A wiring pattern circuit includes part of wiring between a module control circuit and a module. Since the wiring pattern circuit includes a PLD, the wiring thereof can be variably configured in accordance with the specifications of the module control circuit and the module. The construction of the m
A wiring pattern circuit includes part of wiring between a module control circuit and a module. Since the wiring pattern circuit includes a PLD, the wiring thereof can be variably configured in accordance with the specifications of the module control circuit and the module. The construction of the module control circuit can be therefore facilitated. In addition, since a printed wiring pattern does not have to be provided separately for the test of each of a plurality of different modules, the test period, the labor and the cost involved during the test can be decreased.
대표청구항▼
What is claimed is: 1. A module-testing device for testing a module, comprising: at least one module control circuit including a first programmable logic device, said at least one module control circuit feeding a component control signal to the module; an I/O port arranged to transmit a signal to a
What is claimed is: 1. A module-testing device for testing a module, comprising: at least one module control circuit including a first programmable logic device, said at least one module control circuit feeding a component control signal to the module; an I/O port arranged to transmit a signal to and receive a signal from an external device, and the component control signal fed to the module is fed via the I/O port; a first wiring pattern circuit including a second programmable logic device, the first wiring pattern circuit including at least part of a wiring between said at least one module control circuit and the I/O port; a configuration circuit for constructing circuit configurations of said at least one module control circuit and the first wiring pattern circuit on the basis of input information; and a tester arranged to produce an input signal to the module based on a testing control signal fed from the at least one module control circuit via the I/O port; wherein the I/O port is arranged outside the at least one module control circuit; the I/O port includes a plurality of input/output terminals; the at least one module control circuit includes a plurality of input/output terminals; the first wiring pattern circuit includes a plurality of first input/output terminals connected to the plurality of input/output terminals of the I/O port and a plurality of second input/output terminals connected to the plurality of input/output terminals of the at least one module control circuit; and the first wiring pattern circuit is arranged to selectively assign the component control signal to any one of the first input/output terminals in accordance with a signal assignment for the input/output terminals of the I/O port and to selectively assign the component control signal to any one of the second input/output terminals in accordance with a signal assignment for the input/output terminals of the at least one module control circuit, so as to enable the wiring between the at least one module control circuit and the I/O port to be freely changed. 2. A module-testing device according to claim 1, further comprising a test board having the at least one module control circuit, the I/O port and the configuration circuit thereon. 3. A module-testing device according to claim 1, wherein the tester receives an output signal from the module and determines whether the output signal from the module is an appropriate response to the input signal to the module. 4. A module-testing device according to claim 1, wherein the tester includes a module. 5. A module-testing device according to claim 1, wherein the configuration circuit produces data for determining the features of each unit logic circuit in the first programmable logic device and the data produced by the configuration circuit is output to the first programmable logic device. 6. The module-testing device according to claim 1, wherein said at least one module control circuit includes a plurality of module control circuits arranged in a two-by-two matrix configuration. 7. The module-testing device according to claim 6, further comprising a plurality of said first wiring pattern circuits each being disposed between an adjacent pair of the plurality of module control circuits. 8. The module-testing device according to claim 6, wherein the first wiring pattern circuit is disposed between four of the plurality of module control circuits. 9. The module-testing device according to claim 1, further comprising an information processing apparatus arranged to obtain a circuit diagram of the at least one module control circuit and to provide a circuit configuration signal to the configuration circuit. 10. A module-testing device according to claim 2, wherein the at least one module control circuit and the configuration circuit are adjacent to the I/O port on the test board. 11. A module-testing device for testing a module, comprising: at least one module control circuit including a first programmable logic device, said at least one module control circuit feeding a component control signal to the module; an I/O port arranged to transmit a signal to and receive a signal from an external device, and the component control signal fed to the module is fed via the I/O port; a first wiring pattern circuit including a second programmable logic device, the first wiring pattern circuit including at least part of a wiring between said at least one module control circuit and the I/O port; a configuration circuit for constructing circuit configurations of said at least one module control circuit and the first wiring pattern circuit on the basis of input information; and a second wiring pattern circuit including a third programmable logic device, wherein: said at least one module control circuit includes at least two module control circuits; the second wiring pattern circuit including at least part of a wiring between said at least two module control circuits; the configuration circuit constructs a circuit configuration of the second wiring pattern circuit on the basis of the input information; and the I/O port is arranged outside the at least one module control circuit; the I/O port includes a plurality of input/output terminals; the at least one module control circuit includes a plurality of input/output terminals; the first wiring pattern circuit includes a plurality of first input/output terminals connected to the plurality of input/output terminals of the I/O port and a plurality of second input/output terminals connected to the plurality of input/output terminals of the at least one module control circuit; and the first wiring pattern circuit is arranged to selectively assign the component control signal to any one of the first input/output terminals in accordance with a signal assignment for the input/output terminals of the I/O port and to selectively assign the component control signal to any one of the second input/output terminals in accordance with a signal assignment for the input/output terminals of the at least one module control circuit, so as to enable the wiring between the at least one module control circuit and the I/O port to be freely changed. 12. A module-testing device according to claim 11, further comprising a test board having the at least one module control circuit, the I/O port and the configuration circuit thereon. 13. A module-testing device according to claim 11, wherein the configuration circuit produces data for determining the features of each unit logic circuit in the first programmable logic device and the data produced by the configuration circuit is output to the first programmable logic device. 14. A test board for use with a module-testing device, the test board comprising: a substrate; a configuration circuit provided at one end of the substrate; an I/O port provided at the other end of the substrate; module control circuits arranged in a two-by-two matrix on the substrate between the configuration circuit and the I/O port; a plurality of first wiring pattern circuits, at least two of the plurality of first wiring pattern circuits being provided between a respective one of the module control circuits and the I/O port; and a plurality of second wiring pattern circuits sandwiched between two adjacent ones of the module control circuits. 15. The test board according to claim 14, wherein the plurality of second wiring pattern circuits each includes a part of the wiring between two of the module control circuits that are adjacent to each other. 16. A test board according to claim 14, wherein at least one of the plurality of second wiring patterns is disposed between four of the module control circuits. 17. A test board according to claim 14, wherein the module control circuits include programmable logic devices. 18. A test board according to claim 14, wherein the plurality of first wiring pattern circuits and the plurality of second wiring pattern circuits include programmable logic devices.
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이 특허에 인용된 특허 (3)
Prednis, Leonard J.; Proctor, Michael L.; Sugarman, Alan D., Modular automated avionics test system.
Sample Stephen P. (Mountain View CA) D\Amour Michael R. (Los Altos Hills CA) Payne Thomas S. (Union City CA), Reconfigurable hardware emulation system.
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