[특허]Interface assembly for thermally coupling a data acquisition system to a sensor array

General Electric Company

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특허 상세정보

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내보내기 페이스북 공유 트위터 공유 카카오톡 공유

Interface assembly for thermally coupling a data acquisition system to a sensor array

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01T-001/24 G01T-001/00
미국특허분류(USC)	250/370.15
출원번호	UP-0560873 (2006-11-17)
등록번호	US-7586096 (2009-09-22)
발명자 / 주소	Astley, Oliver Richard Rose, James Wilson Lacey, Joe James Short, Jonathan David Joshi, Ashutosh
출원인 / 주소	General Electric Company
대리인 / 주소	Christian, Joseph J.
인용정보	피인용 횟수 : 1 인용 특허 : 17

초록
▼

An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.

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청구항
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The invention claimed is: 1. A system comprising: a sensor array based on a given sensing modality; at least one integrated circuit for providing a desired signal conditioning to a plurality of analog signals from the sensor array, wherein the at least one integrated circuit is directly mounted on to the sensor array establishing thermal coupling there between; and at least one temperature sensor configured to sense temperature variation affecting the sensor array, the at least one temperature sensor disposed in a location selected from at least one of the following locations: a location at the sensor array, and a location within the integrated circuit, wherein the temperature sensor comprises a sensor element disposed at the sensor array but outside a field of view of the sensor array, the sensor element being of a type as used in the sensor array and comprising a cover to shield radiation from exciting the sensor element. 2. The system of claim 1, wherein said at least one temperature sensor is coupled to an outer surface of a substrate of the interface assembly for supporting said at least one integrated circuit. 3. The system of claim 1, wherein said at least one temperature sensor comprises circuitry that is part of said at least one integrated circuit. 4. The system of claim 3, wherein said at least one temperature sensor is based on a reference signal from the circuitry that is part of said at least one integrated circuit, the reference signal being responsive to temperature variation. 5. The system of claim 4, wherein the reference signal comprises a bandgap reference voltage of a semiconductor device, said semiconductor device constituting the circuitry that is part of said at least one integrated circuit. 6. The system of claim 4, wherein said at least one temperature sensor is based on an externally-derived reference signal coupled to a thermally sensitive component in the integrated circuit. 7. The system of claim 6, wherein the thermally sensitive electrical component includes one of a resistor, a diode, a capacitor, a transistor and a combination thereof. 8. The system of claim 3, wherein said at least one temperature sensor is based on monitoring a leakage signal from the circuitry of said at least one integrated circuit, the leakage signal being responsive to temperature variation. 9. The system of claim 3, wherein said at least one temperature sensor is based on monitoring a leakage signal from the circuitry that is part of said at least one integrated circuit though an electro-static discharge pad. 10. The system of claim 1, wherein said at least one temperature sensor comprise a miniaturized thermistor surface-mounted on circuitry that is part of said at least one integrated circuit. 11. The system of claim 1, wherein said at least one temperature sensor is embedded in a substrate of the interface assembly for supporting said at least one integrated circuit. 12. The system of claim 1 further comprising a temperature control system for controlling temperature of the sensor array, said temperature control system comprising: at least one temperature controller coupled to said at least one temperature sensor for receiving an output signal from the temperature sensor indicative of the temperature variation; and at least one temperature correction device coupled to the temperature controller, the temperature correction device operable to cause the temperature variation to be within a predetermined temperature range in response to a control signal from the temperature controller. 13. The system of claim 12, wherein said at least one temperature correction device comprises a heat dissipation circuit. 14. The system of claim 13, wherein the heat dissipation circuit comprises one of a resistor, a capacitor, and a combination thereof. 15. The system of claim 12, wherein said at least one temperature correction device comprises a digital processor in the at least one integrated circuit, wherein a clocking rate of said digital processor is selectively adjusted in response to a control signal from said at least one temperature controller during a non-data acquisition mode, and wherein said clocking rate is restored to a predetermined rate during a normal data acquisition mode. 16. The system of claim 12 comprising: one temperature controller coupled to a plurality of temperature sensors, wherein said temperature controller calculates an average temperature value from said plurality of temperature sensors indicative of an average sensor array temperature deviation, and; one temperature correction device coupled to said temperature controller, said temperature correction device operable to cause said average sensor array temperature variation to fall within said predetermined temperature range in response to an average control signal from said temperature controller. 17. The system of claim 1 wherein the sensing modality for the sensor array is selected from the group consisting of magnetic resonance, ultrasound, positron emission tomography, and computed tomography. 18. A system comprising: a sensor array based on a given sensing modality; at least one integrated circuit for providing a desired signal conditioning to a plurality of analog signals from the sensor array, wherein the at least one integrated circuit is directly mounted on to the sensor array establishing thermal coupling there between; at least one temperature sensor configured to sense temperature variation affecting the sensor array, the at least one temperature sensor disposed in a location selected from at least one of the following locations: a location at the sensor array, and a location within the integrated circuit; and a temperature control system for controlling temperature of the sensor array, said temperature control system comprising: at least one temperature controller coupled to said at least one temperature sensor for receiving an output signal from the temperature sensor indicative of the temperature variation; and at least one temperature correction device coupled to the temperature controller, the temperature correction device operable to cause the temperature variation to be within a predetermined temperature range in response to a control signal from the temperature controller, wherein said at least one temperature correction device comprises a digital processor in the at least one integrated circuit, wherein a clocking rate of said digital processor is selectively adjusted in response to a control signal from said at least one temperature controller during a non-data acquisition mode, and wherein said clocking rate is restored to a predetermined rate during a normal data acquisition mode.

이 특허에 인용된 특허 (17)

이 특허를 인용한 특허 피인용횟수: 1

Guo, Jun; Zhang, Xiaoyan; Liu, Hailiang; Liu, Zhuo; Joshi, Ashutosh. Data acquired system and CT apparatus using the same. USP2014118895933.

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Interface assembly for thermally coupling a data acquisition system to a sensor array

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Interface assembly for thermally coupling a data acquisition system to a sensor array

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이 특허에 인용된 특허 (17)

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