초록 ▼

The present invention discloses an electronic testing apparatus and a continuous test method for electronic component, which includes multiple test areas, each area possesses respective pick and place module. The apparatus includes multiple shuttles located between the test area and input/output tra

The present invention discloses an electronic testing apparatus and a continuous test method for electronic component, which includes multiple test areas, each area possesses respective pick and place module. The apparatus includes multiple shuttles located between the test area and input/output trays. Moreover, a further pick and place module is utilized, between the shuttles and the input/output trays, for picking and placing the devices under test or tested device. The method delivers different electronic component to different test area for testing by different shuttles and to perform testing continuously.

대표청구항 ▼

What is claimed is: 1. An electronic component test apparatus, comprising: at least one input trays for storing an electronic component prior to proceeding a test; at least one output trays for storing a tested electronic component; a plurality of test areas for testing the electronic component; a

What is claimed is: 1. An electronic component test apparatus, comprising: at least one input trays for storing an electronic component prior to proceeding a test; at least one output trays for storing a tested electronic component; a plurality of test areas for testing the electronic component; a plurality of test-pick and place module for picking or placing the tested electronic component or the electronic component wherein each of said a plurality of test areas has one said test-pick and place module, and said test-pick and place module have contact mechanism employed for pressing said electronic component and provide heat to said electronic component in testing time; a plurality of shuttles moving between said test areas and said input trays or said output trays for carrying the electronic component or tested electronic component, wherein each of said a plurality of shuttles is corresponded only one of said test areas and only carries the electronic component or tested electronic component into or out the corresponded test area; a plurality of tracks for moving said shuttles, wherein each of said a plurality of tracks moving several said shuttles at the same time; and a I/O-pick and place module for picking or placing the electronic component between said input tray, said output tray and said shuttles, wherein said I/O-pick and place module has an input suction head for sucking the electronic component to pick and place the electronic component and rotating the electronic component according to requirement, an output suction head for sucking the tested electronic component to pick and place the tested electronic component and rotating the tested electronic component according to requirement and a tray picker for picking said input tray or said output tray. 2. The electronic component test apparatus as set forth in claim 1, wherein said test area further comprises a socket for setting the electronic component prior to undergo the test. 3. The electronic component test apparatus as set forth in claim 1, wherein said shuttles include a front depression and a rear depression for storing the electronic component and the tested electronic component respectively. 4. The electronic component test apparatus as set forth in claim 1, further comprising a Y-rail for moving said I/O-pick and place module in Y-direction. 5. The electronic component test apparatus as set forth in claim 1, further comprising a X-rail for moving said I/O-pick and place module in X-direction. 6. An continuous test method for electronic component by an electronic component test apparatus which comprises a input/output zone, a plurality of test areas, a plurality of shuttles, a plurality of test-pick and place modules and an I/O-pick and place module having an input suction head, an output suction head and a tray picker, comprising: (a) providing at least one input tray to said input/output zone and providing at least one output tray to said input/output zone; (b) transferring a electronic component stored in said input tray to said shuttle and carrying said electronic component to a test area by said shuttle; (c) transferring said electronic component to said test area and testing said electronic component by said test area; (d) transferring said tested electronic component from said test area to said shuttle and carrying said electronic component to said input/output zone by said shuttle; (e) gathering said tested electronic component in said output tray based on test result of said tested electronic component; (f) repeating said steps (b)-(f) for next electronic component stored in said input tray until all electronic components stored in said input tray are tested without using the other shuttles and the other test areas; and repeating (b)-(f) for carrying another electronic component stored in said input tray to another test area by a second shuttle and a second test-pick and place module and testing said another electronic component after said electronic component finishes said step (b), wherein each of said a plurality of shuttles is corresponded only one of said test areas and only carries the electronic component or tested electronic component into or out the corresponded test area. 7. The continuous test method for electronic component as set forth in claim 6, further comprising providing a plurality of input trays and stacking said plurality of input trays. 8. The continuous test method for electronic component as set forth in claim 6, further comprising providing a plurality of output trays and stacking said plurality of output trays. 9. The electronic component test apparatus as set forth in claim 6, wherein said shuttles include a front depression and a rear depression for storing the electronic component and the tested electronic component respectively. 10. The continuous test method for electronic component as set forth in claim 6, wherein said step (b) further comprises picking up a electronic component stored in said input tray by a I/O-pick and place module and placing said electronic component in a shuttle by said I/O-pick and place module. 11. The continuous test method for electronic component as set forth in claim 6, wherein said step (b) further comprises carrying said electronic component to a test area by said shuttle. 12. The continuous test method for electronic component as set forth in claim 11, further comprising rotating said electronic component after said step of picking up said electronic component stored in said input tray by a I/O-pick and place module and before said step of placing said electronic component in a shuttle by said I/O-pick and place module. 13. The continuous test method for electronic component as set forth in claim 6, wherein said step (c) further comprises picking up said electronic component form said shuttle and placing said electronic component in a test area by a test-pick and place module of said test area. 14. The continuous test method for electronic component as set forth in claim 6, wherein said step (c) further comprising pressing and retaining said electronic component until the test has finished. 15. The continuous test method for electronic component as set forth in claim 6, wherein said step (d) further comprises picking up an untested electronic component form said input tray, placing said untested electronic component to said front depression of said shuttle by said I/O-pick and place module, and carrying said untested electronic component to said test area by said shuttle. 16. The continuous test method for electronic component as set forth in claim 15, further comprises picking up said tested electronic component form said test area and placing said tested electronic component in said shuttle by said test-pick and place module. 