초록 ▼

Nano-scale thermal management devices, methods, and systems are provided. According to some embodiments, a thermal management device configured to remove heat from a heated area can comprise an inlet port and a cavity. The cavity can be positioned intermediate a heat source and an opposing surface s

Nano-scale thermal management devices, methods, and systems are provided. According to some embodiments, a thermal management device configured to remove heat from a heated area can comprise an inlet port and a cavity. The cavity can be positioned intermediate a heat source and an opposing surface spaced apart from the heat source. The inlet port can receive a liquid (such as a coolant or cooling fluid) and direct the liquid to the cavity. The cavity can be configured to control the thickness of the liquid within the cavity. Liquid within the cavity can be heated by the heat source, and the opposing surface can comprise openings to allow evaporated liquid to exit the openings. A gas flow proximate the opposing surface can be used to carry vapor and be used to enhance liquid evaporation. Movement of the evaporated liquid enables heat from the heat source to be removed. The opposing surface can be a perforated membrane having micro-sized and nano-sized perforations. Other embodiments are also claimed and described.

대표청구항 ▼

I claim: 1. A thermal management device to remove heat from a heated area, the thermal management device comprising: at least one inlet port to receive a liquid coolant and direct the liquid coolant to a cavity, the cavity disposed intermediate a heat source and an opposing surface, the opposing su

I claim: 1. A thermal management device to remove heat from a heated area, the thermal management device comprising: at least one inlet port to receive a liquid coolant and direct the liquid coolant to a cavity, the cavity disposed intermediate a heat source and an opposing surface, the opposing surface covering at least a portion of the cavity; the cavity configured to receive the liquid coolant such that the liquid coolant has a thickness determined by the cavity when the liquid coolant moves into the cavity from the at least one inlet port, the liquid coolant within the cavity forming a liquid layer having a geometrical shape corresponding to the shape of the cavity; the opposing surface comprising a plurality of openings such that the opposing surface is configured to allow vapor from the liquid coolant heated by the heat source to pass through the openings; and a gas flow directed toward the opposing surface to carry the vapor from the liquid coolant with the gas flow. 2. The thermal management device of claim 1, further comprising a perforated membrane as the opposing surface, the perforated membrane comprising a plurality of membrane pores such that the vapor can pass through the membrane pores. 3. The thermal management device of claim 2, wherein the membrane apertures of the perforated membrane have diameters ranging from approximately 10 nanometers to approximately 10,000 nanometers. 4. The thermal management device of claim 1, the cavity being configured as a nano/micro-fabricated slit having a height ranging from approximately 0.01 micrometers to approximately 100 micrometers thereby causing the liquid film within the cavity to have a thickness ranging from approximately 0.01 micrometers to approximately 100 micrometers. 5. The thermal management device of claim 1, the heat source disposed in thermal communication with the cavity at a surface of the heat source where heat is generated such that heat dissipating from the heat source evaporates the liquid film to provide the vapor that passes through the opposing surface to remove heat from the heat source. 6. The thermal management device of claim 1, further comprising at least one heat conductor disposed at least partially within the cavity, the heat conductor configured to transfer heat toward at least one of the opposing surface and the liquid film within the cavity. 7. The thermal management device of claim 1, wherein the liquid coolant is a dielectric such that the dielectric liquid coolant can be proximate an electronic device without shorting the electronic device. 8. A method to transfer and manage thermal energy released at a heat source, the method comprising: providing a perforated membrane comprising a plurality of micro/nano-sized fabricated perforations; providing a liquid film having a desired thickness and a desired pressure in a cavity, the cavity disposed generally between a heat source and the perforated membrane; evaporating at least a portion of the liquid film with the heat source to form a vapor such that the vapor of the liquid film passes through at least a portion of the perforations; and providing a gas flow proximate the perforated membrane to mix with the vapor to form gas-vapor mixture and to carry the vapor in the direction of the gas flow. 9. The method of claim 8, wherein providing the perforated membrane comprises providing a semipermeable membrane, the semipermeable membrane configured to allow the vapor to pass through membrane and not allow the liquid film to pass through the membrane. 10. The method of claim 8, further comprising removing liquid from the gas-vapor mixture and providing the removed liquid to the cavity as the liquid film. 11. The method of claim 8, further comprising shaping the cavity to a predetermined geometrical shape to provide the desired thickness and the desired pressure of the liquid film. 12. The method of claim 8, further comprising controlling the rate of vapor passing through the perforated membrane by adjusting the perforations. 13. The method of claim 8, further comprising providing a coolant proximate at least one of the liquid film and the heat source to remove heat from at least one of the liquid film and the heat source. 14. The method of claim 8, further comprising providing the gas flow at a velocity ranging from approximately 1 meter per second to approximately 300 meters per second. 15. The method of claim 8, further comprising pressurizing the liquid film to the desired pressure such that cavity is substantially filled with the liquid film. 16. The method of claim 8, further comprising at least one of drying or heating at least a portion of gas in the gas flow to enhance evaporation of the liquid film. 17. In a system to transfer and manage thermal energy released at a hot spot on a surface of a chip, a perspirating patch thermal management system comprising: a liquid in a cavity, the cavity proximate a hot spot, the cavity configured and shaped to control the thickness of the liquid within the cavity, the liquid being at a temperature lower than the temperature of the hot spot such that the liquid absorbs heat from the hot spot; a gas conduit to provide a flow of gas proximate the cavity such that the flow of gas passes proximate the cavity; and a perspirating patch disposed in liquid communication with the cavity, the perspirating patch comprising a plurality of holes to receive evaporated liquid from the cavity for presentation toward the flow of gas so that the flow of gas carries the evaporated liquid from the holes of the perspirating patch. 18. The perspirating patch thermal management system of claim 17, further comprising a second liquid in a conduit proximate the liquid, the second liquid having a temperature different from the liquid to absorb heat from the liquid. 19. The perspirating patch thermal management system of claim 17, the gas conduit being configured as a jet with an exhaust disposed toward and at a desired impingement angle to the perspirating patch to provide the flow of gas proximate the perspirating nano-patch. 20. The perspirating patch thermal management system of claim 17, the perspirating patch having at least one tapered surface such that a portion of the flow of gas contacts the tapered surface at an angle. 21. The perspirating patch thermal management system of claim 17, at least a portion of the perforated holes comprising a material coating to control perspiration of the liquid through the perspirating patch. 22. The perspirating patch thermal management system of claim 17, further comprising a second perspirating patch operatively coupled to the perspirating patch, the second perspirating patch configured to manage thermal energy released at a second hot spot such that the perspirating patch and second perspirating patch cool multiple hot spots. 23. The perspirating patch thermal management system of claim 17, the perspirating patch being a semipermeable membrane such that the semipermeable membrane allows evaporated liquid to pass through the semipermeable membrane but not allow liquid to pass through the semipermeable membrane. 24. The perspirating patch thermal management system of claim 17, the plurality of holes of the perspirating patch having a tapered shape such that the diameter of the holes disposed toward the cavity are greater than the diameter of the holes disposed toward the flow of gas.