초록 ▼

Systems and methods for cooling electronic components are disclosed herein. Certain aspects of the invention are directed toward an electronic system that includes an electronic module having a container with at least two openings and multiple manufactured electronic components carried in the contai

Systems and methods for cooling electronic components are disclosed herein. Certain aspects of the invention are directed toward an electronic system that includes an electronic module having a container with at least two openings and multiple manufactured electronic components carried in the container. The electronic module is configured to operate reliably at or above a maximum manufacturer's suggested first ambient temperature while still maintaining the first suggested operating core temperature of the internal electronic module. The system further includes a duct in fluid communication with at least one of the openings and an exterior flow device coupled to the duct. The flow device is configured to produce a pressure differential between an interior and an exterior of the container to cause high velocity air to flow through the container such that the electronic module can be operated in the selected mode at a second ambient temperature greater than the maximum first manufacturer's suggested ambient temperature.

대표청구항 ▼

We claim: 1. An electronic system, comprising: a support; an electronic module having a housing, multiple heat producing electronic components in the housing and an internal cooling system in the housing that enables air to move in the housing at up to a first velocity relative to the electronic co

We claim: 1. An electronic system, comprising: a support; an electronic module having a housing, multiple heat producing electronic components in the housing and an internal cooling system in the housing that enables air to move in the housing at up to a first velocity relative to the electronic components, the electronic components having individual maximum core operating temperature limits within the housing, the housing having an air inlet opening and an air outlet opening that allow air to flow between an interior and an exterior of the housing, the electronic module being configured to operate in a mode below a manufacturer's maximum rated external ambient air operating temperature without the electronic components exceeding their individual maximum core operating temperature limits; the support coupled to the housing and comprising a first duct and a second duct, at least a portion of the support being exterior of the housing and in fluid communication with at least one of the air inlet opening or the air outlet opening; and a flow device located exterior to the housing and coupled to the support such that at least a portion of the air entering the interior of the housing passes through the second duct, the flow device being positioned and configured to produce a pressure differential between the interior of the housing and the exterior of the housing to cause air to flow through the housing at a second velocity greater than the first velocity such that the electronic module can be operated in the selected mode at an external ambient air temperature greater than the manufacturer's maximum rated external ambient air operating temperature without the multiple electronic components exceeding their corresponding maximum core operating temperature limits; and an enclosure, the flow device being carried by the enclosure, the first duct extending between the flow device and the electronic module and being configured so that at least a portion of air passing through the flow device passes through the first duct, the enclosure carrying a filter, the second duct extending between the electronic module and the filter and being configured so that at least a portion of air passing through the filter flows through the second duct. 2. The system of claim 1 wherein the electronic module includes a portion of a computing system. 3. The system of claim 1 wherein at least one of the first or second ducts carries the flow device. 4. The system of claim 1 wherein the flow device is positioned and configured to produce a pressure differential between the interior of the housing and the exterior of the housing to suck air through the housing of the electronic module. 5. The system of claim 1, further comprising: a temperature sensor proximate to the housing and configured to sense a local temperature of the air flow proximate to the housing; and a controller operatively coupled to the flow device and the temperature sensor, the controller configured to control the pressure differential created by the flow device in response to the local temperature of the airflow. 6. The system of claim 1, further comprising: a temperature sensor proximate to the housing configured to sense an exhaust temperature of air exiting the housing when the flow device produces a pressure differential; and a controller operatively coupled to the flow device and the temperature sensor, the controller configured to control the pressure differential created by the flow device in response to the exhaust temperature. 7. A mobile communications system, comprising: a support: an electronic module carried by the support, the electronic module having a housing and multiple electronic components carried in the housing, the housing having a first opening and a second opening configured to allow air to flow between an interior of the housing and an exterior of the housing to facilitate cooling of the electric components; the support comprises at least a portion of the first duct being exterior to the housing and in fluid communication with the first opening; a high velocity air flow device coupled to the first duct, the flow device located exterior to the housing, the flow device being positioned and configured to produce a pressure differential between the interior of the housing and the exterior of the housing to cause air to flow through the housing, the mobile electronic system being configured to be transportable as a unit from one location to another; the support further comprises at least a portion of the second duct being exterior to the housing and in fluid communication with the second opening so that when the flow device produces the pressure differential, at least a portion of air entering the interior of the housing passes through the second duct; and an enclosure, the support being carried in the enclosure or the support being integral with the enclosure, the flow device being carried by the enclosure, the first duct extending between the flow device and the electronic module and being configured so that at least a portion of air passing through the flow device passes through the first duct, the enclosure carrying a filter, the second duct extending between the electronic module and the filter and being configured so that at least a portion of air passing through the filter flows through the second duct. 8. The system of claim 7 wherein the first and second ducts and the flow device are carried by the support. 9. The system of claim 7 wherein the system includes a first mobile electronic system configured to be either operatively coupled or physically coupled to at least one second mobile electronic system, or both operatively and physically coupled to the at least one second mobile electronic system. 10. The system of claim 7 wherein: the electronic module is configured to operate in a mode below a maximum manufacturer's rated first ambient air temperature without the multiple electronic components exceeding their individual corresponding maximum operating temperature limits; and the flow device is configured to produce a pressure differential to cause air to flow through the housing such that the electronic module can be operated in the selected mode at a second ambient air temperature greater than the maximum manufacturer's rated first ambient air temperature without the multiple electronic components exceeding their corresponding maximum operating temperature limits. 