초록 ▼

A fixture device generally includes a base member, a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a shape memory material configured to selectively conform to a surface contour of a workpiece, and an activation device in operative communication with the sh

A fixture device generally includes a base member, a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a shape memory material configured to selectively conform to a surface contour of a workpiece, and an activation device in operative communication with the shape memory material.

대표청구항 ▼

The invention claimed is: 1. A fixture device, comprising: a base member; a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a share memory material configured to selectively conform to a surface contour of a workpiece; and an activation device in operative c

The invention claimed is: 1. A fixture device, comprising: a base member; a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a share memory material configured to selectively conform to a surface contour of a workpiece; and an activation device in operative communication with the share memory material, wherein the shape memory material of the reconfigurable pad is a composite comprising a shape memory alloy and a shape memory polymer, and wherein the shape memory polymer and the shape memory alloy are selected in accordance with a temperature relationship T.sub.w<T.sub.g<T.sub.t.ltoreq.T.sub.r<M.sub.d, T.sub.max, wherein T.sub.w is a working temperature for the fixture device; T.sub.g is a first thermal transition temperature of the shape memory polymer; T.sub.t is a temperature employed for configuring the reconfigurable pad; T.sub.r is a temperature employed for recovery of the reconfigurable pad to an original shape; M.sub.d is a temperature above which the shape memory alloy loses its shape memory properties; and T.sub.max is a lesser of a last transition temperature or an oxidation temperature for the shape memory polymer. 2. The fixture device of claim 1, further comprising an opposing pad, wherein the opposing pad and the reconfigurable pad are configured to fixture the workpiece therebetween. 3. The fixture device of claim 2, wherein the opposing pad is a reconfigurable opposing pad comprising a shape memory material configured to selectively conform to an opposing surface contour of the workpiece. 4. The fixture device of claim 3, wherein the shape memory material of the reconfigurable opposing pad is a shape memory alloy, a shape memory polymer, a baroplastic, a shape memory ceramic, a composite comprising a shape memory alloy and a shape memory polymer, a composite of one of the foregoing and a non-shape memory material, or a combination comprising at least one of the foregoing. 5. The fixture device of claim 3, wherein the shape memory material of the reconfigurable opposing pad is in operative communication with the activation device or a different activation device. 6. The fixture device of claim 2, further comprising an opposing base member onto which the opposing pad is disposed. 7. The fixture device of claim 1, further comprising a locator pin disposed on the base member. 8. The fixture device of claim 1, wherein the shape memory material of the reconfigurable pad is a composite comprising a shape memory alloy and a shape memory polymer, and wherein the composite comprises a shape memory alloy element disposed in a shape memory polymer matrix. 9. A fixture device, comprising: a base member; a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a shape memory material configured to selectively conform to a surface contour of a workpiece; and an activation device in operative communication with the shape memory material, wherein the shape memory material of the reconfigurable pad is a composite comprising a shape memory alloy and a shape memory polymer, and wherein the shape memory polymer and the shape memory alloy are selected in accordance with a temperature relationship T.sub.w<T.sub.g<T.sub.t<A.sub.s<A.sub.f<T.sub.r<M.sub. d-, T.sub.max, wherein T.sub.w is a working temperature for the fixture device; T.sub.g is a first thermal transition temperature of the shape memory polymer; T.sub.t is a temperature employed for configuring the reconfigurable pad; A.sub.s is an austenite start temperature of the shape memory alloy; A.sub.f is an austenite finish temperature of the shape memory alloy; T.sub.r is a temperature employed for recovery of the reconfigurable pad to an original shape; M.sub.d is a temperature above which the shape memory alloy loses its shape memory properties; and T.sub.max is a lesser of a last transition temperature or an oxidation temperature for the shape memory polymer. 10. A fixture device, comprising: a base member; a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a share memory material configured to selectively conform to a surface contour of a workpiece; and an activation device in operative communication with the share memory material, wherein the shape memory material of the reconfigurable pad is a composite comprising a shape memory alloy and a shape memory polymer, and wherein the shape memory polymer and the shape memory alloy are selected in accordance with a temperature relationship A.sub.f<T.sub.w<T.sub.g<T.sub.t.ltoreq.T.sub.r<M.sub.d, T.sub.max, wherein A.sub.f is an austenite finish temperature of the shape memory alloy; T.sub.w is a working temperature for the fixture device; T.sub.g is a first thermal transition temperature of the shape memory polymer; T.sub.t is a temperature employed for configuring the reconfigurable pad; T.sub.r is a temperature employed for recovery of the reconfigurable pad to an original shape; M.sub.d is a temperature above which the shape memory alloy loses its shape memory properties; and T.sub.max is a lesser of a last transition temperature or an oxidation temperature for the shape memory polymer. 11. A fixture device, comprising: a base member; a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a share memory material configured to selectively conform to a surface contour of a workpiece; and an activation device in operative communication with the share memory material, wherein the shape memory material of the reconfigurable pad is a composite comprising a shape memory alloy and a shape memory polymer, and wherein the shape memory polymer and the shape memory alloy are selected in accordance with a temperature relationship T.sub.w<T.sub.g, M.sub.f<T.sub.t.ltoreq.T.sub.r<A.sub.s<T.sub.a.ltoreq.A.sub.f<-; T.sub.max, wherein T.sub.w is a working temperature for the fixture device; T.sub.g is a first thermal transition temperature of the shape memory polymer; M.sub.f is a martensite finish temperature of the shape memory alloy; T.sub.t is a temperature employed for configuring the reconfigurable pad; T.sub.r is a temperature employed for recovery of the reconfigurable pad to an original shape; A.sub.s is an austenite start temperature of the shape memory alloy; T.sub.a is an actuation temperature for the shape memory alloy; A.sub.f is an austenite finish temperature of the shape memory alloy; and T.sub.max is a lesser of a last transition temperature or an oxidation temperature for the shape memory polymer.