IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0243488
(2005-10-04)
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등록번호 |
US-7520968
(2009-07-01)
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발명자
/ 주소 |
- Mavliev, Rashid A.
- Karuppiah, Lakshmanan
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출원인 / 주소 |
|
대리인 / 주소 |
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인용정보 |
피인용 횟수 :
1 인용 특허 :
140 |
초록
▼
An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to crea
An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.
대표청구항
▼
The invention claimed is: 1. A pad assembly for polishing a substrate, comprising: a contact surface having a plurality of posts and a plurality of interstitial areas disposed on a backing; and a subpad coupled to the backing adapted to be disposed on an electrode, wherein a conductive coating is a
The invention claimed is: 1. A pad assembly for polishing a substrate, comprising: a contact surface having a plurality of posts and a plurality of interstitial areas disposed on a backing; and a subpad coupled to the backing adapted to be disposed on an electrode, wherein a conductive coating is applied to at least a bottom of the plurality of interstitial areas. 2. The pad assembly of claim 1, wherein the conductive coating is a metallic coating. 3. The pad assembly of claim 1, wherein the conductive coating is a copper material, a bronze material, tin/zinc alloy material, or combinations thereof. 4. The pad assembly of claim 1, wherein the conductive coating forms a conductive layer on a sidewall of each of the plurality of interstitial areas. 5. The pad assembly of claim 1, wherein the contact surface is adapted to couple to a power supply by a conductive tab. 6. The pad assembly of claim 1, wherein the pad assembly has a plurality of perforations. 7. A pad assembly for polishing a substrate, the pad assembly adapted to couple to a power source, the pad assembly comprising: a first conductive layer having a contact surface adapted to polish the substrate, the contact surface having a conductive coating formed thereon; and a second conductive layer coupled to and disposed below the first conductive layer with a subpad therebetween, wherein the second conductive layer is adapted to receive a voltage from the power source that is different than the first conductive layer. 8. The pad assembly of claim 7, wherein the pad assembly further has a plurality of perforations extending through the first conductive layer and the subpad to the second conductive layer. 9. The pad assembly of claim 7, wherein the conductive coating is a metal containing coating. 10. The pad assembly of claim 7, wherein the conductive coating is a copper material, a bronze material, tin/zinc alloy material, or combinations thereof. 11. The pad assembly of claim 7, wherein the contact surface is dielectric. 12. The pad assembly of claim 7, wherein the contact surface comprises: a plurality of posts; and a plurality of interstitial areas between the plurality of posts. 13. The pad assembly of claim 12, wherein the conductive coating fills the plurality of interstitial areas. 14. The pad assembly of claim 12, wherein the conductive coating is a copper material, a bronze material, tin/zinc alloy material, or combinations thereof. 15. The pad assembly of claim 12, wherein the conductive coating forms a conductive layer on at least a bottom of the plurality of interstitial areas. 16. The pad assembly of claim 7, wherein the contact surface includes a plurality of abrasive particles. 17. A pad assembly for polishing a substrate, comprising: a perforated contact surface having a plurality of posts and a plurality of interstitial areas disposed on a backing; and a subpad coupled to the backing and adapted to be disposed on an electrode, wherein a conductive coating is disposed on the contact surface and at least a bottom of the plurality of interstitial areas. 18. The pad assembly of claim 17, wherein the conductive coating is a metallic coating. 19. The pad assembly of claim 18, wherein the conductive coating is a copper material, a bronze material, tin/zinc alloy material, or combinations thereof. 20. A pad assembly for polishing a substrate, the pad assembly adapted to couple to a power source, the pad assembly comprising: a first conductive layer having a perforated contact surface coated with a conductive material, the contact surface having a plurality of posts adapted to polish the substrate and a plurality of interstitial areas adjacent the plurality of posts; and a second conductive layer coupled to and disposed below the first conductive layer with a subpad therebetween, wherein the second conductive layer is adapted to receive a voltage from the power source that is different from a voltage applied to the first conductive layer.
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