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특허 상세정보

Heat dissipation structure for electronic devices

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20   
미국특허분류(USC) 361/695; 361/690; 361/694; 361/714; 174/016.1; 174/016.3; 165/080.3; 165/104.33
출원번호 UP-0819150 (2007-06-25)
등록번호 US-7554805 (2009-07-09)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Muncy, Geissler, Olds & Lowe, PLLC
인용정보 피인용 횟수 : 6  인용 특허 : 12
초록

The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the he...

대표
청구항

What is claimed is: 1. A heat-dissipation structure for electronic devices comprising: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in said accommodation space, contacting said heat-generating element and conducting heat generated by said heat-generating element; and an electric fan arranged outside said housing, wherein said housing has an opening corresponding to said heat conductor, and a part of said heat conductor extends through said opening to emerge from said housing and is...

이 특허에 인용된 특허 (12)

  1. Chen,Richard. Air shroud installed on a circuit board. USP2008097423872.
  2. Lord,Charles. Compact electronics plenum. USP2006047027300.
  3. Duxbury, Guy A.; Mistry, Balwantrei V.; Lentz, Donald J.. Component cooling in electronic devices. USP2004126836409.
  4. Schultz, Craig L.; Petit, Todd Micheal; Oen, Joshua T.. EMI shield for transceiver. USP2005126980439.
  5. Hashimoto Suzushi,JPX ; Ito Tomio,JPX. Heat sink devices for use in electronic devices. USP2001106301115.
  6. Miyahara, Masaharu; Mehara, Koji; Yoshida, Shinji. Heat sink unit and electronic apparatus using the same. USP2003036529375.
  7. Bright, Edward John; Costello, Brian Patrick; Shiffler, James Charles; Stahl, Daniel Eugene. Pluggable electronic module and receptacle with heat sink. USP2004116816376.
  8. Ishigami Takahiro,JPX ; Tanifuji Hitoshi,JPX ; Kikkawa Yoshihiko,JPX ; Iwasaki Yoshihiro,JPX ; Suzuki Hiroaki,JPX ; Tanikawa Makoto,JPX ; Mori Masahito,JPX ; Kawasaki Isao,JPX. Power transistor module packaging structure. USP1999085946192.
  9. Meadowcroft,David; Mitchell,Ian; Reilly,Declan. Temperature control of heat-generating devices. USP2008017317617.
  10. Bolle,Cristian A; Hodes,Marc Scott; Kolodner,Paul Robert. Thermal management for shielded circuit packs. USP2007087254034.
  11. Chengalva,Suresh K.; Oberlin,Gary E.; Walsh,Matthew R.. Thermally enhanced electronic module with self-aligning heat sink. USP2006026999317.
  12. Bright, Edward John; Costello, Brian Patrick. Transceiver module assembly ejector mechanism. USP2004066749448.