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Fixture and method of holding and debonding a workpiece with the fixture 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-038/10
출원번호 UP-0460159 (2006-07-26)
등록번호 US-7524390 (2009-07-01)
발명자 / 주소
  • DeMeter, Edward C.
  • Powell, R. Michael
출원인 / 주소
  • The Penn State Research Foundation
대리인 / 주소
    Howard & Howard Attorneys PLLC
인용정보 피인용 횟수 : 7  인용 특허 : 44

초록

A fixture for holding a workpiece during a manufacturing process includes a base and a rod received by and moveable relative to the base. The rod includes a proximal end presenting a bonding surface. Adhesive establishes an adhesive bond extending between and bonding to the bonding surface and the

대표청구항

What is claimed is: 1. A method of holding a workpiece on a fixture including a base and a rod presenting a bonding surface and being received by and moveable relative to the base; said method comprising the steps of: adjoining adhesive to the bonding surface; adhering the adhesive to the bonding s

이 특허에 인용된 특허 (44)

  1. Kobe, James J.; Liu, Junkang Jacob; Harrison, John A.; Momchilovich, Bradley S.; Rivera, Raymond R., Adhesive article and method of preparing.
  2. Hutter ; III Charles G. (Carson City NE), Adhesive attachment and mounting fixture.
  3. Hutter ; III Charles G. (Carson City NV), Adhesive attachment and mounting fixture.
  4. Kulig Frank M. (Bloomfield CT), Apparatus and method for localized heating of an object at precise temperatures.
  5. Mushardt Heinrich (Vechelde DEX) Uhlig Uwe (Buchholz DEX) Bleich Ralf (Lneburg DEX), Cast fixture for holding composite workpieces.
  6. Sakai, Satoki; Todoroki, Jiro, Chip element holder and method of handling chip elements.
  7. Yamada Yutaka,JPX, Fabrication process of a semiconductor device including a dicing process of a semiconductor wafer.
  8. Glista ; Andrew S. ; Katz ; Rodney S., Fiber optics cable strengthening method and means.
  9. Hutter ; III Charles G. (Carson City NV), Fixture for securing an adhesive attachment to a substrate.
  10. Hutter ; III Charles G. (Carson City NV), Fixture for securing an adhesive attachment to a substrate.
  11. Tarumizu Yoshitaka,JPX, Freezing chuck type machining method.
  12. Zhang, Xuesong, Holding apparatus and method utilizing magnetorheological material.
  13. Salamon Peter A. (Hebron CT) DeMarco JoAnn (Wethersfield CT), Lens blocking/deblocking method.
  14. Hood Randy (Milton CAX), Light curing apparatus for a continuous linear product.
  15. Vogel, Klaus, Loader/unloader with selectively actuatable suction elements.
  16. Cory Michael L. (Clinton WI) Dean Donald W. (Rockton IL), Magnetic fixture assembly.
  17. Dischert William A. (Springfield NJ), Method and apparatus for aligning a chuck for holding an information containing disc stylus.
  18. Ishaug, Brian; Wang, Chung-Yung; Chang, Hung-Lun, Method and apparatus for demounting workpieces from adhesive film.
  19. Inoue Hirokazu (Toukai JPX) Takasaka Masahiro (Hitachioota JPX) Watanabe Koichi (Hitachi JPX) Hosokawa Takashi (Hitachi JPX) Sawahata Mamoru (Hitachi JPX), Method and apparatus for removing an electronic component from a board.
  20. Glatfelter Troy ; Lycette Mark ; Akkashian Eric, Method and apparatus for the fabrication of lightweight semiconductor devices.
  21. Hansen Gerald D. (Holicong PA) Biber Joseph N. (West Chester PA), Method and composition for inhibiting corrosion in aqueous heat transfer systems.
  22. Krajewski, Paul Edward; Barton, Georg M., Method for adhering reinforcing patches during superplastic forming.
  23. Marlinski Edward J. (Rochester NY), Method for bonding semiconductor chips.
