초록 ▼

A method of disassembling at least a portion of a structure that includes parts which are bonded together. The method includes selecting a subsurface depth within the structure at which it is desired to cause debonding of the structure. A laser beam diameter, pulse width and power level predetermine

A method of disassembling at least a portion of a structure that includes parts which are bonded together. The method includes selecting a subsurface depth within the structure at which it is desired to cause debonding of the structure. A laser beam diameter, pulse width and power level predetermined to produce a peak tensile stress within the structure at the selected depth are selected. A laser having the selected beam diameter is used to apply a shock load at the selected pulse width and power level to the structure. Using this method, damaged or unwanted aircraft skin, patches or overlays on structure can be removed more cleanly and simply than milling, grinding or other mechanical methods.

대표청구항 ▼

What is claimed is: 1. A method of working on an aircraft structure comprising: applying to the structure a laser beam configured to result in a peak tensile stress in a designated area of a subsurface bond layer of the structure to debond at least part of the area; and removing a portion of the st

What is claimed is: 1. A method of working on an aircraft structure comprising: applying to the structure a laser beam configured to result in a peak tensile stress in a designated area of a subsurface bond layer of the structure to debond at least part of the area; and removing a portion of the structure adjacent the debonded area; the method further comprising applying a single laser pulse to the structure a predetermined distance from a bond layer area debonded by a previous laser pulse. 2. The method of claim 1, further comprising: selecting a subsurface depth within the structure at which it is desired to cause debonding of the structure; selecting a laser beam diameter, pulse width and power level predetermined to produce a peak tensile stress within the structure at the selected depth; and using a laser having the selected beam diameter to apply a shock load at the selected pulse width and power level to the structure. 3. The method of claim 2, further comprising selecting a fluence and an exposure spot area for the shock load based on a bond failure threshold of the structure. 4. The method of claim 2, further comprising using a plurality of lasers to apply a plurality of shock loads to the structure from a plurality of directions to produce the peak tensile stress. 5. The method of claim 1, further comprising: selecting a laser fluence, pulse width and direction predetermined to cause compression and then tension within the structure sufficient to debond at least a selected part of the selected subsurface area; and applying a laser at the selected pulse width in the selected direction to the selected subsurface area to produce the selected fluence. 6. The method of claim 1, performed a plurality of times to propagate debonding. 7. The method of claim 1, further comprising producing in the structure at least one of the following: an interfacial failure, a failure of adhesive, and a laminate failure. 8. The method of claim 1, further comprising providing a laser exciter to apply the laser beam. 9. The method of claim 8, wherein the laser beam is applied from a first direction relative to the structure, the method further comprising providing a second laser exciter to apply an auxiliary beam to the structure from a second direction relative to the structure. 10. The method of claim 1, wherein applying a laser beam comprises applying a 50-Joule-per-square-centimeter laser at a pulse width between 100 and 300 nanoseconds. 11. The method of claim 1, wherein the predetermined distance includes between one centimeter and two centimeters.