomenon. 11. The method of claim 1, wherein contacting the curable material comprises causing the curable material to contact at least part of the first side of the first device and at least part of the first side of the second device. 12. The method of claim 1, wherein contacting the curable material comprises causing the curable material to contact the first side surface of the frit seal in each of the first and second devices. 13. The method of claim 1, wherein the curable material has a viscosity less than about 200 cP. 14. The method of claim 1, wherein arranging comprises placing an insert between the first substrate of the first device and the first or second substrate of the second device. 15. The method of claim 1, wherein arranging comprises contacting the first substrate of the first device with the first or second substrate of the second device. 16. The method of claim 1, wherein the first substrate of the first device is arranged substantially parallel to the first or second substrate of the second device. 17. The method of claim 1, wherein the first side surface of the frit seal is substantially parallel to the first side surface of the first substrate. 18. The method of claim 1, wherein the first structure contacts the frit seal of the first device. 19. The method of claim 1, wherein the first structure contacts at least one of the first and second substrates. 20. The method of claim 1, wherein the first and second structures are integrated after curing. 21. The method of claim 20, further comprising separating the first structure from the second structure. 22. The method of claim 1, wherein each of the first and second devices comprises a second side comprising second side surfaces of the first substrate, the second substrate and the frit seal, wherein the method further comprises contacting the curable material with the second sides of the first and second devices. 23. The method of claim 1, further comprising providing at least one additional device comprising: a first substrate comprising a first side surface, a second substrate comprising a first side surface and opposing the first substrate, an array of organic light emitting pixels interposed between the first and second substrates, a frit seal interposed between the first substrate and the second substrate while surrounding the array, wherein the frit seal, the first substrate and the second substrate together define an enclosed space in which the array is located, the frit seal comprising a first side surface, and a first side comprising the first side surfaces of the first substrate, the second substrates and the frit seal; wherein arranging further arranges the at least one additional device together with the first and second devices; wherein contacting further contacts the curable material on the at least one additional device; and wherein curing forms at least one additional structure, each of which contacts the first side of each of the at least one additional device. 24. The method of claim 1, wherein the curable material is adapted to be a reinforcing material. 25. The method of claim 1, wherein the frit seal comprises one or more materials selected from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li2O), sodium oxide (Na2O), potassium oxide (K2O), boron oxide (B2O3), vanadium oxide (V2O5), zinc oxide (ZnO), tellurium oxide (TeO2), aluminum oxide (Al2O3), silicon dioxide (SiO2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P2O5), ruthenium oxide (Ru2O), rubidium oxide (Rb2O), rhodium oxide (Rh2O), ferrite oxide (Fe2O3), copper oxide (CuO), titanium oxide (TiO2), tungsten oxide (WO3), bismuth oxide (Bi2O3), antimony oxide (Sb2O3), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate.