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A socket for a semiconductor package comprises an insulating base containing a plurality of contacts, a floating board received in the insulating base, a plurality of spring members located between the insulating base and the floating board, a bottom cover pivotally assembled to an end of the insula

A socket for a semiconductor package comprises an insulating base containing a plurality of contacts, a floating board received in the insulating base, a plurality of spring members located between the insulating base and the floating board, a bottom cover pivotally assembled to an end of the insulating base, a top cover pivotally assembled to an edge of the bottom cover, a pressing board retained to the bottom cover, a heat sink module disposed on the bottom cover, and a fan mounted on the top cover.

대표청구항 ▼

What is claimed is: 1. A socket comprising: an insulating base receiving a plurality of contacts and defining a receiving space; a bottom cover pivotally assembled to the insulating base; and a top cover pivotally assembled to the bottom cover and covering the bottom cover, the top cover having sup

What is claimed is: 1. A socket comprising: an insulating base receiving a plurality of contacts and defining a receiving space; a bottom cover pivotally assembled to the insulating base; and a top cover pivotally assembled to the bottom cover and covering the bottom cover, the top cover having supporting portions upwardly protruding from sides thereof. 2. The socket of claim 1, further comprising a fan mounted to and supported by the supporting portions of the top cover. 3. The socket of claim 1, further comprising a floating board movably received in the receiving space of the insulating base and a plurality of spring members located between the insulating base and the floating board to upwardly urge the floating board. 4. The socket of claim 3, further comprising a pressing board retained in an opening defined in a center of the bottom cover and a heat sink module located upon the bottom cover and upwardly passing through a mouth defined on the top cover. 5. A socket for a semiconductor package comprising: an insulating base receiving a plurality of contacts and defining a receiving space; a bottom cover pivotally assembled to an end of the insulating base thereof; a top cover pivotally assembled to an edge of the bottom cover and covering the bottom cover; and a fan mounted on the top cover. 6. The socket of claim 5, wherein the top cover is formed with supporting portions protruding upwardly from opposed sides thereof, the fan is mounted to and retained with the supporting portions. 7. The socket of claim 6, wherein the top cover is formed with a pivot sides attached to the bottom cover and a retaining side opposed to the pivot side, to which a retainer is assembled for retaining the top cover to the insulating base. 8. The socket of claim 6, further comprising a floating board movably received in the receiving space of the insulating base and a plurality of spring members located between the insulating base and the floating board to upwardly urge the floating board. 9. The socket of claim 8, further comprising a pressing board retained in an opening defined in a center of the bottom cover and a heat sink module mounted on the bottom cover. 10. The socket of claim 9, wherein the top cover has a mouth for the heat sink module passing through, and the supporting portion has a certain height to let the fan locate upon the heat sink. 11. The socket of claim 9, wherein the floating board defines a room for receiving the semiconductor package, the pressing board can downwardly press the semiconductor package to bring the floating board and the semiconductor package downwardly move. 12. A socket assembly comprising: an insulating base receiving a plurality of contacts and defining a receiving space; a bottom cover having one end linked to an end of the insulating base thereof; a top cover linked to the other end of the bottom cover and covering the bottom cover; and a fan mounted on the top cover with a distance so as to allow a heat sink to be located thereunder under a condition that both the top cover and the bottom cover respectively define aligned central openings through which said heat sink and an associated electronic package extend. 13. The socket assembly as claimed in claim 12, wherein at least one supporting section is formed on the top cover unto which the fan is assembled.