초록 ▼

An organic light emitting display device includes a first substrate, an array of organic light emitting pixels formed on the substrate, a second substrate opposing the first substrate. A frit seal interconnects the first and second substrates and surrounds the array of organic light emitting pixels.

An organic light emitting display device includes a first substrate, an array of organic light emitting pixels formed on the substrate, a second substrate opposing the first substrate. A frit seal interconnects the first and second substrates and surrounds the array of organic light emitting pixels. A film structure interposed between the second substrate and the array of organic light emitting pixels and contacts both the second substrate and the array.

대표청구항 ▼

What is claimed is: 1. An organic light emitting display device comprising: a first substrate; a second substrate comprising an interior surface opposing the first substrate; an array of organic light emitting pixels formed between the first and second substrates, the array comprising a top surface

What is claimed is: 1. An organic light emitting display device comprising: a first substrate; a second substrate comprising an interior surface opposing the first substrate; an array of organic light emitting pixels formed between the first and second substrates, the array comprising a top surface facing the second substrate; a frit seal interposed between the first and second substrates while surrounding the array, wherein the frit seal comprises an inner surface facing the array; and a film structure comprising one or more layered films, wherein the film structure comprising a portion interposed between the second substrate and the array, the film structure substantially fills space between the second substrate and the array and further contacts the interior surface and the top surface, wherein the film structure further contacts substantially the entire portion of the inner surface of the frit seal, wherein the film structure contacting the inner surface comprises a resin material, wherein the frit seal further comprises an outer surface facing away from the array, and wherein the same resin material is formed on a portion of the outer surface of the frit seal. 2. The device of claim 1, wherein the film structure covers substantially the entire portion of the top surface. 3. The device of claim 1, wherein the film structure further comprises a portion interposed between the first and second substrates while not interposed between the array and the second substrate. 4. The device of claim 1, wherein the array comprises a first electrode, a second electrode and an organic light emitting material interposed between the first and second electrodes, wherein the first electrode has a first distance from the first substrate, and the second electrode has a second distance from the first substrate, wherein the second distance is greater than the first distance, and wherein the top surface is a surface of the second electrode. 5. The device of claim 1, wherein the film structure comprises an organic resin layer and a protective layer interposed between the array and the organic resin layer, wherein the protective layer is configured to substantially inhibit components of the organic resin layer from diffusing into the array. 6. The device of claim 5, wherein the protective layer comprises at least one selected from the group consisting of silicon oxide and silicon nitride. 7. The device of claim 5, wherein the organic resin layer comprises a urethane acrylic resin. 8. The device of claim 1, wherein the array emits visible light through the second substrate. 9. The device of claim 1, wherein at least part of the film structure is substantially transparent with respect to visible light. 10. The device of claim 1, wherein the film structure has a reflectance for visible light smaller than or substantially equal to that of the second substrate. 11. The device of claim 1, wherein the film structure has a refractive index substantially equal to that of material that forms a layer contacting the film structure. 12. The device of claim 1, wherein the film structure is substantially nonconductive. 13. The device of claim 1, wherein the frit seal comprises one or more materials selected from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li2O), sodium oxide (Na2O), potassium oxide (K2O), boron oxide (B2O3), vanadium oxide (V2O5), zinc oxide (ZnO), tellurium oxide (TeO2), aluminum oxide (Al2O3), silicon dioxide (SiO2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P2O5), ruthenium oxide (Ru2O), rubidium oxide (Rb2O), rhodium oxide (Rh2O), ferrite oxide (Fe2O3), copper oxide (CuO), titanium oxide (TiO2), tungsten oxide (WO3), bismuth oxide (Bi2O3), antimony oxide (Sb2O3), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate. 14. The device of claim 1, wherein the film structure contacting the inner surface comprises a resin material, wherein the frit seal further comprises an outer surface facing away from the array, wherein the same resin material is formed on substantially the entire portion of the outer surface of the frit seal. 15. The device of claim 1, wherein the first substrate, the second substrate, the array and the frit seal in combination define a space, wherein the space is substantially filled with a solid matter, wherein the solid matter comprising the film structure.