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Methods for fabricating compound material wafers are described. An embodiment of the method includes providing a donor substrate having a surface, forming a weakened zone in the donor substrate to define a transfer layer that includes the donor substrate surface, bonding the surface of the transfer

Methods for fabricating compound material wafers are described. An embodiment of the method includes providing a donor substrate having a surface, forming a weakened zone in the donor substrate to define a transfer layer that includes the donor substrate surface, bonding the surface of the transfer layer to a handle substrate, and detaching the donor substrate at the weakened zone to transfer the transfer layer onto the handle substrate. Consequently, a compound material wafer is formed, and the transfer layer detached donor wafer provides a remainder substrate having a surface where the transfer layer was detached. Next, an additional layer is deposited onto a surface of the remainder substrate to increase its thickness and to form a reconditioned substrate, and the reconditioned substrate is recycled as a donor substrate for fabricating additional compound material wafers.

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What is claimed is: 1. A method for fabricating compound material wafers, comprising: providing a donor substrate having a surface; forming a weakened zone in the donor substrate to define a transfer layer that includes the donor substrate surface; bonding the surface of the transfer layer to a han

What is claimed is: 1. A method for fabricating compound material wafers, comprising: providing a donor substrate having a surface; forming a weakened zone in the donor substrate to define a transfer layer that includes the donor substrate surface; bonding the surface of the transfer layer to a handle substrate; detaching the donor substrate at the weakened zone to transfer the transfer layer onto the handle substrate thus forming a compound material wafer, with the transfer layer detached, the donor substrate providing a remainder substrate having a first surface where the transfer layer was detached; epitaxially depositing an additional layer of a crystalline material onto a second surface of the remainder substrate to increase the thickness of the remainder substrate to that of the initial donor substrate to form a reconditioned substrate, wherein the second surface is positioned opposite to the first surface where detaching occurred; providing an additional transfer layer on the first surface of the reconditioned substrate by forming a weakened zone therein after depositing the additional layer; and recycling the reconditioned substrate as a donor substrate for fabricating an additional compound material wafer that includes the additional transfer layer. 2. The method of claim 1, which further comprises, prior to depositing the additional layer on the remainder substrate, detaching transfer layers from the donor substrate at least two times to form compound material wafers. 3. The method of claim 1, which further comprises, prior to depositing the additional layer on the remainder substrate, repeatedly using the donor substrate to form compound material wafers until a minimum thickness value is reached. 4. The method of claim 1, which further comprises homoepitaxially depositing the additional layer onto the second surface of the remainder substrate. 5. The method of claim 4, wherein the homoepitaxial layer is deposited by at least one of a metal organic chemical vapor deposition method, a hybrid vapor phase epitaxy method, or a molecular beam epitaxy method. 6. The method of claim 5, wherein the homoepitaxial layer has a dislocation density of less than about 1×102 per cm2. 7. The method of claim 1, which further comprises depositing a protective layer on the first surface prior to depositing the additional layer on the second surface. 8. The method of claim 7, wherein the protective layer is made of an oxide material or a nitride material. 9. The method of claim 7, which further comprises removing the protective layer prior to forming the weakened zone that provides the additional transfer layer when recycling the reconditioned substrate as the donor substrate. 10. The method of claim 1, which further comprises polishing or cleaning the surface of the remainder substrate before depositing the additional layer onto it. 11. The method of claim 1, wherein the donor substrate is made of at least one of gallium nitride, silicon carbide, germanium, aluminum nitride, or diamond. 12. The method of claim 1, wherein the handle substrate is made of a monocrystalline material or a polycrystalline material. 13. The method of claim 12, wherein the handle substrate is made of at least one of silicon, gallium arsenide, zinc oxide, silicon carbide, or aluminum nitride. 14. The method of claim 1, wherein the handle substrate is made of at least one of a glass or a ceramic material. 15. The method of claim 1, which further comprises, prior to bonding the donor substrate to the handle substrate, providing at least one of an insulating layer or a conducting layer on a bonding surface of the handle substrate. 16. The method of claim 15, wherein the insulating layer is made of at least one of silicon dioxide or silicon nitride. 17. The method of claim 1, wherein the additional layer that is deposited upon the remainder substrate is of a crystalline quality that is comparable to that of the remainder substrate. 18. The method of claim 1, wherein the additional layer that is deposited upon the remainder substrate is made of the same material as that of the remainder substrate. 19. The method of claim 18, wherein the additional layer that is deposited upon the remainder substrate is of a crystalline quality that is better than that of the remainder substrate.