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Heat dissipating device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
  • F28F-013/12
  • F28F-013/00
  • H05K-007/20
출원번호 UP-0262301 (2005-10-27)
등록번호 US-7578337 (2009-09-08)
발명자 / 주소
  • Spokoiny, Michael
  • Kerner, James M.
  • Lux, Craig J.
  • Maurus, James M.
출원인 / 주소
  • United States Thermoelectric Consortium
대리인 / 주소
    The Webostad Firm
인용정보 피인용 횟수 : 10  인용 특허 : 33

초록

A heat dissipation device with a fluid cavity that utilizes a hybrid of star pins with concave surfaces and sharp edges, and truncated dimples, which creates turbulence and a vortex phenomenon perpendicular to fluid flow transmission, and increases the heat transfer coefficient without increasing re

대표청구항

What is claimed is: 1. A heat dissipation device, comprising: a housing adapted to conduct heat from a heat source; wherein said housing comprises a first component and a second component; wherein a first fluid cavity is formed by coupling said first component and said second component; an inlet po

이 특허에 인용된 특허 (33)

  1. Meyer,Michael T., Apparatus for heat transfer and critical heat flux enhancement.
  2. McDunn Kevin J. ; Limper-Brenner Linda ; Press Minoo D., Apparatus for spray-cooling multiple electronic modules.
  3. Kamath, Vinod; Loebach, Beth Frayne; Matteson, Jason Aaron; Mansuria, Mohanlal S., Apparatus having forced fluid cooling and pin-fin heat sink.
  4. Fahey Albert J. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Pavelka John B. (Beacon NY) Sherif Raed A. (Pleasant Valley NY), Blind hole cold plate cooling system.
  5. Smith Dean L. ; Sobresky Edmund J. ; Kerr Roger S., Bonded cast, pin-finned heat sink and method of manufacture.
  6. Novotny Shlomo D. (Wayland MA), Closed-cycle expansion-valve impingement cooling system.
  7. Scott,Alexander Robin Walter, Computer cooling apparatus.
  8. Ahn Tae-Bong,KRX, Cooling apparatus for electronic systems and computer systems with such apparatus.
  9. Becker Klaus,DEX ; Staiger Wolfgang,DEX ; Jung Matthias,DEX ; Heinemeyer Peter,DEX, Cooling body having lugs.
  10. Chu, Richard C.; Ellsworth, Jr., Micheal J.; Simons, Robert E., Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader.
  11. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack.
  12. Carter, Daniel P.; Crocker, Michael T.; Broili, Ben M.; Byquist, Tod A.; Llapitan, David J., Electronic assemblies with high capacity curved fin heat sinks.
  13. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Electronic module with integral refrigerant evaporator assembly and control system therefore.
  14. Chao-Fan Chu Richard (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Simons Robert E. (Poughkeepsie NY) Zumbrunnen Michael L. (Poughkeepsie NY), Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels.
  15. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof.
  16. Cannell, Michael J.; Cooley, Roger; Garman, Richard W.; Green, Geoffrey; Harrison, Peter N.; Walters, Joseph D., Fluid-cooled heat sink with turbulence-enhancing support pins.
  17. Gregory T. Wyler ; Peter B. Favini ; Blaine C. Wotring ; Bibek Chapagain, Folded fin heat sink and fan attachment.
  18. Gabriel Rouchon, Heat dissipating device.
  19. Gedamu, Elias; Man, Denise, Heat dissipation apparatus and method.
  20. William B. Rife, Heat dissipation device with threaded fan module.
  21. Itoh Satomi (Hyogo JPX), Heat radiating device.
  22. Feenstra Sean D., Heat sink utilizing the chimney effect.
  23. Tilton Donald E. (Kent WA) Tilton Charles L. (Kent WA), High heat flux evaporative spray cooling.
  24. Pellant Michal (Prague CSX) Zuna Jaroslav (Prague CSX) Novak Petr (Prague CSX) Zavazal Zdenek (Prague CSX) Kratina Jindrich (Prague CSX) Reichel Pavel (Prague CSX) Kafunek Pavel (Prague CSX), Liquid cooler for semiconductor power elements.
  25. Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Local condensation control for liquid impingement two-phase cooling.
  26. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  27. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  28. Ku, Shih-Chang, Multi-opening heat-dissipation device for high-power electronic components.
  29. Ward Terence G. ; Downer Scott D., Pin fin heat sink and pin fin arrangement therein.
  30. Tantoush, Mohammad A., Scalable and modular heat sink-heat pipe cooling system.
  31. Kieda Shigekazu (Ishioka JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Sato Motohiro (Ibaraki JPX), Semiconductor cooling device.
  32. Dale, James L., Stud welded pin fin heat sink.
  33. Kerner James M. (779 Hillgrove Chico CA 95926), Thermoelectric closed-loop heat exchange system.

이 특허를 인용한 특허 (10)

  1. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins.
  2. Dede, Ercan Mehmet, Cooling apparatuses and electronics modules having branching microchannels.
  3. Kawaura, Masanori; Matsui, Hirohito; Yoshida, Tadafumi, Cooling fin structure.
  4. Matsumoto, Daisuke; Mima, Akira; Kawashima, Tetsuya; Mabuchi, Yuuichi; Hattori, Yukio; Kamizuma, Hiroshi; Miyagawa, Ryouhei; Ichikawa, Tomonori, Cooling structure of heating element and power conversion device.
  5. Matsumoto, Daisuke; Mima, Akira; Kawashima, Tetsuya; Mabuchi, Yuuichi; Hattori, Yukio; Kamizuma, Hiroshi; Miyagawa, Ryouhei; Ichikawa, Tomonori, Cooling structure of heating element and power conversion device.
  6. Koizuka, Yousuke; Nakayama, Tatsuomi; Ishikawa, Ichiro, Cooling structure, vortex-flow forming plate molding apparatus, and method for molding vortex-flow generating portion.
  7. Spokoiny, Michael; Kerner, James M.; Qiu, Xinliang; Maurus, James W.; Spokoyny, Boris M., Fluid-operated heat transfer device.
  8. Kucherov, Yan R.; Hubler, Graham, Heat dissipation system with boundary layer disruption.
  9. Kucherov, Yan R.; Hubler, Graham K., Heat dissipation system with surface located cavities for boundary layer disruption.
  10. Koizuka, Yousuke; Nakayama, Tatsuomi, Heat-radiating system.
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