  24. Newton Orrin A. (Northville MI), Method for fixturing a workpiece.
  25. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY) Welles ; II Kenneth B. (Schenectady NY), Method for packaging integrated circuit chips employing a polymer film overlay layer.
  26. Dillner James R. (Hebron CT), Method for securing a workpiece to a workholder.
  27. Crivello James V. (Clifton Park NY) Ashby Bruce A. (Schenectady NY), Method of adhesive bonding using visible light cured epoxies.
  28. Levine Aaron W. (Mercer County NJ), Method of forming a structural bond employing indirect exposure of a light responsive adhesive.
  29. Hed P. Paul (80 Milaw Ct. San Ramon CA 94583), Method of holding optical elements without deformation during their fabrication.
  30. Rickie C. Lake ; Mark E. Tuttle ; Joseph P. Mousseau ; Clay L. Cirino, Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate.
  31. Wal, III,H. James Vander, Modular tooling apparatus with tapered locater system.
  32. Cole Brian M. ; Dower William V. ; Oxman Joel D., Optical fiber connector using colored photocurable adhesive.
  33. Conant Jay W. (Richmond VT) Fisher Donald W. (Colchester VT) Fox David D. (Milton VT), Pellicle ring removal method and tool.
  34. Baur Manfred (Ulm-Jungingen DEX), Pressurized clamp for securing tools or workpieces.
  35. Sweeney, Jr., Theodore J., Self-dispensing fastener for photocuring adhesive.
  36. Ruhl Florence J. ; Ruhl Stephen L., Support device for artificial fingernails.
  37. DeMeter,Edward C., System and method for bonding and debonding a workpiece to a manufacturing fixture.
  38. Steele,Mark Greg; Cochran,Dustin Alan, System and method for holding and releasing a workpiece for electrochemical machining.
  39. Becker Manfred G. ; Dinardi Peter C. ; Sprenger Kenneth J. ; Guitar Timothy S., System for holding a thin-walled workpiece during machining.
  40. Rock Reinhold (Westlake OH) Schuessler Josef (Brecksville OH), Tape application apparatus.
  41. Yamamoto Yasuyoshi (Komaki JPX) Kaga Yuzo (Nagoya JPX) Yoshikawa Toshiharu (Nagoya JPX) Moribe Akira (Inazawa JPX), Ultraviolet-hardenable adhesive and bonding method employing same.
  42. Goellner Willy J. (Rockford IL), Universal holding system for a contoured workpiece.
  43. Dillner James R. (Hebron CT), Workholder for securing a workpiece thereto.
  44. Weck Manfred (Aachen DEX) Klingel Hans (Mglingen DEX) Werntze Georg (Hopfen DEX), Workpiece manipulation system.

이 특허를 인용한 특허 (7)

  1. Raffles, Mark H.; Llewellyn-Powell, Helen L.; High, Colin J., Adhesive fastening elements for holding a workpiece.
  2. Raffles, Mark H.; Axinte, Dragos; Llewellyn-Powell, Helen L., Adhesive fastening elements for holding a workpiece and methods of de-bonding a workpiece from an adhesive fastening element.
  3. Raffles, Mark H.; Axinte, Dragos; Llewellyn-Powell, Helen L., Adhesive fastening elements for holding a workpiece and methods of de-bonding a workpiece from an adhesive fastening element.
  4. Raffles, Mark H.; Axinte, Dragos; Winton, Peter D.; Llewellyn-Powell, Helen L., Adhesive fastening elements for holding a workpiece and methods of de-bonding a workpiece from an adhesive fastening element.
  5. Leong, Eric M.; Terpsma, John, Compliant battery supports for device testing.
  6. Fessler-Knobel, Martin; Huttner, Roland, Mounting device and method for mounting a component on a component carrier using an adhesive.
  7. Puttichaem, Wachira; Waiyawong, Sarawut, Systems and devices for achieving high throughput attachment and sub-micron alignment of components.
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