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Low cost high throughput processing platform 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65H-001/00
출원번호 UP-0622361 (2007-01-11)
등록번호 US-7563068 (2009-07-29)
발명자 / 주소
  • Niewmierzycki, Leszek
  • Barker, David
  • Devine, Daniel J.
  • Kuhlman, Michael
  • Pakulski, Ryan
  • Shan, Hongqing
  • Zucker, Martin
출원인 / 주소
  • Mattson Technology, Inc.
대리인 / 주소
    Pritzkau Patent Group, LLC
인용정보 피인용 횟수 : 9  인용 특허 : 35

초록

As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces betwe

대표청구항

What is claimed is: 1. In a workpiece processing system in which a plurality of workpieces are movable to and from a process chamber arrangement, said process chamber arrangement using at least two side-by-side, first and second process stations each of which is configured for executing a treatment

이 특허에 인용된 특허 (35)

  1. Kojima, Masayuki; Torii, Yoshimi; Hunabashi, Michimasa; Suko, Kazuyuki; Yamada, Takashi; Kuroiwa, Keizo; Nojiri, Kazuo; Kawasaki, Yoshinao; Sato, Yoshiaki; Fukuyama, Ryooji; Kawahara, Hironobu, Apparatus for processing samples.
  2. Uratani, Takafumi, Arm operation mechanism and industrial robot incorporating the same.
  3. Wakabayashi, Takenori; Nii, Satoshi; Kamitani, Masashi; Taniguchi, Michio, Conveying device.
  4. Bacchi Paul ; Filipski Paul S., Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities.
  5. Kroeker Tony R. ; Mooring Benjamin W. ; Bright Nicolas J., Dual sided slot valve and method for implementing the same.
  6. Tepman Avi, Front end vacuum processing environment.
  7. Altwood Allen ; Colborne Kelly ; Fairbairn Kevin ; Lane Christopher ; Ponnekanti Hari K. ; Sundar Satish, Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding.
  8. Balter Valetin (Cupertino CA), Mechanism for feedthrough of rotary and/or linear motions to a sealed chamber.
  9. Robert J. C. Mitchell GB; Keith D. Relleen GB; John Ruffell, Method and apparatus for processing wafers.
  10. Bauser Elisabeth (Ludwigsburg DEX) Frik Martina (Nuertingen DEX) Lchner Karl S. (Gerlingen DEX) Schmidt Laurenz (Stuttgart DEX), Method of growing epitaxial layers from a liquid phase.
  11. Larsen, Grant Kenji, Methods and apparatus for high speed object handling.
  12. Cho Gyung Su,KRX, Multi-substrate feeder for semiconductor device manufacturing system.
  13. Edwards Richard C. ; Zielinski Marian, Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor.
  14. Uehara Akira (Kanagawa JPX) Hijikata Isamu (Kanagawa JPX) Minato Mitsuaki (Kanagawa JPX), Object handling devices.
  15. Keiichi Tanaka JP; Shinsuke Asao JP; Masahito Ozawa JP; Masaki Sohma JP, Process system with transfer unit for object to be processed.
  16. Mitomi Yoshimichi (Wadasaki JPX), Reactive ion etching appartus.
  17. Coomer, Stephen D.; Kopacz, Stanislaw; Reynolds, Glyn; Lombardi, Michael James; Visconti, Todd Michael, Reduced edge contact wafer handling system and method of retrofitting and using same.
  18. Savage, Richard N.; Menagh, Frank S.; Carvalheira, Helder R.; Troiani, Philip A.; Cossentine, Dan L.; Vaughan, Eric R.; Mayer, Bruce E., Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system.
  19. Kevin Thomas Ryan ; Peter Lawrence Kellerman ; Frank Sinclair ; Ernest Everett Allen ; Roger Bradford Fish, Serial wafer handling mechanism.
  20. Bacchi Paul ; Filipski Paul S., Single and dual end effector, multiple link robot arm systems having triaxial drive motors.
  21. Suzuki, Takeo; Ogasawara, Masaru; Omata, Toshio, Substrate delivering robot.
  22. Beaulieu, David R.; Adams, Douglas R.; Drew, Mitchell; Van Der Meulen, Peter, Substrate processing apparatus with independently configurable integral load locks.
  23. Hofmeister Christopher A., Substrate processing apparatus with vertically stacked load lock and substrate transport robot.
  24. Tuan T. Ha, Substrate transport apparatus.
  25. Gilchrist, Ulysses, Substrate transport apparatus with multiple independent end effectors.
  26. Van Der Meulen, Peter, System for transporting substrates.
  27. Tabrizi, Farzad; Kitazumi, Barry; Barker, David A.; Setton, David A.; Niewmierzycki, Leszek; Kuhlman, Michael J., Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing.
  28. Tabrizi Farzad ; Kitazumi Barry ; Barker David A. ; Setton David A. ; Niewmierzycki Leszek ; Kuhlman Michael J., Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber.
  29. Kroeker Tony R., Three chamber load lock apparatus.
  30. Franklin, Timothy J.; Marohl, Dan A., Transfer chamber with side wall port.
  31. Edwards Richard C., Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor.
  32. Miller Richard F. (10905 Eureka St. Boca Raton FL 33428), Ultraclean robotic material transfer method.
  33. Davis Cecil J. (Greenville TX) Matthews Robert (Plano TX) Hildenbrand Randall C. (Richardson TX), Vacuum processing system.
  34. Hertel Richard J. (Bradford MA) Delforge Adrian C. (Rockport MA) Mears Eric L. (Rockport MA) MacIntosh Edward D. (Gloucester MA) Jennings Robert E. (Nethuen MA) Bhargava Akhil (Reading MA), Wafer transfer system.
  35. Kinnard, David William; Richardson, Daniel, Wafer transport apparatus.

이 특허를 인용한 특허 (9)

  1. Kim, Sun-Ho; Nam, Ki-Hoon; Earmme, Tae-Min; Heo, Seok; Hwang, Jae-Chul, Link structure.
  2. Klomp, Albert Jan Hendrik; Hoogkamp, Jan Frederik; Vugts, Josephus Cornelius Johannes Antonius; Livesey, Robert Gordon; Franssen, Johannes Hendrikus Gertrudis, Load lock and method for transferring objects.
  3. Niewmierzycki, Leszek, Low cost high throughput processing platform.
  4. Hosek, Martin; Hofmeister, Christopher, Robot and adaptive placement system and method.
  5. Hosek, Martin; Hofmeister, Christopher, Robot and adaptive placement system and method.
  6. Hosek, Martin; Hofmeister, Christopher; Poole, Dennis, Robot and adaptive placement system and method.
  7. Caveney, Robert T.; Krishnasamy, Jayaraman; Gilchrist, Ulysses; Drew, Mitchell; Moura, Jairo T., Substrate processing apparatus.
  8. Gilchrist, Ulysses; Caveney, Robert T.; Krishnasamy, Jayaraman; Drew, Mitchell; Moura, Jairo T., Substrate processing apparatus.
  9. Gilchrist, Ulysses; Caveney, Robert T.; Krishnasamy, Jayaraman; Drew, Mitchell; Moura, Jairo T., Substrate processing apparatus.
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