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A package structure and method of packaging an interferometric modulator with an integrated desiccant. An interferometric modulator is formed on a transparent substrate. A backplane is joined to the transparent substrate to form a package structure and to encapsulate the interferometric modulator. A

A package structure and method of packaging an interferometric modulator with an integrated desiccant. An interferometric modulator is formed on a transparent substrate. A backplane is joined to the transparent substrate to form a package structure and to encapsulate the interferometric modulator. A desiccant integrated into the backplane or the transparent substrate is provided to absorb moisture within the package.

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What is claimed is: 1. A display device, comprising: a transparent substrate; an interferometric modulator configured to modulate light transmitted through the transparent substrate; and a backplane cover disposed on the interferometric modulator, the backplane cover sealing the interferometric mod

What is claimed is: 1. A display device, comprising: a transparent substrate; an interferometric modulator configured to modulate light transmitted through the transparent substrate; and a backplane cover disposed on the interferometric modulator, the backplane cover sealing the interferometric modulator within a package between said transparent substrate and the backplane cover, wherein the backplane cover comprises a material that includes an integrated desiccant and wherein the integrated desiccant is configured to absorb moisture within the package. 2. The display device of claim 1, wherein the backplane cover comprises a polymer and a molecular sieve or a silica gel. 3. The display device of claim 1, wherein the backplane cover comprises a desiccant, a channeling agent and a polymer. 4. The display device of claim 1 further comprising a spray coat of desiccant on a surface of the backplane cover. 5. The display device of claim 1, wherein a surface of the backplane comprises recessed areas and wherein the recessed areas comprise desiccant. 6. The display device of claim 1, wherein the desiccant is a zeolite. 7. The display device of claim 1, wherein the desiccant is calcium oxide. 8. The display device of claim 1, wherein the transparent substrate has an integrated desiccant configured to absorb moisture within the package. 9. A method of manufacturing a display device, comprising: providing a transparent substrate; forming an interferometric modulator on the transparent substrate; joining a backplane to the transparent substrate to form a package, wherein the package encapsulates the interferometric modulator; and providing within the package a desiccant contained within a membrane. 10. The method of claim 9, wherein the membrane is adhered to the backplane. 11. The method of claim 9, wherein the membrane is adhered to the transparent substrate. 12. The method of claim 9, wherein the membrane is formed of polyethylene. 13. The method of claim 9, wherein the desiccant is selected from a group consisting of zeolites, calcium sulfate, calcium oxide, silica gel, molecular sieves, surface adsorbents, bulk adsorbents, chemical reactants, and indicating silica gel. 14. A display device, comprising: a package comprising a transparent substrate, a backplane, and a seal applied between the backplane and the transparent substrate; an electronic display configured to modulate light transmitted through the transparent substrate, wherein the electronic display is formed on the transparent substrate and positioned between the transparent substrate and the backplane; and a desiccant contained within a pouch adhered to a surface inside the package, wherein the desiccant is configured to absorb moisture within the package. 15. The display device of claim 14, wherein the desiccant is adhered to an interior surface of the backplane. 16. The display device of claim 14, wherein the desiccant is adhered to the transparent substrate. 17. The display device of claim 14, wherein the pouch comprises polyethylene. 18. A display device, comprising: a transmitting means for transmitting light therethrough; a modulating means configured to modulating light transmitted through the transmitting means, wherein the modulating means comprises an interferometric modulator; an encapsulating means for sealing the modulating means within a package between the transmitting means and the encapsulating means; and a moisture absorbing means integrated into either the transmitting means or the encapsulating means, the moisture absorbing means configured to absorb moisture within the package. 19. The display device of claim 18, wherein the moisture absorbing means is selected from a group consisting of zeolites, calcium sulfate, calcium oxide, silica gel, molecular sieves, surface adsorbents, bulk adsorbents, chemical reactants, and indicating silica gel. 20. The display device of claim 18, wherein the encapsulating means is formed of a material comprising the moisture absorbing means. 21. The display device of claim 18, wherein at least a portion of the encapsulating means is formed of a material comprising the moisture absorbing means. 22. A display device, comprising: a transparent substrate; an electronic display configured to modulate light transmitted through the transparent substrate, wherein the electronic display is formed on the transparent substrate; a backplane joined to the transparent substrate to form a package, wherein the electronic display is positioned in the package between the backplane and the transparent substrate; at least one pouch in the package; and a desiccant within the at least one pouch, the desiccant being configured to absorb moisture within the package. 23. The display device of claim 22, wherein the at least one pouch is adhered to the backplane. 24. The display device of claim 22, wherein the at least one pouch is adhered to the transparent substrate. 25. The display device of claim 22, wherein the at least one pouch comprises two pouches. 26. The display device of claim 25, wherein each of the two pouches contains a different type of desiccant. 27. A method of manufacturing a backplane, comprising: providing a backplane having a recessed area on a surface, wherein the recessed area is created by applying a mask to the surface of the backplane and etching an area of the backplane exposed by the mask; applying desiccant to the recessed area on the surface of the backplane such that the desiccant is integrated into the backplane while the mask is on the surface; providing a transparent substrate having an interferometric modulator formed thereon; and joining the backplane to the transparent substrate to form a package. 28. The method of claim 27, wherein etching is sandblasting. 29. The method of claim 27, wherein etching is wet etching.