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Elastomer bonding of large area sputtering target

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-015/00
출원번호 UP-0224221 (2005-09-12)
등록번호 US-7550055 (2009-07-01)
발명자 / 주소
  • Le, Hienminh H.
  • Hosokawa, Akihiro
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Patterson & Sheridan LLP
인용정보 피인용 횟수 : 21  인용 특허 : 45

초록

Embodiments of the present invention generally relate to sputtering targets used in semiconductor manufacturing. In particular, the invention relates to bonding the sputtering target to a backing plate that supports the sputtering target in a deposition chamber. In one embodiment, a method of bondin

대표청구항

What is claimed is: 1. A method of bonding at least one sputtering target tile to a backing plate, comprising: providing an elastomeric adhesive layer between the at least one sputtering target tile and the backing plate; providing at least one metal mesh within the elastomeric adhesive layer, wher

이 특허에 인용된 특허 (45)

  1. Subramani, Anantha; Das, Ashok K.; DeLaurentis, Leif E.; Rosenstein, Michael, Aluminum deposition shield.
  2. Satitpunwaycha Peter ; Yao Gongda ; Ngan Kenny King-Tai ; Xu Zheng, Aluminum hole filling method using ionized metal adhesion layer.
  3. Al-Shaikh Ayad ; Rosenstein Michael ; Stimson Bradley O. ; Fu Jianming ; Gopalraja Praburam, Apparatus for providing RF return current path control in a semiconductor wafer processing system.
  4. Singhvi Shri ; Rengarajan Suraj ; Ding Peijun ; Yao Gongda, Barrier applications for aluminum planarization.
  5. Guo Ted ; Chen Liang ; Chen Fusen ; Mosely Roderick C., Blanket-selective chemical vapor deposition using an ultra-thin nucleation layer.
  6. Kelley, Charles A.; Krause, Eric J.; Nelson, Cecil H., Bonding a thermoplastic elastomer to a magnesium based metal.
  7. Wang Hougong ; Ding Peijun, Ceramic coated metallic insulator particularly useful in a plasma sputter reactor.
  8. Tomlinson Richard W. (Watertown CT), Cured fibers coated with adhesion promoting additives for ethylene-propylene-nonconjugated diene elastomers.
  9. Ding Peijun ; Xu Zheng ; Fu Jianming, Electrically floating shield in a plasma reactor.
  10. Grimard Dennis S. ; Parkhe Vijay ; Levinstein Hyman ; Chen Fusen ; Chafin Michael G., Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported ther.
  11. Guo Ted ; Chen Liang-Yuh ; Subrahmanyan Suchitra, In-situ capped aluminum plug (CAP) process using selective CVD AL for integrated plug/interconnect metallization.
  12. Mehul B. Naik ; Suketu A. Parikh, Integrated circuit interconnect lines having sidewall layers.
  13. Chen Liang-Yuh ; Guo Ted ; Mosely Roderick Craig, Integrated nitrogen-treated titanium layer to prevent interaction of titanium and aluminum.
  14. Mosely Roderick Craig ; Zhang Hong ; Chen Fusen ; Guo Ted, Low temperature integrated metallization process and apparatus.
  15. Mosely, Roderick Craig; Zhang, Hong; Chen, Fusen; Guo, Ted, Low temperature integrated metallization process and apparatus.
  16. Mosely, Roderick Craig; Zhang, Hong; Chen, Fusen; Guo, Ted; Chen, Liang-Yuh, Low temperature integrated metallization process and apparatus.
  17. Roderick Craig Mosely ; Hong Zhang ; Fusen Chen ; Ted Guo, Low temperature integrated metallization process and apparatus.
  18. Crocker Steven Charles, Magnetron with cooling system for substrate processing system.
  19. Naik Mehul B. ; Guo Ted ; Chen Liang-Yuh ; Mosely Roderick Craig ; Beinglass Israel, Metallization process and method.
  20. Ivo J. Raaijmakers ; Robert S. Busacca ; John Lane, Method and apparatus for enhancing a sputtering target's lifetime.
  21. Nitin Khurana ; Vince Burkhart ; Steve Sansoni ; Vijay Parkhe ; Eugene Tzou, Method and apparatus for sputter etch conditioning a ceramic body.
  22. Somekh Sasson (Los Altos Hills CA) Nulman Jaim (Palo Alto CA) Chang Mei (Cupertino CA), Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer.
  23. Somekh Sasson (Los Altos Hills CA) Nulman Jaim (Palo Alto CA) Chang Mei (Cupertino CA), Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer.
  24. Pavate Vikram ; Hansen Keith J. ; Mori Glen ; Narasimhan Murali ; Ramaswami Seshadri ; Nulman Jaim, Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomalies.
  25. Cheung, Robin; Chen, Liang-Yuh, Method of forming copper interconnects.
  26. Hosokawa,Akihiro; Le,Hien Minh Huu, Multiple target tiles with complementary beveled edges forming a slanted gap therebetween.
  27. Adams Bret W. ; Raaijmakers Ivo, Particle trap in a magnetron sputtering chamber.
  28. Yang Lisa ; Tolia Anish ; Mosely Roderick Craig, Plasma treatment for ex-situ contact fill.
  29. Demaray Richard Ernest ; Hosokawa Akihiro ; Herrera Manuel J., Preparation and bonding of workpieces to form sputtering targets and other assemblies.
  30. Campet Guy (Canejan FRX) Bourrel Maurice (Pau FRX) Delmas Claude (Talence FRX) Portier Joesph (Gradignan FRX) Salardenne Jean (Pessac FRX), Process for the preparation of a target component for cathode sputtering.
  31. Fusen Chen ; Zheng Xu ; Peijun Ding ; Barry Chin ; Ashok Sinha, Processes to improve electroplating fill.
  32. Fu Jianming ; Xu Zheng, Reliable sustained self-sputtering.
  33. Brezoczky Thomas ; Narasimhan Murali, Shield to prevent cryopump charcoal array from shedding during cryo-regeneration.
  34. Demaray Richard E. (Portola Valley CA) Herrera Manuel (San Mateo CA) Berkstresser David E. (Los Gatos CA), Sputtering device and target with cover to hold cooling fluid.
  35. Sang-Ho Yu ; Yonghwa Chris Cha ; Murali Abburi ; Shri Singhvi ; Fufa Chen, Staged aluminum deposition process for filling vias.
  36. Yu, Sang-Ho; Cha, Yonghwa Chris; Abburi, Murali; Singhvi, Shri; Chen, Fufa, Staged aluminum deposition process for filling vias.
  37. Tanaka Yoichiro, Step coverage and overhang improvement by pedestal bias voltage modulation.
  38. Tanaka Yoichiro, Step coverage and overhang improvement by pedestal bias voltage modulation.
  39. Metzner, Craig R.; Kher, Shreyas S.; Han, Shixue, System and method for forming a gate dielectric.
  40. Pavate Vikram ; Hansen Keith J. ; Mori Glen ; Narasimhan Murali ; Ramaswami Seshadri ; Nulman Jaim, Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target.
  41. Pavate Vikram ; Hansen Keith J. ; Mori Glen ; Narasimhan Murali ; Ramaswami Seshadri ; Nulman Jaim, Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target.
  42. Pavate Vikram ; Hansen Keith J. ; Mori Glen ; Narasimhan Murali ; Ramaswami Seshadri ; Nulman Jaim, Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target.
  43. Abburi Murali ; Ramaswami Seshadri, Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life.
  44. Abburi, Murali; Ramaswami, Seshadri, Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life.
  45. Murali Abburi ; Seshadri Ramaswami, Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life.

