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Wafer probe station having a skirting component

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-031/02
출원번호 UP-0056647 (2005-02-11)
등록번호 US-7589518 (2009-09-24)
발명자 / 주소
  • Schwindt, Randy J.
  • Harwood, Warren K.
  • Tervo, Paul A.
  • Smith, Kenneth R.
  • Warner, Richard H.
출원인 / 주소
  • Cascade Microtech, Inc.
대리인 / 주소
    Chernoff, Vilhauer, McClung & Stenzel
인용정보 피인용 횟수 : 5  인용 특허 : 718

초록

A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting c

대표청구항

What is claimed is: 1. A probe station having a chuck for supporting a semiconductor under test comprising: (a) a screw with a screw head and a shaft supported by said chuck; (b) a conductive member laterally surrounding and spaced apart from said chuck, wherein said shaft supports said conductive

이 특허에 인용된 특허 (718)

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  195. Yarush Don ; Sosa Martin G. ; Handelin Gary, Hand-held portable endoscopic camera.
  196. Heigl Helmuth,DEX, Handling device.
  197. Frosch Robert A. Administrator of the National Aeronautics and Space Administration ; with respect to an invention of ( Westwood MA) Tschirch Richard P. (Westwood MA) Sidman Kenneth R. (Wayland MA), Heat sealable, flame and abrasion resistant coated fabric.
  198. Oliver Paul Leisten GB, Helical antenna.
  199. Ogawa, Koichi; Iwai, Hiroshi; Koyanagi, Yoshio, Helical antenna apparatus provided with two helical antenna elements, and radio communication apparatus provided with same helical antenna apparatus.
  200. Leisten Oliver Paul,GB2, Helical antenna having a solid dielectric core.
  201. Hollman Kenneth F., High Resolution analytical probe station.
  202. Chou,Min Chieh; Huang,Ya Ju; Wang,Horng Chieh, High conducting thin-film nanoprobe card and its fabrication method.
  203. Subramanian Eswar (Phoenix AZ), High density probe card for testing electrical circuits.
  204. Blanz John H. (Carlisle MA), High efficiency cryogenic test station.
  205. Coberly ; Charles W. ; Lewis ; Howard A., High frequency probe.
  206. Katoh Takayuki (Itami JPX), High frequency wafer probe including open end waveguide.
  207. Walker Douglas,GBX ; Iddon Robin,GBX, High impedance probe for monitoring fast ethernet LAN links.
  208. Hollman, Kenneth F., High resolution analytical probe station.
  209. Bowman Douglas (Shrewsbury MA) Fay Fredric (Worcester MA) Rodgers Cyril (Paxton MA) Tuft Richard (Bolton MA), High speed digital imaging microscope.
  210. Scott ; Paul F., High speed frequency response measurement.
  211. Roch ; Jacques L., High speed precision chuck assembly.
  212. Roch Jacques L. (San Jose CA), High speed precision chuck assembly.
  213. El-Fishawy Sani (Santa Clara CA) Read Andrew J. (Sunnyvale CA) Widdoes L. Curtis (Los Altos CA) Mardjuki Robert (Danville CA), High speed three-state sampling.
  214. Gleason K. Reed (Portland OR) Jones Keith E. (Aloha OR), High-frequency active probe having replaceable contact needles.
  215. Godshalk Edward M. (Beaverton OR) Williams Jeffrey A. (Beaverton OR) Burr Jeremy N. (Portland OR), High-frequency probe tip assembly.
  216. Johnson Robert B. (Laguna Beach CA), High-temperature, low-noise coaxial cable assembly with high strength reinforcement braid.
  217. Ohlsson Magnus,SEX ; Marcus Carina,SEX ; Fredriksson H.ang.kan,SEX, Horn antenna.
  218. Kovacs Gregory T. A. ; Borkholder David A., Hybrid biosensors.
  219. Kovacs Gregory T. A. ; Borkholder David A., Hybrid biosensors.
  220. Pye Richard ; Khazam Moses, Hybrid scanner for use in an improved MDA tester.
  221. Tojo Toru (Yamato JPX) Sugihara Kazuyoshi (Kawasaki JPX), IC Tester using an electron beam capable of easily setting a probe card unit for wafers & packaged IC\s to be tested.
  222. Kiyokawa Toshiyuki (Kitakatsushika JPX) Hayama Hisao (Gyoda JPX), IC test equipment.
  223. Suzuki Kempei (Tokyo JPX) Iwanaga Yushi (Tokyo JPX) Sato Hiroshi (Tokyo JPX) Sato Kohei (Tokyo JPX) Igarashi Noriyuki (Tokyo JPX) Koya Shinichi (Tokyo JPX), IC test equipment.
  224. Kainuma Tadashi,JPX ; Masuda Noboru,JPX ; Nakajima Haruki,JPX ; Igarashi Noriyuki,JPX ; Nansai Yuichi,JPX, IC testing apparatus.
