초록 ▼

A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two

A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

대표청구항 ▼

The invention claimed is: 1. A method comprising: (1) applying a composition over an electronic circuit board, and (2) curing the composition to produce a sealed circuit board; where the composition is prepared by mixing components comprising: (I) a polyorganosiloxane having an average of at least

The invention claimed is: 1. A method comprising: (1) applying a composition over an electronic circuit board, and (2) curing the composition to produce a sealed circuit board; where the composition is prepared by mixing components comprising: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter comprising a reaction product of a hydroxy-terminated polyorganosiloxane with an epoxy-functional alkoxysilane or an unsaturated alkoxysilane, or a physical blend of a hydroxy-terminated polyorganosiloxane with an epoxy-functional alkoxysilane or an unsaturated alkoxysilane, with the proviso that component (IV) and component (V) are added to the composition in amounts sufficient to provide resistance to Bleed to the composition. 2. The method of claim 1, where the substrate comprises an epoxy, a polycarbonate, a poly(butylene terephthalate) resin, a polyamide resin, a blend of polyamide resin with syndiotactic polystyrene, an acrylonitrile-butadiene-styrene, a styrene-modified poly(phenylene oxide), a poly(phenylene sulfide), a vinyl ester, a polyphthalamide, a polyimide, silicon, aluminum, a stainless steel alloy, titanium, copper, nickel, silver, gold, or combinations thereof. 3. The method of claim 1, where component (V) comprises an alkoxysilane of the formula R28 μSi(OR29)(4-μ), where μ is 1, 2, or 3, each R28 is independently a monovalent organic group, with the proviso that at least one R28 is an unsaturated organic group or an epoxy-functional group, and each R29 is independently an unsubstituted, saturated hydrocarbon group of at least 1 carbon atom. 4. A method comprising: (1) applying a composition on an electronic substrate, (2) attaching a semiconductor die to the composition, (3) curing the composition to produce a bonded composite, optionally (4) repeating steps (1) to (3) to attach one or more additional semiconductor dice to the semiconductor die, optionally (5) wire bonding the semiconductor die or semiconductor dice, optionally (6) cleaning, optionally (7) overmolding the semiconductor die or semiconductor dice with a molding compound, and optionally (8) attaching solder balls to form a finished package; where the composition is prepared by mixing components comprising: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (Ill) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter compriding a reaction product of a hydroxy-terminated polyorganosiloxane with an epoxy-functional alkoxysilane or an unsaturated alkoxysilane, or a physical blend of hydroxy-terminated polyorganosiloxane with an epoxy-functional alkoxysilane or an unsaturated alkoxysilane, with the proviso that component (IV) and component (V) are added to the composition in amounts sufficient to provide resistance to Bleed to the composition. 5. The method of claim 4, where the substrate comprises an epoxy, a polycarbonate, a poly(butylene terephthalate) resin, a polyamide resin, a blend of polyamide resin with syndiotactic polystyrene, an acrylonitrile-butadiene-styrene, a styrene-modified poly(phenylene oxide), a poly(phenylene sulfide), a vinyl ester, a polyphthalamide, a polyimide, silicon, aluminum, a stainless steel alloy, titanium, copper, nickel, silver, gold, or combinations thereof. 6. The method of claim 4, where component (I) comprises a polyorganosiloxane of the formula: (a) R13SiO(R12SiO) α(R1R2SiO)βSiR1 3, (b) R32R4SiO(R32SiO) χ(R3R4SiO) δSiR32R4, or (c) a combination thereof, where α has an average value of 0 to 2000, β has an average value of 2 to 2000, each R1 is independently a monovalent organic group, each R2 is independently an unsaturated monovalent organic group, χ has an average value of 0 to 2000, δ has an average value of 0 to 2000, each R3 is independently a monovalent organic group, and each R4 is independently an unsaturated monovalent organic group. 7. The method of claim 4, where component (I) comprises an MQ resin consisting essentially of R53SiO1/2 units and SiO4/2 units, a TD resin consisting essentially of R5SiO3/2 units and R52SiO2/2 units, an MT resin consisting essentially of R53SiO1/2 units and R5SiO3/2 units, an MTD resin consisting essentially of R53SiO1/2 units, R5SiO3/2 units, and R52SiO2/2 units, or a combination thereof, where each R5 is a monovalent organic group of 1 to 20 carbon atoms, and the resin contains an average of 3 to 30 mole percent of unsaturated organic groups. 8. The method of claim 4, where component (II) is present and component (II) comprises siloxane units selected from HR62SiO1/2, R63SiO1/2, HR6SiO2/2, R62SiO2/2, R6SiO3/2, SiO4/2, or combinations thereof; where each R6 is independently selected from monovalent organic groups free of aliphatic unsaturation. 9. The method of claim 4, where component (II) is present and component (II) comprises a compound of the formula: (a) R73SiO(R72SiO) ε(R7HSiO) øSiR73, or (b) R82HSiO(R82SiO) γ(R8HSiO) ηSiR82H, (c) a combination thereof, where ε has an average value of 0 to 2000, ø has an average value of 2 to 2000, each R7 is independently a monovalent organic group free of aliphatic unsaturation, γ has an average value of 0 to 2000, η has an average value of 0 to 2000, and each R8 is independently a monovalent organic group free of aliphatic unsaturation. 10. The method of claim 4, where component (Ill) comprises a platinum metal, a rhodium metal, or an organometallic compound. 11. The method of claim 4, where component (Ill) comprises a microencapsulated hydrosilylation catalyst. 12. The method of claim 4, where component (IV) comprises a compound of the formula: (a) R93SiO(R92SiO) ι(R9R10SiO) φSiR93, (b) R112R12SiO(R112SiO) κ(R11R12SiO) λSiR112R12, (c) F3C(CF2)νR13--Si--[O--Si(R14 )2(R15)]3, (d) a resinous or branched structure consisting essentially of R15R142SiO1/2 units, CF3(CF2)νR13SiO3/2 units, and optionally SiO4/2 units, or (e) a combination thereof; where ι has an average value of 0 to 2000, φ has an average value of 1 to 500, each R9 is independently a hydrogen atom or a monovalent organic group, with the proviso that at least one R9 is a hydrogen atom or an unsaturated monovalent organic group; each R10 is independently a fluoro-functional organic group; κ has an average value of 0 to 2000; λ has an average value of 0 to 500; each R11 is independently a hydrogen atom or a monovalent organic group, with the proviso that at least one R11 is a hydrogen atom or an unsaturated monovalent organic group; each R12 is independently a fluoro-functional organic group; each R13 is independently a divalent organic group; each R14 is independently a monovalent hydrocarbon group free of aliphatic unsaturation; ν is 0 to 10; and each R15 is independently a hydrogen atom or an unsaturated monovalent organic group. 13. The method of claim 4, where component (V) comprises an alkoxysilane of the formula R28 μSi(OR29)(4-μ), where μ is 1, 2, or3, each R28 is independently a monovalent organic group, with the proviso that at least one R28 is an unsaturated organic group or an epoxy-functional group, and each R29 is independently an unsubstituted, saturated hydrocarbon group of at least 1 carbon atom. 14. The method of claim 4, where the composition further comprises an acid acceptor, an anti-oxidant, a stabilizer, a flame retardant, a flow control additive, a reactive diluent, an anti-settling agent, a silylating agent, a desiccant, a blowing agent, or combinations thereof.