이 특허를 인용한 특허 (21)

  1. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  2. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  3. Tanase, Yoshiaki; Hosokawa, Akihiro, Electron beam welding of sputtering target tiles.
  4. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
  5. McCabe, Ian A.; Harlow, Jeffrey D., Hot tile sputtering system.
  6. McCabe, Ian A.; Harlow, Jeffrey D., Hot tile sputtering system.
  7. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
  8. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  9. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  10. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
  11. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
  12. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
  13. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  14. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  15. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
  16. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  17. Scheible, Kathleen; Flanigan, Michael Allen; Yoshidome, Goichi; Allen, Adolph Miller; Pavloff, Cristopher M., Process kit and target for substrate processing chamber.
  18. Sawada, Satoru; Inoue, Masato; Oguri, Noriaki; Takeda, Shinichi; Akiyama, Masayoshi; Takei, Taiki, Radiation detection apparatus and radiation imaging system.
  19. Chung, Yun-Mo; Lee, Ki-Yong; Jeong, Min-Jae, Separated target apparatus for sputtering and sputtering method using the same.
  20. Allen, Adolph Miller; Yoon, Ki Hwan; Guo, Ted; Yang, Hong S.; Yu, Sang-Ho, Sputtering target having increased life and sputtering uniformity.
  21. Ritchie, Alan Alexander; Young, Donny; Hong, Ilyoung (Richard); Scheible, Kathleen A.; Kelkar, Umesh, Target for sputtering chamber.
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