  225. Bell Theodore F. (c/o Norbell Corp. ; 400 Fentress Blvd. Daytona Beach FL 32014), Index table.
  226. Khoshaba Mushie (Elk Grove Village IL), Indexing chuck.
  227. Daniel L. Harris ; Peter R. McCann, Indexing rotatable chuck for a probe station.
  228. Harris, Daniel L.; McCann, Peter R., Indexing rotatable chuck for a probe station.
  229. Harris, Daniel L.; McCann, Peter R., Indexing rotatable chuck for a probe station.
  230. Spaziani Stephen (Nashua NH) Vaccaro Kenneth (Acton MA) Waters William (Bedford MA), Infrared receiver wafer level probe testing.
  231. Miyazawa Toshio,JPX ; Hatta Masataka,JPX ; Akiyama Masahiko,JPX, Inspecting method and apparatus for semiconductor integrated circuit.
  232. Nikawa Kiyoshi,JPX, Inspection method and wiring current observation method for semiconductor device and apparatus of the same.
  233. Kiyoshi Takekoshi JP, Inspection stage including a plurality of Z shafts, and inspection apparatus.
  234. Devoe, Daniel; Devoe, Alan; Devoe, Lambert, Integrated broadband ceramic capacitor array.
  235. Stockstad, Troy, Integrated circuit and method of controlling output impedance.
  236. Cole ; Jr. Edward I. (2116 White Cloud St. ; NE. Albuquerque NM 87112), Integrated circuit failure analysis by low-energy charge-induced voltage alteration.
  237. Schwartz Rodney E. (Tempe AZ) Wirick Glenn M. (Phoenix AZ) Rogers Gary B. (Mesa AZ), Integrated circuit probe card inspection system.
  238. Schwartz Rodney E. ; Wirick Glenn M. ; Rogers Gary B., Integrated circuit probe card inspection system.
  239. Snyder Delmer E. (Hillsboro OR) Veenendaal Cornelis T. (Cornelius OR) Creedon Theodore G. (Lake Oswego OR), Integrated circuit probe station.
  240. Boll Gregory G. (Naples FL) Boll Harry J. (Naples FL), Integrated circuit probing apparatus including a capacitor bypass structure.
  241. Hamburgen William R. (Menlo Park CA), Integrated circuit test fixture and method.
  242. Swapp Mavin C. (Gilbert AZ), Integrated circuit test with programmable source for both AC and DC modes of operation.
  243. Henderson Watson R. (Broomfield CO) Paurus Floyd G. (Boulder CO) Szerlip Stanley R. (Longmont CO), Integrated decoupling capacitive core for a printed circuit board and method of making same.
  244. Deckert Richard Allan ; Engelking Steven ; Evans Joey Dean, Integrated testing method and apparatus for semiconductor test operations processing.
  245. Reid Lee R. (Plano TX), Intelligent multiprobe tip.
  246. Cowan, Joseph W., Interconnector and method of connecting probes to a die for functional analysis.
  247. Cedrone Nicholas J. (Wellesley Hills MA) Lee Kenneth R. (Lincoln MA), Interface assembly for testing integrated circuit devices.
  248. Perry Charles H. (Poughkeepsie NY) Bauer Tibor L. (Hopewell Junction NY) Long David C. (Wappingers Falls NY) Pickering Bruce C. (Wappingers Falls NY) Vittori Pierre C. (Cold Spring NY), Interface card for a probe card assembly.
  249. Marcus, Michael A.; Lee, Jiann-Rong; Lowry, Donald R.; Trembley, Timothy M., Interferometric-based external measurement system and method.
  250. Bezos Jeffrey P. ; Kaphan Sheldon J. ; Ratajak Ellen L. ; Schonhoff Thomas K., Internet-based customer referral system.
  251. Back Gerald W. ; Mirowski Joseph A., Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits.
  252. Alani, Reza, Ion beam milling system and method for electron microscopy specimen preparation.
  253. Friend,Stephen H.; Stoughton,Roland; Linsley,Peter S.; Burchard,Julja, Iterative probe design and detailed expression profiling with flexible in-situ synthesis arrays.
  254. Miller Donald C. (1139 Blair Ave. Sunnyvale CA 94087) Isaac George L. (980 Kiely Blvd. #326 Santa Clara CA 95051), Kelvin chuck apparatus and method of manufacture.
  255. Akimoto Mitsuru (Kanagawa JPX) Jimbo Takamasa (Kanagawa JPX) Umemura Kiyoshi (Kanagawa JPX) Iwase Haruhiko (Kanagawa JPX) Ogawa Kenzirou (Kanagawa JPX), Laminated board for testing electronic components.
  256. Kister January (Palo Alto CA), Large scale protrusion membrane for semiconductor devices under test with very high pin counts.
  257. Park Sang-il (Palo Alto CA) Smith Ian R. (Los Gatos CA) Kirk Michael D. (San Jose CA), Large stage system for scanning probe microscopes and other instruments.