17. The continuous test method for electronic component as set forth in claim 16, further comprises picking up said untested electronic component form said front depression of said shuttle and placing said untested electronic component in said test area by said test-pick and place module. 18. The continuous test method for electronic component as set forth in claim 6, wherein said step (d) further comprises carrying said tested electronic component back by said shuttle. 19. The continuous test method for electronic component as set forth in claim 6, wherein said step (e) further comprises picking up another untested electronic component form said input tray and placing said another untested electronic component to said front depression of said shuttle by said I/O-pick and place module. 20. The continuous test method for electronic component as set forth in claim 19, wherein said step (e) further comprises picking up said tested electronic component form said shuttle and placing said tested electronic component in said output tray based on test result of said tested electronic component by said I/O-pick and place module. 21. The continuous test method for electronic component as set forth in claim 20, wherein said step of placing said another untested electronic component in said front depression of said shuttle is proceeded by said input suction head of said I/O-pick and place module and said step of picking up said tested electronic component form said rear depression of said shuttle is performed by said output suction head of said I/O-pick and place module at the same time. 22. The continuous test method for electronic component as set forth in claim 20, further comprising rotating said tested electronic component after said step of picking up said tested electronic component form said shuttle by said I/O-pick and place module and before said step of placing said tested electronic component in said output tray based on test result of said tested electronic component by said I/O-pick and place module. 23. The continuous test method for electronic component as set forth in claim 6, further comprising picking up a input tray wherein all said electronic component stored in said input tray finish testing from said input zone and placing said input tray to said output zone. 24. An continuous test method for electronic component by an electronic component test apparatus which comprises a I/O-pick and place module having an input suction head, an output suction head and a tray picker, a plurality of test areas, a plurality of shuttles and a plurality of test-pick and place modules wherein each of said plurality of shuttles of test-pick and place module corresponding to one of said plurality of test areas, comprising: (a) providing at least one input tray to input/output zone and providing at least one output tray to input/output zone; (b) picking up a electronic component stored in said input tray by said I/O-pick and place module and placing said electronic component in one of said plurality of shuttle by said I/O-pick and place module; (c) carrying said electronic component to one of said plurality of test area by said shuttle; (d) picking up said electronic component form said shuttle and placing said electronic component in said test area by said test-pick and place module of said test area; (e) testing said electronic component by said test area; (f) picking up said tested electronic component form said test area and placing said tested electronic component in said shuttle by said test-pick and place module; (g) carrying said tested electronic component back by said shuttle; (h) picking up said tested electronic component form said shuttle and placing said tested electronic component in said output tray based on test result of said tested electronic component by said I/O-pick and place module; (i) repeating said steps (b)-(i)for next electronic component stored in said input tray until all electronic components stored in said input tray are tested without using the other shuttles and the other test areas; and repeating (b)-(i) for carrying another electronic component stored in said input tray to another test area by a second shuttle and a second test-pick and place module and testing said another electronic component after said electronic component finishes said step (b),wherein each of said a plurality of shuttles is corresponded only one of said test areas and only carries the electronic component or tested electronic component into or out the corresponded test area. 25. The continuous test method for electronic component as set forth in claim 24, further comprising providing a plurality of input trays and stacking said plurality of input trays. 26. The continuous test method for electronic component as set forth in claim 24, further comprising providing a plurality of output trays and stacking said plurality of output trays. 27. The continuous test method for electronic component as set forth in claim 24, further comprising rotating said electronic component after said step of picking up said electronic component stored in said input tray by a I/O-pick and place module and before said step of placing said electronic component in a shuttle by said I/O-pick and place module. 28. The continuous test method for electronic component as set forth in claim 24, further comprising rotating said tested electronic component after said step of picking up said tested electronic component form said shuttle by said I/O-pick and place module and before said step of placing said tested electronic component in said output tray based on test result of said tested electronic component by said I/O-pick and place module. 29. The continuous test method for electronic component as set forth in claim 24, wherein said shuttles include a front depression and a rear depression for storing the electronic component and the tested electronic component respectively. 30. The continuous test method for electronic component as set forth in claim 29, wherein said electronic component is placed into said front depression of said shuttle in said step (b). 31. The continuous test method for electronic component as set forth in claim 29, wherein said tested electronic component is placed into said rear depression of said shuttle in said step (f). 32. The continuous test method for electronic component as set forth in claim 31, wherein said step (f) further comprises picking up an untested electronic component form said input tray, placing said untested electronic component to said front depression of said shuttle by said I/O-pick and place module, and carrying said untested electronic component to said test area by said shuttle. 33. The continuous test method for electronic component as set forth in claim 32, wherein in said step (f) further comprises picking up said untested electronic component form said front depression of said shuttle and placing said untested electronic component in said test area by said test-pick and place module. 34. The continuous test method for electronic component as set forth in claim 29, wherein said step (h) further comprises picking up another untested electronic component form said input tray and placing said another untested electronic component to said front depression of said shuttle by said I/O-pick and place module. 35. The continuous test method for electronic component as set forth in claim 34, wherein said step of placing said another untested electronic component in said front depression of said shuttle is proceeded by said input suction head of said I/O-pick and place module and said step of picking up said tested electronic component form said rear depression of said shuttle is performed by said output suction head of said I/O-pick and place module at the same time. 36. The continuous test method for electronic component as set forth in claim 24, wherein said step (e) further comprising pressing and retaining said electronic component until the test has finished.