Semiconductor device and method of manufacturing the same
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0489625
(2006-07-20)
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등록번호 |
US-7566973
(2009-08-05)
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우선권정보 |
JP-2005-213593(2005-07-25) |
발명자
/ 주소 |
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출원인 / 주소 |
- NEC Electronics Corporation
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
0 인용 특허 :
2 |
초록
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The method of manufacturing a semiconductor device according to the present invention includes: forming an interconnect trench in an insulating film formed on a semiconductor substrate (S100); forming a barrier metal layer on the whole surface of the insulating film (S102); forming a copper layer on
The method of manufacturing a semiconductor device according to the present invention includes: forming an interconnect trench in an insulating film formed on a semiconductor substrate (S100); forming a barrier metal layer on the whole surface of the insulating film (S102); forming a copper layer on the whole surface of the barrier metal layer so that the copper layer is embedded in the interconnect trench (S104); removing the copper layer outside the interconnect trench by polishing under a condition that the barrier metal layer is left on the surface of the insulating film (S106); selectively forming a cap metal layer on the copper layer formed in the interconnect trench after the step of removing the copper layer by polishing (S108); and flattening the cap metal layer by polishing (S110).
대표청구항
▼
What is claimed is: 1. A semiconductor device, including: a semiconductor substrate; an insulating film formed on said semiconductor substrate; an interconnect which is formed in said insulating film, and includes a copper layer with a plurality of orientations; and a cap metal layer formed on a su
What is claimed is: 1. A semiconductor device, including: a semiconductor substrate; an insulating film formed on said semiconductor substrate; an interconnect which is formed in said insulating film, and includes a copper layer with a plurality of orientations; and a cap metal layer formed on a surface of said copper layer, the cap metal layer having a final layer thickness of 5 to 25 nm, wherein an RMS value of a surface roughness of said cap metal layer is 10 nm or less. 2. The semiconductor device according to claim 1, wherein said cap metal layer has a flattened surface. 3. The semiconductor device according to claim 1, wherein said interconnect further includes a barrier metal layer, and said cap metal layer is formed with a material different from that of said barrier metal layer. 4. The semiconductor device according to claim 2, wherein said interconnect further includes a barrier metal layer, and said cap metal layer is formed with a material different from that of said barrier metal layer. 5. The semiconductor device according to claim 1, wherein said cap metal layer is formed with an amorphous material. 6. The semiconductor device according to claim 2, wherein said cap metal layer is formed with an amorphous material. 7. The semiconductor device according to claim 3, wherein said cap metal layer is formed with an amorphous material. 8. The semiconductor device according to claim 1, wherein an upper surface of said cap metal layer is formed to substantially be flat with that of said insulating film. 9. The semiconductor device according to claim 2, wherein an upper surface of said cap metal layer is formed to substantially be flat with that of said insulating film. 10. The semiconductor device according to claim 3, wherein an upper surface of said cap metal layer is formed to substantially be flat with that of said insulating film. 11. The semiconductor device according to claim 4, wherein an upper surface of said cap metal layer is formed to substantially be flat with that of said insulating film. 12. The semiconductor device according to claim 5, wherein an upper surface of said cap metal layer is formed to substantially be flat with that of said insulating film. 13. The semiconductor device according to claim 6, wherein an upper surface of said cap metal layer is formed to substantially be flat with that of said insulating film. 14. The semiconductor device according to claim 7, wherein an upper surface of said cap metal layer is formed to substantially be flat with that of said insulating film. 15. The semiconductor device according to claim 1, wherein the RMS value of the surface roughness of said cap metal layer is 5 nm or less. 16. The semiconductor device according to claim 1, wherein the RMS value of the surface roughness of said cap metal layer is 2 nm or less. 17. The semiconductor device according to claim 1, wherein the RMS value of the surface roughness of said cap metal layer is 2-5 nm. 18. The semiconductor device according to claim 1, wherein a via resistance R due to the cap metal layer is determined by R=ρ×t/S, where ρ is the resistance rate of the cap metal, t is the film thickness of the cap metal and S is a base area of the via. 19. The semiconductor device according to claim 17, wherein t=R×S/ρ, Δt=ΔR×S/ρ, and ΔR=0.5Ω, S=Π(50 nm)2, ρ=50 μΩcm, and Δt=7.9 nm. 20. The semiconductor device according to claim 1, wherein a variation of the layer thickness of the cap metal layer is 7.9 nm or less.
이 특허에 인용된 특허 (2)
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Cabral, Jr.,Cyril; Chiras,Stefanie R.; Cooper,Emanuel; Deligianni,Hariklia; Kellock,Andrew J.; Rubino,Judith M.; Tsai,Roger Y., Electroplated CoWP composite structures as copper barrier layers.
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Dubin Valery M. (Cupertino CA) Schacham-Diamand Yosi (Ithaca NY) Zhao Bin (Irvine CA) Vasudev Prahalad K. (Austin TX) Ting Chiu H. (Saratoga CA), Use of cobalt tungsten phosphide as a barrier material for copper metallization.
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