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A thermionic or thermotunneling gap diode device consisting of two silicon electrodes maintained at a desired distance from one another by means of spacers. These spacers are formed by oxidizing one electrode, protecting certain oxidized areas and removing the remainder of the oxidized layer. The pr

A thermionic or thermotunneling gap diode device consisting of two silicon electrodes maintained at a desired distance from one another by means of spacers. These spacers are formed by oxidizing one electrode, protecting certain oxidized areas and removing the remainder of the oxidized layer. The protected oxidized areas remain as spacers. These spacers have the effect of maintaining the electrodes at a desired distance without the need for active elements, thus greatly reducing costs.

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The invention claimed is: 1. A thermionic or thermotunneling gap diode device comprising: a) a pair of electrodes having surfaces substantially facing one another; b) spacers comprising silicon oxide topped by a dot of protective layer, wherein said protective layer is present only as a part of sai

The invention claimed is: 1. A thermionic or thermotunneling gap diode device comprising: a) a pair of electrodes having surfaces substantially facing one another; b) spacers comprising silicon oxide topped by a dot of protective layer, wherein said protective layer is present only as a part of said spacers and not elsewhere on said surfaces of said electrodes and wherein said spacers are disposed between said surfaces to allow a gap between said electrodes; wherein said spacers are in direct contact with said electrodes, wherein said gap is of the order of 10-15 nm, and wherein a surface area of said spacers in contact with said surfaces is less than a surface area of said surfaces. 2. The gap diode device of claim 1 wherein one or both of said electrodes comprise silicon. 3. The gap diode device of claim 1 wherein a distance between said spacers is in the range of 10 to 10,000 times a height of said spacers. 4. An electrode for use in the gap diode device of claim 1 comprising: a) an electrode surface, wherein said electrode comprises silicon; b) spacers protruding from said electrode surface having a height of the order of 10-15 nm said spacers comprising silicon oxide topped by a dot of protective layer. 5. The electrode of claim 4 wherein an exposed area between said spacers comprises silicon from which oxidized silicon has been removed. 6. The electrode of claim 4 wherein a distance between said spacers is in the range of 10 to 10,000 times a height of said spacers. 7. The gap diode device of claim 1 wherein one of said electrodes supports one or more circuits to be cooled. 8. The gap diode device of claim 7 wherein said circuits are selected from the group consisting of: a microprocessor, a graphics processor, and a memory chip. 9. The gap diode device of claim 1 wherein one of said electrodes additionally comprises an active layer. 10. The gap diode device of claim 9 wherein said active layer is selected from the group consisting of: zinc, lead, cadmium, thallium, bismuth, polonium, tin, selenium, lithium, indium, sodium, potassium, gallium diamond-like carbon, cesium, titanium and silver. 11. The gap diode device of claim 1 wherein one of said electrodes has a thickness in the range of 100-200 μm. 12. The electrode of claim 4 additionally comprising a bond pad positioned at one side of said electrode. 13. The electrode of claim 4 additionally comprising an oxide seal positioned around a perimeter of said electrode. 14. A thermionic or thermotunneling device comprising: a) a first wafer; b) a second wafer; and c) a plurality of gap diode devices wherein each of said plurality of gap diode devices is a gap diode device of claim 1; wherein one of said pair of electrodes is disposed on said first wafer and the other of said pair of electrodes is disposed on said second wafer. 15. The device of claim 14 wherein one of said wafers has a thickness in the range of 100-200 μm. 16. The device of claim 14 wherein each one of said pair of electrodes disposed on a first wafer additionally comprises a bond pad positioned at one side of each one of said pair of electrodes. 17. The device of claim 14 wherein each one of said pair of electrodes disposed on a first wafer additionally comprising an oxide seal positioned around a perimeter of each one of said pair of electrodes. 18. The gap diode device of claim 1 wherein said dot of protective layer separates said silicon oxide from one of said surfaces.