[특허]Methods and apparatus for a band to band transfer module

Methods and apparatus for a band to band transfer module 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G06F-019/00 G06F-007/00
출원번호	UP-0521070 (2006-09-13)
등록번호	US-7577487 (2009-08-31)
발명자 / 주소	Lowrance, Robert B. Englhardt, Eric Andrew Rice, Michael R. Shah, Vinay Koshti, Sushant S. Hudgens, Jeffrey C.
출원인 / 주소	Applied Materials, Inc.
대리인 / 주소	Dugan & Dugan
인용정보	피인용 횟수 : 0 인용 특허 : 76

초록 ▼

A band to band transfer module according to the present invention may be used with a substrate carrier transport system, or other systems, to transfer substrate carriers (e.g., small lot substrate carriers) from one conveyor to another conveyor or between two points on the same conveyor. The transfers (e.g., pick and place) of the substrate carriers may be made between conveyors traveling at different speeds. Numerous other aspects and features are disclosed.

대표청구항 ▼

The invention claimed is: 1. A band to band transfer apparatus comprising: a first assembly adapted to remove a substrate carrier which is adapted to transport substrates for manufacture of electronic devices from a source conveyor traveling at a first speed while a portion of the source conveyor is in motion within a first transfer zone of a closed-loop transfer station track of the band to band transfer apparatus; and a second assembly adapted to load a substrate carrier which is adapted to transport substrates for manufacture of electronic devices onto a destination conveyor traveling at a second speed while a portion of the destination conveyor is in motion within a second transfer zone of the transfer station track of the band to band transfer apparatus and wherein each of the first assembly and second assembly are adapted to support the substrate carrier and change speed while circulating around on a surface of the closed-loop transfer station track. 2. The apparatus of claim 1 wherein the first assembly and the second assembly are a single, same assembly. 3. The apparatus of claim 1 wherein the source conveyor and the destination conveyor are different portions of a single, same conveyor. 4. The apparatus of claim 1 wherein the substrate carrier is a lot size carrier adapted to hold a maximum of less than thirteen substrates. 5. The apparatus of claim 1 wherein the substrate carrier from the source conveyor is supported on the source conveyor by a first cradle, wherein the substrate carrier loaded onto the destination conveyor is supported on the destination conveyor by a second cradle, and wherein the first cradle is paired with the second cradle by a scheduler executing in a system controller. 6. The apparatus of claim 5 wherein a speed of the first assembly is adjusted to match a speed of the source conveyor in the first transfer zone of the band to band transfer apparatus. 7. The apparatus of claim 5 wherein a speed of the second assembly is adjusted to match a speed of the destination conveyor in the second transfer zone of the band to band transfer apparatus. 8. A system for transporting substrate carriers, the system comprising: a first conveyor traveling at a first speed; a second conveyor traveling at a second speed; and a band to band transfer apparatus disposed adjacent the first and second conveyors and including: a first assembly adapted to remove a substrate carrier which is adapted to transport substrates for manufacture of electronic devices from the first conveyor while a portion of the first conveyor is in motion within a first transfer zone of the band to band transfer apparatus, and a second assembly adapted to load a substrate carrier which is adapted to transport substrates for manufacture of electronic devices onto the second conveyor while a portion of the second conveyor is in motion within a second transfer zone of the band transfer apparatus wherein the first and second assemblies support the substrate carrier while circulating around on a surface of the closed-loop transfer station track of the band transfer apparatus and wherein each of the first assembly and the second assembly are adapted to change speed while circulating around on the surface of the closed-loop transfer station track. 9. The system of claim 8 wherein the first assembly and the second assembly are a single, same assembly. 10. The system of claim 8 wherein the first conveyor and the second conveyor are different portions of a single, same conveyor. 11. The system of claim 8 wherein the substrate carrier is a lot size carrier adapted to hold a maximum of less than thirteen substrates. 12. The system of claim 8 further comprising a system controller coupled to the band to band transfer apparatus, wherein the substrate carrier from the first conveyor is supported on the first conveyor by a first cradle, wherein the substrate carrier loaded onto the second conveyor is supported on the second conveyor by a second cradle, and wherein the first cradle is paired with the second cradle by a scheduler executing in the system controller. 13. The system of claim 12 wherein a speed of the first assembly is adjusted to match a speed of the first conveyor in the first transfer zone of the band to band transfer apparatus. 14. The system of claim 12 wherein a speed of the second assembly is adjusted to match a speed of the second conveyor in the second transfer zone of the band to band transfer apparatus. 15. A method of transporting substrate carriers using a band to band transfer apparatus, the method comprising: removing a substrate carrier which is adapted to transport substrates for manufacture of electronic devices from a source conveyor traveling at a first speed while a portion of the source conveyor is in motion within a first transfer zone of the band to band transfer apparatus; conveying the substrate carrier from the first transfer zone to a second transfer zone on an assembly supporting the substrate carrier while circulating around on a surface of a closed-loop transfer station track of the band to band transfer apparatus; and loading the substrate carrier onto a destination conveyor traveling at a second speed while a portion of the destination conveyor is in motion within the second transfer zone of the band to band transfer apparatus wherein during each of the steps of removing and loading, the assembly is adapted to change speed in the first and second transfer zones while circulating around on the surface of a closed-loop transfer station track. 16. The method of claim 15 wherein the removing the substrate carrier and the loading the substrate carrier are performed by a single, same assembly. 17. The method of claim 15 wherein the source conveyor and the destination conveyor are different portions of a single, same conveyor. 18. The method of claim 15 wherein the substrate carrier is a lot size carrier adapted to hold a maximum of less than thirteen substrates. 19. The method of claim 15 wherein the substrate carrier from the source conveyor is supported on the source conveyor by a first cradle, wherein the substrate carrier loaded onto the destination conveyor is supported on the destination conveyor by a second cradle, and wherein the first cradle is paired with the second cradle by a scheduler executing in a system controller. 20. The method of claim 19 wherein a speed of a first assembly used to remove the substrate carrier is adjusted to match a speed of the source conveyor in the first transfer zone of the band to band transfer apparatus. 21. The method of claim 19 wherein a speed of a second assembly used to load the substrate carrier is adjusted to match a speed of the destination conveyor in the second transfer zone of the band to band transfer apparatus.

이 특허에 인용된 특허 (76)

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
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연합인증

Methods and apparatus for a band to band transfer module 원문보기

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Methods and apparatus for a band to band transfer module 원문보기

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