초록 ▼

A circuit board includes a substrate forming an opening, a first thermal module disposed on a first side of the substrate, a second thermal module disposed on a second side opposite to the first side of the substrate m, and a heat pipe installed on the substrate and passing through the opening. A fi

A circuit board includes a substrate forming an opening, a first thermal module disposed on a first side of the substrate, a second thermal module disposed on a second side opposite to the first side of the substrate m, and a heat pipe installed on the substrate and passing through the opening. A first end of the heat pipe is connected to the first thermal module, and a second end of the heat pipe is connected to the second thermal module.

대표청구항 ▼

What is claimed is: 1. A circuit board comprising: a substrate forming an opening; a first thermal module disposed on a first side of the substrate; a second thermal module disposed on a second side opposite to the first side of the substrate; and a heat pipe comprising: a first section disposed on

What is claimed is: 1. A circuit board comprising: a substrate forming an opening; a first thermal module disposed on a first side of the substrate; a second thermal module disposed on a second side opposite to the first side of the substrate; and a heat pipe comprising: a first section disposed on the first side of the substrate and connected to the first thermal module; a second section connected to the first section and passing through the opening on the substrate; and a third section disposed on the second side of the substrate and connected to the second section and the second thermal module, an included angle being formed between a projective vector of the first section and a projective vector of the third section on the substrate. 2. The circuit board of claim 1 wherein the substrate is a printed circuit board. 3. The circuit board of claim 1 wherein the first thermal module comprises a heat sink. 4. The circuit board of claim 3 wherein a plurality of fins is disposed on the heat sink. 5. The circuit board of claim 1 wherein the second thermal module comprises a heat sink. 6. The circuit board of claim 5 wherein the heat sink comprises a plurality of fins. 7. The circuit board of claim 1 wherein the heat pipe is a U-shaped heat pipe. 8. The circuit board of claim 1 wherein the heat pipe is an L-shaped heat pipe. 9. The circuit board of claim 1 wherein the opening of the substrate is a groove. 10. The circuit board of claim 1 wherein the included angle is equal to 90��. 11. The circuit board of claim 1 being a display card. 12. The circuit board of claim 11 further comprising a graphic processing unit installed on the substrate wherein the first thermal module is installed above the graphic processing unit. 13. The circuit board of claim 1 being a motherboard.