초록 ▼

An electronic device with an airflow guiding duct includes a chassis, an airflow guiding duct, and a top cover. The chassis includes a bottom wall and a sidewall perpendicular to the bottom wall. A circuit board is mounted on the bottom wall. A pair of securing members protrudes from a top of the si

An electronic device with an airflow guiding duct includes a chassis, an airflow guiding duct, and a top cover. The chassis includes a bottom wall and a sidewall perpendicular to the bottom wall. A circuit board is mounted on the bottom wall. A pair of securing members protrudes from a top of the sidewall. The airflow guiding duct includes a top wall and a plurality of securing slots defined in the top wall corresponding to the securing members, for the securing members being lockingly engaging in the securing slots, thereby limiting movement of the airflow guiding duct in directions parallel to the circuit board. The cover is mounted on the chassis and abuts against the top wall of the airflow guiding duct, for limiting movement of the airflow guiding duct in a direction perpendicular to the circuit board.

대표청구항 ▼

What is claimed is: 1. An electronic device, comprising: a chassis comprising a bottom wall and a sidewall perpendicular to the bottom wall, a circuit board mounted on the bottom wall, a plurality of securing members protruding from a top of the sidewall in a direction perpendicular to the circuit

What is claimed is: 1. An electronic device, comprising: a chassis comprising a bottom wall and a sidewall perpendicular to the bottom wall, a circuit board mounted on the bottom wall, a plurality of securing members protruding from a top of the sidewall in a direction perpendicular to the circuit board; and an airflow guiding duct configured for covering a heat dissipating module mounted on the circuit board, the airflow guiding duct comprising a substantially rectangular base, an expanded portion protruding from a front end of the base, and a smaller portion protruding from a rear end of the base, a first opening defined in the smaller portion configured for allowing air to flow into the airflow guiding duct, a second opening configured for allowing air to flow into the airflow guiding duct defined in a corner of the rectangular base adjacent to the smaller portion, a third opening defined in the expanded portion facing the heat dissipating holes in the sidewall of the chassis and configured for allowing air to flow out of the airflow guiding duct. 2. The electronic device as described in claim 1, wherein the airflow guiding duct comprises a top wall and a plurality of securing slots defined in the top wall, the securing members are lockingly engaged in the securing slots, and thereby limit movement of the airflow guiding duct in directions parallel to the motherboard. 3. The electronic device as described in claim 2, wherein a main flange is perpendicularly bent from a top edge of the sidewall of the chassis, a secondary flange perpendicularly extends down from a side edge of the main flange, and a supporting flange parallel to the main flange extends out from a bottom edge of the secondary flange, the securing members perpendicularly protrude up from the supporting flange. 4. The electronic device as described in claim 3, wherein a plurality of receiving slots is defined in the secondary flange at a joint of the main flange and the supporting flange, and a plurality of guiding tabs protrudes toward the sidewall of the chassis from an outer edge of the top wall of the airflow guiding duct, for inserting in the receiving slots of the sidewall thereby guiding the airflow guiding duct to be mounted in the chassis. 5. The electronic device as described in claim 2, further comprises a cover mounted on the chassis and abutting against the top wall of the airflow guiding duct, for limiting movement of the airflow guiding duct in a direction perpendicular to the circuit board. 6. An electronic device, comprising: a chassis comprising a bottom wall and a sidewall perpendicular to the bottom wall, a circuit board mounted on the bottom wall, at least one receiving slot defined in the side wall, and a main flange is perpendicularly bent from a top edge of the sidewall of the chassis, a secondary flange perpendicularly extends down from a side edge of the main flange, and a supporting flange parallel to the main flange extends out from a bottom edge of the secondary flange, a plurality of securing members perpendicularly protrude up from the supporting flange; an airflow guiding duct configured for covering heat dissipating modules mounted on the circuit board, the airflow guiding duct including a top wall and a plurality of securing slots defined in the top wall corresponding to the securing members, the airflow guiding duct including at least one guiding tab extending in a direction perpendicular to the motherboard; wherein the at least one guiding tab is inserted in the at least one receiving slot of the sidewall in a direction parallel to the circuit board so as to position the airflow guiding duct in the chassis, and the securing members are engaged with the securing slots of the sidewall; and a cover seating on the chassis and abutting against the top wall of the airflow guiding duct, for securing the airflow guiding duct in the chassis. 7. The electronic device as described in claim 6, wherein the at least one receiving slot is defined in the secondary flange at a joint of the main flange and the supporting flange, and the at least one guiding tab corresponding to the at least one receiving slot protrudes toward the sidewall of the chassis from an outer edge of the top wall of the airflow guiding duct. 8. The electronic device as described in claim 6, wherein the airflow guiding duct comprises a substantially rectangular base, an expanded portion protruding from a front end of the base, and a smaller portion protruding from a rear end of the base, the base and the smaller portion respectively define an opening configured for air flowing into the airflow guiding duct, the expanded portion defines a third opening facing the heat dissipating boles in the sidewall of the chassis configured for air flowing out of the airflow guiding duct. 9. The electronic device as described in claim 8, wherein a dividing wall extends down from a middle of the top wall of the expanded portion, for dividing the third opening into two sections.