Embedding memory between tile arrangement of a configurable IC
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-025/00
H03K-019/177
출원번호
UP-0757982
(2007-06-04)
등록번호
US-7564261
(2009-07-29)
발명자
/ 주소
Schmit, Herman
Redgrave, Jason
출원인 / 주소
Tabula Inc.
대리인 / 주소
Adeli & Tollen LLP
인용정보
피인용 횟수 :
22인용 특허 :
137
초록▼
Some embodiments of the invention provide a configurable IC that includes several configurable computational tiles and several memory tiles. These tiles are arranged in a particular tile arrangement. Each computational tile has a set of configurable logic circuits for configurably performing a plura
Some embodiments of the invention provide a configurable IC that includes several configurable computational tiles and several memory tiles. These tiles are arranged in a particular tile arrangement. Each computational tile has a set of configurable logic circuits for configurably performing a plurality of computations and a set of configurable routing circuits. The routing circuits of the tiles configurably route signals between configurable logic circuits. The configurable IC also has several memory arrays for storing data on which the logic circuit perform computation. The memory arrays are embedded in the tile arrangement between two sets of memory tiles, where each set of memory tiles includes a set of routing circuits. In this IC, at least a first memory tile has the same set of configurable routing circuits as at least a second computational tile.
대표청구항▼
We claim: 1. An integrated circuit (IC) comprising: a) a plurality of tiles arranged in a particular tile arrangement, wherein said tiles comprise a plurality of memory tiles and a plurality of computational tiles, wherein at least one particular computational tile comprises a set of configurable i
We claim: 1. An integrated circuit (IC) comprising: a) a plurality of tiles arranged in a particular tile arrangement, wherein said tiles comprise a plurality of memory tiles and a plurality of computational tiles, wherein at least one particular computational tile comprises a set of configurable input select interconnects; and b) a plurality of memory arrays for storing data, each memory array embedded in the tile arrangement between two sets of memory tiles, wherein each of said two sets of memory tiles comprises a set of configurable input select interconnects that correspond to the set of configurable input select interconnects of said particular computational tile, wherein a subset of the set of configurable input select interconnects of each memory tile forms at least part of a port for accessing at least one memory array. 2. The IC of claim 1, wherein each of the plurality of memory tiles includes a plurality of configurable input select interconnects, wherein each of a plurality of configurable input select interconnects is for receiving a plurality of signals and supplying a set of the received signals to the memory array of the particular memory tile, and wherein each of a plurality of memory tiles has the same set of configurable input select interconnects as said particular computational tile. 3. The IC of claim 1 further comprising a routing network comprising configurable routing circuits in said plurality of tiles for routing signals between logic circuits of said plurality of tiles and between logic circuits and memory arrays, wherein the embedded memory arrays do not create a discontinuity in the routing network. 4. The IC of claim 3, wherein the routing network in a section of the IC that contains a memory array embedded in a memory tile is the same as the routing network in a section of the IC that does not contain any memory arrays. 5. An electronic device comprising an integrated circuit (IC), said IC comprising: a) a plurality of tiles arranged in a particular tile arrangement, wherein said tiles comprise a plurality of memory tiles and a plurality of computational tiles, wherein at least one particular computational tile comprises a set of configurable input select interconnects; and b) a plurality of memory arrays for storing data, each memory array embedded in the tile arrangement between two sets of memory tiles, wherein each of said two sets of memory tiles comprises a set of configurable input select interconnects that correspond to the set of configurable input select interconnects of said particular computational tile, wherein a subset of the set of configurable input select interconnects of each memory tile forms at least part of a port for accessing at least one memory array. 6. The electronic device of claim 5, wherein each memory tile comprises a plurality of configurable input select interconnects, each input select interconnect for receiving a plurality of signals and supplying a set of the received signals to the memory array of the particular memory tile, and wherein each of a plurality of memory tiles has the same set of configurable input select interconnects as a plurality of computational tiles of said plurality of tiles. 7. The electronic device of claim 5, wherein the IC further comprises a routing network comprising configurable routing circuits in said plurality of tiles for routing signals between logic circuits of said plurality of tiles and between logic circuits and memory arrays, wherein the embedded memory arrays do not create a discontinuity in the routing network. 8. The electronic device of claim 7, wherein the routing network in a section of the IC that contains a memory array embedded in a memory tile is the same as the routing network in a section that does not contain any memory arrays. 