초록 ▼

A method of manufacturing an infrared rays receiver comprises the steps of: chip attach; wire bonding; encapsulation; metal housing covering; encapsulation; pin cutting; and testing. A lead frame has several pins, wherein one pin has a coupling part. An infrared rays receiving chip is coupled to the

A method of manufacturing an infrared rays receiver comprises the steps of: chip attach; wire bonding; encapsulation; metal housing covering; encapsulation; pin cutting; and testing. A lead frame has several pins, wherein one pin has a coupling part. An infrared rays receiving chip is coupled to the coupling part of the pin of the lead frame, and electrically connected to the other pins by bonding wires. Thereafter, a light-pervious adhesive encapsulates part of the lead frame, the chip, and the bonding wires. Thereafter, the light-pervious adhesive is covered with a metal housing having a through hole so as to expose the infrared rays receiving chip via the through hole. Thereafter, the metal housing and the light-pervious adhesive are encapsulated into a unity by a colored adhesive. Consequently, the infrared rays receiver is protected from the occurrence of short circuits and has a metal shielding effect to provide a longer transmission distance.

대표청구항 ▼

What the invention claimed is: 1. A method of manufacturing an infrared rays receiver, comprising the steps of: (a) chip attach: attaching an infrared rays receiving chip to one pin of a lead frame; (b) wire-bonding: connecting said infrared rays receiving chip with the other pins of said lead fram

What the invention claimed is: 1. A method of manufacturing an infrared rays receiver, comprising the steps of: (a) chip attach: attaching an infrared rays receiving chip to one pin of a lead frame; (b) wire-bonding: connecting said infrared rays receiving chip with the other pins of said lead frame by a plurality of bonding wires; (c) encapsulation: encapsulating part of said lead frame, said infrared rays receiving chip and said bonding wires into a unity by a light-pervious adhesive; (d) metal housing covering: covering said light-pervious adhesive with a metal housing having a through hole on one side; (e) encapsulation: encapsulating said metal housing with a colored adhesive; (f) pin cutting: cutting off a plurality of connection sections of said lead frame; and (g) testing: performing a testing on said infrared rays receiver obtained above. 2. A method of manufacturing an infrared rays receiver according to claim 1, wherein said light-pervious adhesive is a transparent resin. 3. A method of manufacturing an infrared rays receiver according to claim 1, wherein said colored adhesive is a black resin. 4. A method of manufacturing an infrared rays receiver according to claim 1, wherein said metal housing is an iron housing. 5. An infrared rays receiver, comprising: a lead frame having a plurality of pins having a coupling part on one pin of said pins; an infrared rays receiving chip coupled to said coupling part of said one pin of said pins and electrically connected with the rest of said pins by a plurality of bonding wires; a light-pervious adhesive for encapsulating part of said lead frame, said infrared rays receiving chip and said bonding wires; a metal housing having a through hole on one side for covering said light-pervious adhesive to expose said infrared rays receiving chip via said through hole; and a colored adhesive for encapsulating said metal housing and said light-pervious adhesive into a unity. 6. An infrared rays receiver according to claim 5, wherein said light-pervious adhesive is a transparent resin. 7. An infrared rays receiver according to claim 5, wherein said colored adhesive is a black resin. 8. An infrared rays receiver according to claim 5, wherein said metal housing is an iron housing.