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A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closin

A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closing a seam between frame structure and chip. The jet-printed structure has an upper edge that is above a lower edge of the chip.

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What is claimed is: 1. A method of manufacturing a micro-electro-mechanical systems (MEMS) component, the method comprising: producing a plurality of frame structures on a panel, each of the plurality of frame structures for enclosing a chip installation site; connecting, via bumps, a plurality of

What is claimed is: 1. A method of manufacturing a micro-electro-mechanical systems (MEMS) component, the method comprising: producing a plurality of frame structures on a panel, each of the plurality of frame structures for enclosing a chip installation site; connecting, via bumps, a plurality of chips to the panel at installation sites, at least one of the plurality of chips having a back side containing active components; and using a jet-printing process to apply a jet-printed structure that substantially closes a gap between the frame structure and the plurality of chips; wherein a fluid and curable resin, a melted polymer, or a dispersion containing nanoparticles is used to produce the jet-printed structure. 2. A method of manufacturing a micro-electro-mechanical systems (MEMS) component, the method comprising: producing a plurality of frame structures on a panel, each of the plurality of frame structures for enclosing a chip installation site; connecting, via bumps, a plurality of chips to the panel at the installation site, at least one of the plurality of chips having a back side containing active components; and using a jet-printing process to apply a jet-printed structure that substantially closes a gap between the frame structure and the plurality of chips; wherein a fluid and curable resin is printed as a dispersion containing nanoparticles to produce the jet-printed structure. 3. The method of claim 1 or 2, further comprising: separating the MEMs component from other MEMs components by cutting the panel. 4. The method according to claim 1, wherein the melted polymer comprises a UV-curing polymer. 5. The method of claim 1 or 2, further comprising: before applying the jet-printed structure, modifying surface energy of surfaces coming into contact with the jet-printed structure such that the jet-printed structure does not wet the surfaces coming into contact with the jet-printed structure. 6. The method of claim 5, further comprising: applying, to the surfaces coming into contact with the jet-printed structure, a film comprising a non-wetting surface, the film having a thickness of one or a more molecules. 7. The method of claim 6, further comprising treating the surfaces coming into contact with the jet-printed structure with a plasma containing fluorine. 8. The method of claim 6, further comprising: treating the surfaces coming into contact with the jet-printed structure with an organosilicon solution. 9. The method of claim 1 or 2, further comprising: after connecting the plurality of chips and applying the jet-printed structure, applying a base metallization to the panel by sputtering, CVD, PECVD, vapor deposition, or a thin-film process; and reinforcing the base metallization by depositing a metal layer using solution. 10. The method of claim 1 or 2, wherein the jet-printing process is performed under exposure to UV. 11. The method of claim 1 or 2, further comprising: applying a cast frame to the panel, the cast frame being applied under UV exposure during the jet-printing process; and producing a cover layer on the component by applying a polymer inside the cast frame without simultaneous UV exposure, wherein the polymer flows inside the cast frame and is thereafter cured. 12. The method of claim 1 or 2, further comprising: applying a base metallization to the panel; covering the base metallization with a polymer mask such than an annularly closed strip of the base metallization remains uncovered reinforcing the base metallization in an area of the annular strip by metal deposition from a solution to thereby produce a metallic frame structure; and removing the polymer mask prior to connecting a plurality of chips to the panel. 13. The method of claim 12, wherein the metallic frame structure has a height that is at least half a height of the bumps. 14. The method of claim 1 or 2, further comprising: before connecting the plurality of chips, producing a frame structure on the panel, the frame structure comprising ceramic or metal and having a spacing away from a lower edge of at least one of the plurality of chips; and sealing the frame structure via the jet-printing process after connecting the plurality of chips. 15. The method of claim 1 or 2, further comprising: applying, to the panel, a base metallization comprising an adhesion layer comprising titanium and a copper layer; and enhancing a thickness of the base metallization via non-current deposition using copper and nickel. 16. The method of claim 15, further comprising: applying a lamination film before applying the base metallization; and removing the lamination film in a strip-shaped area around at least one of the plurality of chips. 17. The method of claim 1 or 2, further comprising: producing a polymer layer on a back side of at least one of the plurality of chips; and depositing a metal layer over the polymer layer, the metal layer comprising a hermetic cover layer. 18. The method of claim 1 or 2, wherein polymer structures having a height between 20 μm and 30 μm height are produced in a single pass of the jet-printing process.