IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0506114
(2006-08-17)
|
등록번호 |
US-7586745
(2009-09-22)
|
발명자
/ 주소 |
- Szelong, Michael
- Son, Keith
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
10 인용 특허 :
7 |
초록
▼
A chassis assembly for an electronic device such as a storage device. The assembly includes a chassis for housing various functional components included in the electronic device. A sub-housing for containing a waste heat generating device, a device which requires temperature moderation, is included.
A chassis assembly for an electronic device such as a storage device. The assembly includes a chassis for housing various functional components included in the electronic device. A sub-housing for containing a waste heat generating device, a device which requires temperature moderation, is included. The sub-housing defines a first airflow exhaust path for exhausting air in a first direction and a second airflow exhaust path for exhausting air in a second direction. The directing of airflow from the sub-housing is based on a chassis enclosure configuration such as to allow for the implementation of a common component including a component enclosure in a variety of chassis form factors. A method of controlling airflow in a electronic device enclosure includes the steps of utilizing a fan to generate a flow of air, directing the flow of air through a sub-housing including a waste heat generating device, and implementing the electronic device enclosure to selectively direct the exhaust path of the generated airflow from the sub-housing base on the configuration of the electronic device enclosure.
대표청구항
▼
What is claimed is: 1. A data storage device chassis assembly, comprising: a chassis for housing a data storage device, the chassis being configured for receiving components, the chassis having a chassis enclosure configuration; and at least one component housing for containing a component, the at
What is claimed is: 1. A data storage device chassis assembly, comprising: a chassis for housing a data storage device, the chassis being configured for receiving components, the chassis having a chassis enclosure configuration; and at least one component housing for containing a component, the at least one component housing being user configurable to direct an airflow over the component including a waste heat generating device contained within the at least one component housing, the at least one component housing defining a first airflow exhaust path for exhausting airflow from the at least one component housing in a first direction and a second airflow exhaust path for exhausting airflow from the at least one component housing in a second direction, and the airflow is exhausted utilizing one of the first airflow exhaust path or the second airflow exhaust path; wherein the exhausting of airflow from the at least one component housing is determined by the chassis enclosure configuration and the at least one component housing, and is user configurable. 2. The data storage device chassis assembly of claim 1, wherein the second airflow exhaust path is substantially perpendicular to the first airflow exhaust path. 3. The data storage device chassis assembly of claim 1, wherein the at least one component housing is configured to contain a central processing unit. 4. The data storage device chassis assembly of claim 1, wherein the chassis is at least one of a rack form factor, a desktop form factor, or a desk side tower form factor. 5. The data storage device chassis assembly of claim 1, wherein the chassis includes a wall for selectively blocking one of the first exhaust path or the second exhaust path. 6. The data storage device chassis assembly of claim 1, wherein the at least one component housing is configured to contain at least one of a battery, a data storage device, or a power supply. 7. The data storage device chassis assembly of claim 1, wherein the at least one component housing includes a first component housing and a second component housing, the chassis enclosure configuration being configured to accept the second component housing, within the chassis, the second component housing being disposed to block at least one of the first airflow exhaust path or the second airflow exhaust path of the first component housing. 8. The data storage device chassis assembly of claim 1, wherein the chassis is a desktop form factor, the desktop form factor chassis being constructed to include a wall for blocking at least one of the first airflow exhaust path or the second airflow exhaust path. 9. The data storage device chassis assembly of claim 1, wherein said chassis enclosure configuration causes movement of airflow in said first direction and said second direction. 10. The data storage device chassis assembly of claim 1, wherein said chassis enclosure configuration includes the configuration of exterior walls and partial walls of said chassis. 11. The data storage device chassis assembly of claim 1, wherein said chassis enclosure configuration includes the configuration of structures for securing functional components. 12. The data storage device chassis assembly of claim 1, wherein said chassis includes a plurality of apertures for exhausting airflow. 13. A chassis assembly for an electronic device, comprising: a chassis for housing the electronic device, the chassis being user configured for receiving functional components, the chassis having a chassis enclosure configuration; and at least one component housing for containing a component, the component housing being user configured to direct an airflow over the component including a waste heat generating device contained within the at least one component housing, the at least one component housing defining a first airflow exhaust path for exhausting airflow from the at least one component housing in a first direction and a second airflow exhaust path for exhausting airflow from the at least one component housing in a second direction, and the airflow is exhausted utilizing one of the first airflow exhaust path or the second airflow exhaust path; wherein the chassis selectively directs the airflow exhaust through the first airflow exhaust path or the second airflow exhaust path determined by the chassis enclosure configuration and the at least one component housing. 