초록 ▼

A anti-icing/de-icing device for an aircraft wing includes at least one aerodynamic surface, e.g. a rotorcraft blade or an airplane wing, the aerodynamic surface possessing at least two anti-icing/de-icing modules 17, with each module 17 being provided with a respective heater element 54. In additio

A anti-icing/de-icing device for an aircraft wing includes at least one aerodynamic surface, e.g. a rotorcraft blade or an airplane wing, the aerodynamic surface possessing at least two anti-icing/de-icing modules 17, with each module 17 being provided with a respective heater element 54. In addition, the heater elements 54 of the modules 17 are powered electrically by a common electrical power supply member 1, each anti-icing/de-icing module acting against icing in its own zone independently of the other module(s).

대표청구항 ▼

What is claimed is: 1. An anti-icing/de-icing device for an aircraft wing, comprising: a common power supply connection in the wing; a common communication connection in the wing; at least two separate anti-icing/de-icing modules on an aerodynamic surface of the wing, each of said modules having a

What is claimed is: 1. An anti-icing/de-icing device for an aircraft wing, comprising: a common power supply connection in the wing; a common communication connection in the wing; at least two separate anti-icing/de-icing modules on an aerodynamic surface of the wing, each of said modules having a respective microprocessor connected to said common communication connection and to said common power supply, a respective heater element that is connected to said microprocessor, a respective ice sensor that communicates with said microprocessor, and a respective temperature sensor that communicates with said microprocessor, wherein each said microprocessor is arranged to operate said respective heater element in response to inputs from said respective ice and temperature sensors, and wherein each said microprocessor is managed independently of every other said microprocessor in the other module(s). 2. A device according to claim 1, wherein said microprocessor causes electrical power to be supplied to said heater element when a first measurement signal from said temperature sensor lies below a predetermined trigger threshold. 3. A device according to claim 1, wherein said microprocessor receives a monitoring signal coming from said ice sensor, said microprocessor electrically powering said heater element depending on said monitoring signal. 4. A device according to claim 1, wherein said microprocessor is made on a flexible medium that is integrated in the aerodynamic surface. 5. A device according to claim 1, wherein said temperature sensor on a flexible medium. 6. A device according to claim 1, wherein said heater element is made on a flexible medium. 7. A device according to claim 1, wherein said heater element comprises a switch member and a heater surface. 8. A device according to claim 1, wherein said heater element includes at least two heater sections. 9. A device according to claim 1, wherein said common power supply connection is made in redundant manner. 10. A device according to claim 1, wherein said microprocessor is connected to a central processor unit via said common communication connection. 11. A device according to claim 10, wherein said central processor unit includes a diagnosis connector element and a central processor together with its memory and interfaces. 12. A method of anti-icing/de-icing an aircraft wing, the wing including at least one first aerodynamic surface possessing at least two anti-icing/de-icing modules, each module being provided with a respective microprocessor, a respective ice sensor, a respective temperature sensor, and a respective heater element, the method comprising: electrically powering the heater elements of said modules via a common electrical power supply connection in the wing; operating each said respective heater element by said respective microprocessor in response to inputs from said respective ice and temperature sensors; and managing each said microprocessor independently of every other said microprocessor in the other module(s).