11. The system of claim 7 wherein the electronic module includes a first electronic module with a first housing and multiple first electronic components, the duct includes a first duct, and the high-velocity flow device includes a first high-velocity flow device, and where in the system further comprises: a second electronic module carried by the support, the second electronic module having a second housing and multiple second electronic components carried in the second housing, the second housing having the at least two openings configured to allow air to flow between an interior of the second housing and an exterior of the second housing to facilitate cooling of the second electronic components, wherein the second duct is in fluid communication with at least one of the openings of the second housing; a second high-velocity flow device coupled to the second duct, the second high-velocity flow device being configured to produce a pressure differential between the interior of the second housing and the exterior of the second housing to cause high velocity air to flow through the second housing. 12. A mobile communications system, comprising: a support; a first electronic module carried by the support, the first electronic module having a housing and multiple first electronic components carried in the housing, the housing having a first opening and a second opening configured to allow air to flow between an interior of the housing and an exterior of the housing to facilitate cooling of the first electronic components; a first duct, at least a portion of the first duct being exterior to the housing an in fluid communication with at least one of the first or second openings; a first high velocity air flow device coupled to the first duct, the first flow device located exterior to the housing, the flow device being positioned and configured to produce a pressure differential between the interior of the housing and the exterior of the housing to cause air to flow through the housing, the mobile electronic system being configured to be transportable as a unit from one location to another; an enclosure, the support being carried in the enclosure or the support being integral with the enclosure, the first flow device being carried by the enclosure, the first duct extending between the first flow device and the first opening of the first electronic module and being configured so that at least a portion of air passing through the first flow device flows between the interior of the first housing and an exterior of the enclosure; a first filter carried by the enclosure; a second duct extending between the second opening of the first electronic module and the first filter and being configured so that at least a portion of air passing through the first filter passes between the interior of the first housing and an the exterior of the enclosure; a second electronic module carried by the support, the second electronic module having a second housing and multiple second electronic components carried in the second housing, the second housing having a third opening and a fourth opening, the third and fourth openings being configured to allow air to flow between an interior of the second housing and an exterior of the second housing to facilitate cooling of the second electronic components; a second flow device carried by the support, the second flow device being configured to produce a pressure differential between the interior of the second housing and the exterior of the second housing to cause air to flow through the second housing; a third duct extending between the second flow device and the third opening of the second electronic module and being configured so that at least a portion of air passing through the second flow device flows between the interior of the second housing and an exterior of the enclosure; a second filter carried by the enclosure; and a fourth duct extending between the fourth opening of the second electronic module and the second filter and being configured so that at least a portion of air passing through the second filter passes between the interior of the second housing and an the exterior of the enclosure, and wherein the first and second electronic modules are configured to operate together to provide network switching equipment. 13. An electronic system, comprising: a support an electronic module having a housing, multiple electronic components in the housing, and an internal cooling system in the housing that enables air to move in the housing at up to a first velocity relative to the electronic components, the electronic components having individual maximum core operating temperature limits within the housing, the housing having at a first opening and a second opening configured to allow air to flow between an interior of the housing and an exterior of the housing to facilitate cooling of the electronic components, the electronic module being configured to operate in a mode at or below a manufacturer's maximum rated external ambient air operating temperature without the multiple electronic components exceeding their individual corresponding maximum core operating temperature limits; the support comprises at least a portion of the first duct being exterior to the housing and in fluid communication with the first opening; the support further comprises at least a portion of the second duct being exterior to the housing and in fluid communication with the second opening; an air moving mechanism for producing a pressure differential between the interior of the housing and the exterior of the housing to cause air to flow through the housing at a second velocity greater than the first velocity such that the electronic module can be operated in the mode at an external ambient air temperature greater than the manufacturer's maximum rated external ambient air operating temperature without the multiple electronic components exceeding their individual maximum core operating temperature limits, the air moving mechanism being located exterior to the housing; and an enclosure, the air moving mechanism being carried by the enclosure, the first duct extending between the air moving mechanism and the electronic module and being configured so that at least a portion of air passing through the flow device passes through the first duct, the enclosure carrying a filter, the second duct extending between the electronic module and the filter and being configured so that at least a portion of air passing through the filter flows through the second duct. 14. The system of claim 13 wherein the electronic module includes a portion of a computing system. 15. The system of claim 13 wherein the air moving mechanism is positioned and configured to draw a flow of air through the interior of the housing at the second velocity. 16. The system of claim 13 wherein the filter is positioned so that at least a portion of air passes through the filter before entering the interior of the housing. 17. The system of claim 13, further comprising: a temperature sensor proximate to the housing and configured to sense a local temperature; and a processing means for controlling air moving mechanism in response to the local temperature. 18. An electronic system, a support: an electronic module having a housing, multiple heat producing electronic components in the housing and an internal cooling system in the housing configured to move air in the housing at up to a maximum first velocity relative to the electronic components, the housing having a first air inlet and outlet opening and a second air inlet that allow air to flow between an interior and an exterior of the housing; the support comprises coupled to the housing, at least a portion of the first air duct being exterior of the housing and in direct communication with at least one of the air inlet or outlet openings; a high-velocity flow device located exterior to the housing and coupled to the first air duct, the flow device being positioned and configured to create an airflow drawn through the first air duct and directly through the housing at a second velocity greater than the first velocity; the support further comprises at least a portion of the second air duct being exterior to the housing and in fluid communication with at least one of the air inlet or outlet openings so that when the flow device produces the pressure differential, at least a portion of air entering the interior of the housing passes through the second air duct; and an enclosure, the high-velocity flow device being carried by the enclosure, the first air duct extending between the flow device and the electronic module and being configured so that at least a portion of air passing through the high-velocity flow device passes through the first air duct, the enclosure carrying a filter, the second air duct extending between the electronic module and the filter and being configured so that at least a portion of air passing through the filter flows through the second air duct.