초록 ▼

A semiconductor package includes a support plate made of an electrically non-conducting material. Electrical connection vias are formed outside a chip fixing region provided on the front face of the support plate. Electrical connection wires connect pads on a front of the chip to pads on the front o

A semiconductor package includes a support plate made of an electrically non-conducting material. Electrical connection vias are formed outside a chip fixing region provided on the front face of the support plate. Electrical connection wires connect pads on a front of the chip to pads on the front of the support plate associated with the electrical connection vias. The front face of the support plate is further provided with at least one intermediate front layer made of a thermally conducting material extending at least partly below the chip. The rear face of the support plate is provided with at least one rear layer made of a thermally conducting material extending at least partly opposite the front layer. The front and rear layers are connected by vias made of a thermally conducting material that fills through-holes made through the plate.

대표청구항 ▼

What is claimed is: 1. A semiconductor package, comprising: a support plate made of an electrically non-conducting material and having electrical pads provided on a front face of the support plate outside of a chip fixing region, with electrical connection vias associated with the electrical pads;

What is claimed is: 1. A semiconductor package, comprising: a support plate made of an electrically non-conducting material and having electrical pads provided on a front face of the support plate outside of a chip fixing region, with electrical connection vias associated with the electrical pads; an electrically conductive front thermal layer on the front face of the support plate which covers the chip fixing region, the electrically conductive front thermal layer being made of a thermally conducting material and the electrical pads on the front face being positioned distant from a periphery of the electrically conductive front thermal layer; an electrically conductive rear thermal layer on a rear face of the support plate positioned opposite the electrically conductive front thermal layer, the electrically conductive rear thermal layer being and made of a thermally conducting material; electrically conductive thermal vias interconnecting the front and rear thermal layers through the support plate, the thermal vias being made of a thermally conducting material; an integrated-circuit chip having bonding pads and being attached by an adhesive to the electrically conductive front thermal layer at the chip fixing region, wherein the electrically conductive front thermal layer extends beyond a periphery of the chip; a retaining ring attached to the electrically conductive front thermal layer and positioned to surround the periphery of the chip at a certain distance therefrom leaving an encircling peripheral region of the electrically conductive front thermal layer to which the integrated circuit is attached outside of the retaining ring; a first bonding wire electrically connecting a first bonding pad of the integrated circuit chip to one of the electrical pads on the front face of the support plate; a second bonding wire electrically connecting a second bonding pad of the integrated circuit chip to the encircling peripheral region of the electrically conductive front thermal layer; wherein the adhesive used in attaching the integrated circuit chip which spreads out on the front face of the support plate is retained by the retaining ring from spreading to touch the first and second bonding wires. 2. The package of claim 1 further comprising at least one ball made of an electrically and thermally conductive material affixed to the electrically conductive rear thermal layer. 3. The package of claim 2 wherein the ball is also electrically conducting. 4. The package of claim 1 further comprising an organic front finish layer overlying the electrically conductive front thermal layer on the front surface. 5. The package of claim 1 further comprising an organic rear finish layer covering the electrically conductive rear thermal layer on the rear surface. 6. The package of claim 5 further comprising at least one ball made of an electrically and thermally conductive material affixed to the electrically conductive rear thermal layer and passing through the organic rear finish layer. 7. The package of claim 1 further comprising an encapsulant structure applied over the front surface of the support plate to encapsulate the chip fixing region and cover both the integrated-circuit chip and the retaining ring. 8. A semiconductor package, comprising: an insulating support plate having electrical pads provided on a front face of the support plate outside of a chip fixing region, with electrical connection vias associated with the electrical pads; an electrically and thermally conductive front layer on the front face of the support plate which covers the chip fixing region, wherein the electrical pads on the front face are positioned distant from a periphery of the electrically conductive front thermal layer; an electrically and thermally conductive rear layer on a rear face of the support plate positioned opposite the electrically and thermally conductive front layer; electrically and thermally conductive vias interconnecting the front and rear layers through the support plate; an integrated-circuit chip having bonding pads and being attached by an adhesive to the front layer at the chip fixing region; a retaining ring attached to the front layer and positioned to surround the periphery of the chip at a certain distance therefrom leaving an encircling peripheral region of the front layer to which the integrated circuit is attached located outside of the retaining ring; a first bonding wire electrically connecting a first bonding pad of the integrated circuit chip to one of the electrical pads on the front face of the support plate; a second bonding wire electrically connecting a second bonding pad of the integrated circuit chip to the encircling peripheral region of the front layer; wherein the retaining ring retains the adhesive used in attaching the integrated circuit chip from spreading out on the front face of the support plate to contact the first and second bonding wires. 9. The package of claim 8 further comprising at least one ball made of an electrically and thermally conductive material affixed to the rear layer. 10. The package of claim 9 wherein the ball is also electrically conducting. 11. The package of claim 8 further comprising an organic front finish layer overlying the front layer on the front surface. 12. The package of claim 8 further comprising an organic rear finish layer covering the rear layer on the rear surface. 13. The package of claim 12 further comprising at least one ball made of an electrically and thermally conductive material affixed to the rear layer and passing through the organic rear finish layer. 14. The package of claim 8 further comprising an encapsulant structure applied over the front surface of the support plate to encapsulate the chip fixing region and cover both the integrated-circuit chip and the retaining ring.