A universal mounting supports high intensity LEDs in a lighting fixture with heat removal and electrical connection facilities. A holder includes a peripheral sidewall defining a cavity for accepting a printed circuit board assembly. A support member supports the printed circuit board assembly along
A universal mounting supports high intensity LEDs in a lighting fixture with heat removal and electrical connection facilities. A holder includes a peripheral sidewall defining a cavity for accepting a printed circuit board assembly. A support member supports the printed circuit board assembly along the peripheral sidewall. Electrical contact elements are provided the printed circuit board. A thermal conduction member is in thermal communication with the printed circuit board assembly. The receptacle portion removably engages with the holder portion. A plurality of contact sockets conductively engages the electrical contact elements of the holder portion to interconnect the contact elements to external wires. An aperture in the receptacle portion accepts the thermal conduction member, wherein the thermal conduction member passes through the aperture and into a space for dissipating heat from the printed circuit board.
대표청구항▼
The invention claimed is: 1. A universal mounting assembly for supporting at least one high intensity LED in a lighting fixture comprising: a holder portion and a receptacle portion, the holder portion including: a peripheral sidewall defining a cavity for accepting a printed circuit board assembly
The invention claimed is: 1. A universal mounting assembly for supporting at least one high intensity LED in a lighting fixture comprising: a holder portion and a receptacle portion, the holder portion including: a peripheral sidewall defining a cavity for accepting a printed circuit board assembly, at least one support member being disposed along the peripheral sidewall and configured to support the printed circuit board assembly; a plurality of electrical contact elements; and a thermal conduction member in thermal communication with the printed circuit board assembly; the receptacle portion including a plurality of contact sockets configured to conductively engage the plurality of electrical contact elements to connect the plurality of contact elements to external wires of the light fixture; and an aperture arranged to accept the thermal conduction member; wherein the thermal conduction member passes through the aperture and into a space for dissipating heat from the printed circuit board. 2. The mounting assembly of claim 1, also including: a spring for biasing the thermal conduction member, the spring disposed within the at least one support member; and the thermal conduction member having a flange portion adjacent to a first end of the spring; wherein the spring is configured to bias the flange portion against the printed circuit board to maintain a thermal path between the printed circuit board and the thermal conduction member. 3. The mounting assembly of claim 2, wherein the spring is seated on a washer at a second end of the spring opposite the flange portion, and a circular locking clip engaged with the thermal conduction member to lock the washer in a predetermined position along the thermal conduction member. 4. The mounting assembly of claim 2, wherein the support member also includes an internal shelf portion and the spring is seated on the shelf portion at a second end of the spring opposite the flange portion. 5. The mounting assembly of claim 2, wherein the support member also includes a peripheral latch portion directed inwardly; and the flange portion includes an offset rim that mates against the latch portion, to maintain the spring bias. 6. The mounting assembly of claim 2, wherein the printed circuit board includes at least one high intensity LED mounted thereon, and associated with each LED a pair of interconnection pad elements in electrical communication with the corresponding LED. 7. The mounting assembly of claim 6, wherein each electrical contact element of the plurality of contact elements include a finger portion; each finger portion including an angled portion, wherein the angled portion is engageable with the printed circuit board on a side of the printed circuit board opposite the flange portion for gripping the printed circuit board. 8. The mounting assembly of claim 7, wherein the printed circuit board having a plurality of interconnection pad elements corresponding to the plurality of electrical contact elements; the interconnection pad elements being arranged along an edge of the printed circuit board, and aligned with the corresponding angled portions of the electrical contact elements to provide a continuous electrical path between the LEDs mounted on the printed circuit board and the electrical contact elements. 9. The mounting assembly of claim 7, wherein the printed circuit board further comprises at least one interconnection pad element associated with one of control or communication path of the light fixture, wherein each control or communication interconnection pad is arranged along an edge of the printed circuit board, and aligned with the corresponding angled portions of the electrical contact elements to provide a continuous electrical path for control or communication circuits. 10. The mounting assembly of claim 1, wherein the receptacle portion is mounted on a substrate, the receptacle portion having a plurality of terminal portions extending through the substrate for attachment of a plurality external lead wires, and the thermal conduction member protruding below through the substrate for dissipation of heat from the printed circuit board. 11. The mounting assembly of claim 1, wherein the holder portion also includes at least one bayonet lug disposed on an exterior of the peripheral wall portion, the at least one bayonet lug insertable into a complementary channel in the light fixture. 12. A universal mounting assembly for supporting at least one high intensity LEDs in a lighting fixture comprising: a holder portion including: a peripheral sidewall defining a cavity for accepting a printed circuit board assembly, at least one support member being disposed along the peripheral sidewall and configured to support the printed circuit board assembly; a plurality of electrical contact elements to connect to external wires of the light fixture; a thermal conduction member in thermal communication with the printed circuit board assembly; and an aperture arranged to accept the thermal conduction member; wherein the thermal conduction member passes through the aperture and into a space for dissipating heat from the printed circuit board. 13. The mounting assembly of claim 12, also including: a spring for biasing the thermal conduction member, the spring disposed within the at least one support member; and the thermal conduction member having a flange portion adjacent to a first end of the spring; wherein the spring is configured to bias the flange portion against the printed circuit board to maintain a thermal path between the printed circuit board and the thermal conduction member. 14. The mounting assembly of claim 13, wherein the support member also includes an internal shelf portion and the spring is seated on the shelf portion at a second end of the spring opposite the flange portion. 15. The mounting assembly of claim 13, wherein the printed circuit board includes at least one high intensity LED mounted thereon, and associated with each LED a pair of interconnection pad elements in electrical communication with the corresponding LED. 16. A mounting assembly for supporting at least one high intensity LED in a lighting fixture comprising: a first portion having a frame portion and a plurality of integral electrical conductors arranged about a perimeter of the frame for connection to a corresponding plurality of electrical contact pads disposed on a PCB having at least one high intensity LED mounted thereon; an elongated second portion retentively engageable in thermal contact with the first portion, the second portion extending axially from the first portion for dissipation of heat from the PCB disposed within the first portion; the second portion further including a cavity for connecting the first portion and at least one base portion for supporting the first portion within the cavity. 17. The mounting assembly of claim 16, wherein the second portion includes a plurality of flute portions spaced apart to provide surface area for dissipating heat generated by the at least one LED mounted on the PCB. 18. The mounting assembly of claim 17, wherein the flute portions project radially inward from the outer radius of the second portion and at least one of the flute portions support the PCB assembly. 19. The mounting assembly of claim 18, also including at least one wire lead connected to one of the electrical contact pads, wherein the flute portions define at least one channel to accommodate extension of the at least one wire lead for connection to a power source. 20. The mounting assembly of claim 19, wherein the at least one wire lead includes crimped contacts inserted into a contact carrier portion.
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