9. An integrated circuit (IC) comprising: a) a plurality of computational tiles and a plurality of memory tiles, said pluralities of tiles arranged in a tile arrangement, wherein a particular computational tile comprises a set of configurable routing circuits; and b) a plurality of memory arrays for storing data that serve as variables in the computations of the plurality of computational tiles, each memory array embedded in the tile arrangement between two sets of memory tiles, each memory tile comprising a set of configurable routing circuits; wherein at least a first memory tile has the same set of configurable routing circuits as the particular computational tile; and wherein a particular configurable routing circuit within the particular computational tile directly connects to a configurable input select interconnect within the particular computational tile and to a configurable circuit within at least one other tile. 10. The IC of claim 9, wherein each computational tile further comprises a plurality of configurable input select interconnects, each configurable input select interconnect for receiving a plurality of signals and supplying a set of received signals to a logic circuit in the particular computational tile; wherein each memory tile comprises a plurality of configurable input select interconnects, each input select interconnect for receiving a plurality of signals and supplying a set of the received signals to the memory array adjacent to the particular memory tile; and wherein the first memory tile has the same set of configurable input select interconnects as the first computational tile. 11. The IC of claim 9 further comprising a routing network comprising at least some of said configurable routing circuits of said plurality of computational tiles and said plurality of memory tiles, wherein said routing network is for routing signals between logic circuits and between logic circuits and memory arrays, wherein the embedded memory arrays do not create a discontinuity in the routing network. 12. The IC of claim 9, wherein each set of memory tiles includes a plurality of configurable input select interconnects that provide signals to the memory array and wherein the configurable circuits of at least one of the two sets of memory tiles form at least part of a port for accessing the memory array. 13. An electronic device comprising an integrated circuit (IC), said IC comprising: a) a plurality of computational tiles and a plurality of memory tiles, said pluralities of tiles arranged in a tile arrangement, wherein a particular computational tile comprises a set of configurable routing circuits; and b) a plurality of memory arrays for storing data that serve as variables in the computations of the plurality of computational tiles, each memory array embedded in the tile arrangement between two sets of memory tiles, each memory tile comprising a set of configurable routing circuits; wherein at least a first memory tile has the same set of configurable routing circuits as the particular computational tile; and wherein a particular configurable routing circuit within the particular computational tile directly connects to a configurable input select interconnect within the particular computational tile and to a configurable circuit within at least one other tile. 14. The electronic device of claim 13, wherein each computational tile further comprises a plurality of configurable input select interconnects, each configurable input select interconnect for receiving a plurality of signals and supplying a set of received signals to a logic circuit in the particular computational tile; wherein each memory tile comprises a plurality of configurable input select interconnects, each configurable input select interconnect for receiving a plurality of signals and supplying a set of the received signals to the memory array adjacent to the particular memory tile; and wherein the first memory tile has the same set of configurable input select interconnects as the first computational tile. 15. The electronic device of claim 13, wherein the IC further comprises a routing network comprising at least some of said configurable routing circuits of said plurality of computational tiles and said plurality of memory tiles, wherein said routing network is for routing signals between logic circuits and between logic circuits and memory arrays, wherein the embedded memory arrays do not create a discontinuity in the routing network. 16. The electronic device of claim 13, wherein each set of memory tiles comprises a plurality of configurable input select interconnects that provide signals to the memory array and wherein the configurable circuits of at least one of the two sets of memory tiles form at least part of a port for accessing the memory array. 17. The IC of claim 2, wherein a first subset of said plurality of configurable input select interconnects of each of said two sets of memory tiles provide at least part of an address bus of said memory port. 18. The IC of claim 17, wherein a second subset of said plurality of configurable input select interconnects of each of said two sets of memory tiles provide at least part of a data input bus of said memory port. 19. The IC of claim 1, wherein two ports that both access the same memory array operate on two different clock domains.
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이 특허에 인용된 특허 (137)
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