초록 ▼

The present invention is directed to coverlay compositions derived from two-layer polyamic acid-based composites having a cover layer and adjacent thereto an adhesive layer wherein the cover layer comprises polyamic acid and other additives allowing the composition to be photosensitive and aqueous b

The present invention is directed to coverlay compositions derived from two-layer polyamic acid-based composites having a cover layer and adjacent thereto an adhesive layer wherein the cover layer comprises polyamic acid and other additives allowing the composition to be photosensitive and aqueous base developable, and where the adhesive layer can form a polyimide having a glass transition temperature between 170 and 250° C. The two-layer coverlay compositions of the present invention are used to encapsulate metal circuit traces formed on a flexible printed circuit base substrate. These two-layer compositions are particularity useful due to having an overall in-plane CTE between 10 and 40 ppm/° C. a range that is useful in avoiding unwanted curling of a flexible printed circuit when used as a polyimide-based coverlay material.

대표청구항 ▼

What is claimed is: 1. A multi-layer composite coverlay substrate, comprising: A. an adhesive layer having a thickness in a range between and including 1-20 microns, comprising: i. an adhesive polyamic acid precursor curable to an adhesive polyimide base polymer wherein said adhesive base polymer e

What is claimed is: 1. A multi-layer composite coverlay substrate, comprising: A. an adhesive layer having a thickness in a range between and including 1-20 microns, comprising: i. an adhesive polyamic acid precursor curable to an adhesive polyimide base polymer wherein said adhesive base polymer exhibits a glass transition temperature ("Tg") between and including 170° C. and 250° C.; ii. an ethylenically unsaturated photo-monomer wherein at least 2 percent by weight of the photo-monomer is an amine acrylate, a methacrylate having amine functionality, or a combination of the two; B. a cover layer adjacent to the adhesive layer having a thickness between 10 and 75 microns, comprising: i. 60 to 83.9 percent by weight (on a dry solids basis) cover layer polyamic acid precursor curable to a cover layer polyimide base polymer having a glass transition temperature (Tg) from 10° C. to 100° C. greater than the glass transition temperature of the adhesive polyimide base polymer, the cover layer polyamic acid precursor comprising: a. 95 to 100 mole % diamine component, b. 85 to 99 mole % dianhydride component, c. 1 to 15 mol % tetra carboxylic acid wherein the amount of tetracarboxylic acid is based on the amount of corresponding dianhydride needed to react with the unreacted diamine ends, and wherein the cover layer polyamic acid precursor has a weight-average molecular weight equal to or below 50,000, and ii. 15 to 35 percent by weight (on a dry solids basis) an ethylenically unsaturated photo-monomer where at least 2 percent by weight of the photo-monomer is an amine acrylate, a methacrylate having amine functionality, or a combination of the two; iii. 1 to 10 percent by weight, on a dry solids basis, of a photo-initiator; and iv. 0.1 to 1.0 percent by weight (on a dry solids basis) a visible light sensitizer; wherein the overall in-plane coefficient of thermal expansion ("CTE"), of the coverlay is between 10 and 40 ppm/° C. measured at 30° C. 2. A coverlay substrate in accordance with claim 1, wherein the cover layer polyamic acid is derived from the polymerization of a dianhydride and diamine, wherein the dianhydride is selected from the group consisting of biphenyltetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA) and mixtures of BPDA and PMDA. 3. A coverlay substrate in accordance with claim 1 wherein the cover layer polyamic acid is derived from the polymerization of a dianhydride and diamine wherein the diamine is selected from the group consisting of p-phenylene diamine, or mixtures of p-phenylene diamine with diaminobenzanilide. 4. A coverlay substrate in accordance with claim 3, wherein the diaminobenzanilide is selected from a group consisting of 2-methoxy-4,4'-diaminobenzanilide, 2'-methoxy-4,4'-diaminobenzanilide and 2,2'-dimethoxy-4,4'-diamino-benzanilide. 5. A coverlay substrate in accordance with claim 1 wherein the photo-monomer is selected from a group consisting of N-methyldiethylamino dimethacrylate, dimethylaminopropyl methacrylamide, dimethylamino dimethacrylate, acrylated amine oligomer acrylate. 6. A coverlay substrate in accordance with claim 1 wherein the adhesive layer further comprises an adhesion promoter selected from a group consisting of benzotriazole, 5-chloro-benzotriazole, 1-chloro-benzotriazole, 1-carboxy-benzotriazole, 1-hydroxy-benzotriazole, 1,2-napthotriazole, benzimidazole, mercaptobenzimidazole, 5-nitro-2-mercaptobenimidazole, 5-amino-2-mercyptobenzimidazole, 2-amino-benzimidazole, 5-methyl-benzimidazole, 4,5-diphenyl-benzimidazole, 2-guanadino-benzimidazole, benzothiazole, 2-amino-6-methyl-benzothiazole, 2-mercaptobenzothiazole, 2-methyl-benzothiazole, benzoxazole, 2-mercaptobenzoxazole, 2-mercaptothiazoline, benzotriazole, 3-amino-1,2,4-triazole, 1H-1,2,4-triazole-3-thiol, 5-amino-1,3,4-thiodiazole-2-thiol, 4-mercapto-1H-pyrazolo[3,4-d]pyrimidine, 4-hydroxy-pyrazolo[3,4-d]pyrimidene, 5-amino-tetrazole monohydrate, tolutriazole, 1-phenyl-3-mercapototetrazole, 2-amino-thiazole, thio-benzanilide, 2-amino-5-mercaptothiophene, 5-amino-1,3,4-thiodiazole-2-thiol, benzotriazole, 5-chloro-benzotriazole, 1-chloro-benzotriazole, 1-carboxy-benzotriazole, 1-hydroxy-benzotriazole, 2-mercaptobenzoxazole, 1H-1,2,4-triazole-3-thiol, and mercaptobenzimidazole. 7. A coverlay substrate in accordance with claim 1, wherein at least a portion of the adhesive layer is bonded to a flexible printed circuit. 8. A coverlay substrate in accordance with claim 1, wherein the adhesive layer and the cover layer are imidized to provide a polyimide adhesive layer and a polyimide cover layer. 9. A coverlay substrate in accordance with claim 8, wherein the cover layer polyimide layer comprises a polyimide having an in-plane GTE between and including any two of the following numbers 5, 10, 15, 20, 25 and 30 ppm/° C. measure at 30° C. 10. A coverlay substrate in accordance with claim 8, wherein the adhesive layer is bonded to a circuitized electronic substrate. 11. A coverlay substrate in accordance with claim 8, wherein the adhesive layer is bonded to a metal. 12. A coverlay substrate in accordance with claim 1 wherein the photo-monomer additionally comprises a non-amine containing photo-monomer selected from the group consisting of hexamethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol (200) diacrylate, cyclohexane dimethanol diacrylate, oxyethylated phenol acrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate, polyoxyethylated trimethylolpropane triacrylate, poly-oxypropylated trimethylolpropane triacrylate, pentaerythritol triacrylate, and pentaerythritol tetraacrylate.