14. The chassis assembly for an electronic device of claim 13, wherein the second airflow exhaust path is substantially perpendicular to the first airflow exhaust path. 15. The chassis assembly for an electronic device of claim 13, wherein the at least one component housing is configured to contain a central processing unit. 16. The chassis assembly for an electronic device of claim 13, wherein the chassis is at least one of a rack form factor, a desktop form factor, or a desk side tower form factor. 17. The chassis assembly for an electronic device of claim 13, wherein the chassis includes a wall for selectively blocking one of the first airflow exhaust path or the second exhaust path. 18. The chassis assembly for an electronic device of claim 13, wherein the wherein the at least one component housing is configured to contain at least one of a battery, a data storage device, or a power supply. 19. The chassis assembly for an electronic device of claim 13, wherein the at least one component housing includes a first component housing and a second component housing, the chassis enclosure configuration being configured to accept the second component housing within the chassis to block at least one of the first exhaust path or the second exhaust path included in the first component housing. 20. The chassis assembly for an electronic device of claim 13, wherein the chassis is a desktop form factor, the desktop form factor chassis being constructed to include a wall for blocking at least one of the first exhaust path or the second exhaust path. 21. The chassis assembly for an electronic device of claim 13, wherein said chassis enclosure configuration causes movement of airflow in said first direction and said second direction. 22. The chassis assembly for an electronic device of claim 13, wherein said chassis enclosure configuration includes the configuration of exterior walls and partial walls of said chassis. 23. The chassis assembly for an electronic device of claim 13, wherein said chassis enclosure configuration includes the configuration of structures for securing functional components. 24. The chassis assembly for an electronic device of claim 13, wherein said chassis includes a plurality of apertures for exhausting airflow. 25. A chassis assembly for an electronic device, comprising: means for containing components, for providing information handling functionality; and at least one component housing for containing a waste heat generating component, the component housing being user configured to direct an airflow over a waste heat generating device contained within the at least one component housing, the at least one component housing defining a first airflow exhaust path for exhausting airflow from the at least one component housing in a first direction and a second airflow exhaust path for exhausting airflow from the at least one component housing in a second direction, and the airflow is exhausted utilizing one of the first airflow exhaust path or the second airflow exhaust path; wherein the containing means directs the airflow through one of the first airflow exhaust path or the second airflow exhaust path determined by the arrangement of the at least one component housing within the containing means. 26. The chassis assembly for an electronic device of claim 25, wherein the second airflow exhaust path is substantially perpendicular to the first airflow exhaust path. 27. The chassis assembly for an electronic device of claim 25, wherein the at least one component housing is configured to contain a central processing unit. 28. The chassis assembly for an electronic device of claim 25, wherein containing means is configured as at least one of a rack configuration or a desktop configuration. 29. The chassis assembly for an electronic device of claim 25, wherein the wherein the at least one component housing is configured to contain at least one of a battery, a data storage device, or a power supply. 30. A method of controlling airflow in an electronic device enclosure having a structural configuration, comprising: utilizing a fan to generate a flow of air; directing the generated flow of air through a component housing containing a waste heat generating device, the component housing disposed in the electronic device enclosure; implementing the electronic device enclosure to selectively direct the exhaust path of the generated airflow from the component housing through at least one of a first airflow exhaust or the second airflow exhaust path determined by the structural configuration of the electronic device enclosure, where the structural configuration is user configurable. 31. The method of claim 30, wherein implementing the electronic device enclosure to selectively direct the exhaust path permits the airflow to be exhausted from the component housing in one of a first orthogonal direction or a second orthogonal direction based on the structural configuration of the electronic device enclosure. 32. The method of claim 30, wherein implementing the electronic device enclosure to selectively direct the exhaust path is accomplished by disposing a second different component housing within the electronic device enclosure proximate to the component housing through which the airflow is passed. 33. The method of claim 30, wherein the fan is substantially disposed inboard the electronic device enclosure to minimize fan noise external to the electronic device chassis.
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