  258. Bruce, Victoria J., Laser intrusive technique for locating specific integrated circuit current paths.
  259. Wang,Shixin, Lift-out probe having an extension tip, methods of making and using, and analytical instruments employing same.
  260. Kirk Duane B., Light-tight enclosure and joint connectors for enclosure framework.
  261. Mileski Paul (Mystic CT) Kornblith Jeffrey (Mystic CT), Lightweight deployable antenna system.
  262. Maltabes John,DEX ; Charles Alain,DEX ; Mautz Karl,DEX, Lithography chuck having piezoelectric elements, and method.
  263. Fraser Douglas S. (Bloomingtion NY) Thompson ; Jr. Taylor N. (Kingston NY), Live component temperature conditioning device providing fast temperature variations.
  264. Sayre Tracy L. ; Slutz Robert A. ; Kanack Kris J., Loaded-board, guided-probe test fixture.
  265. Trant Edward ; Doran Robert ; Swift Philip W. ; Thelemann Carl, Lockable storage cradle for battery-operated electronic device.
  266. Taura Toru,JPX ; Inoue Hirobumi,JPX ; Tanehashi Masao,JPX ; Matsunaga Kouji,JPX ; Yamagishi Yuuichi,JPX ; Hayakawa Satoshi,JPX ; Tsugane Hironori,JPX, Longitudinal type high frequency probe for narrow pitched electrodes.
  267. Aisenbrey,Thomas, Low cost electronic probe devices manufactured from conductive loaded resin-based materials.
  268. Soar Steven E. (Vancouver WA), Low inductance ground lead.
  269. Ferlier Jean-Pierre (Yerres FRX), Low noise cable.
  270. Singles David T. (Newark DE) Walter Grant (Newark DE) Mortimer ; Jr. William P. (Conowingo MD), Low noise signal transmission cable.
  271. Tervo Paul A. ; Cowan Clarence E., Low-current pogo probe card.
  272. Schwindt Randy J., Low-current probe card with reduced triboelectric current generating cables.
  273. Schwindt Randy J., Low-current probe card with reduced triboelectric current generating cables.
  274. Boucher John N. (110 Coveridge La. Longwood FL 32779) Bajune David E. (6800 W. S.R. 46 Sanford FL 32773), Machine tool rotary table locking apparatus.
  275. Shin, Sung Chul; Choe, Sug Bong, Magneto-optical microscope magnetometer.
  276. Chong, Fu Chiung; Mok, Sammy, Massively parallel interface for electronic circuits.
  277. del Rio Eddy H. (Jupiter FL), Means to orbit and rotate target wafers supported on planet member.
  278. Mautz, Karl; Maltabes, John; Charles, Alain, Measurement chuck having piezoelectric elements and method.
  279. Mitchell David H. (Pacific Palisades CA) Mitchell Ralph M. (Pacific Palisades CA), Measurement of ligand/anti-ligand interactions using bulk conductance.
  280. Aguirre Donald G. (Kirtland AFB NM), Measurement of permittivity and permeability of microwave materials.
  281. Habu Satoshi (Hachioji JPX), Measuring cable and measuring system.
  282. Sepponen Raimo E. (Pitkansillanranta 7-9 C 111 00530 Helsinki 53 FIX), Medical diagnostic microwave scanning apparatus.
  283. Egitto,Frank D.; Miller,Keith J.; Nguyen,Manh Quan T., Membrane probe with anchored elements.
  284. Huff Richard E. (1408 Solana Dr. Belmont CA 94002) Perlaki Miklos (1406 Sage Rd. Colfax CA 95713), Membrane probe with automatic contact scrub action.
  285. Phillips James Patrick, Method and antenna for providing an omnidirectional pattern.
  286. Roman Vitenberg IL, Method and apparatus for RF common-mode noise rejection in a DSL receiver.
  287. Beckous,Frank R.; Czikora,Paul A.; Squires,John J., Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts.
  288. Bryan Elizabeth Ruth ; Deadwyler Murden K. ; Green David N. ; Heiertz James L. ; Murphy Hugh Joseph, Method and apparatus for amplifying electrical test signals from a micromechanical device.
  289. Cabot Richard C., Method and apparatus for asynchronously measuring frequency shifted signals.
  290. Graham Daniel J. ; Holt Alyn R. ; Matthiessen Robert E. ; Weilerstein I. Marvin ; West Christopher L., Method and apparatus for automated docking of a test head to a device handler.
  291. Bockelman David E. ; Eisenstadt William R., Method and apparatus for calibrating a network analyzer.
  292. Marcuse, Arno G.; Most, Robert A.; North, Edward S., Method and apparatus for cleaning electronic test contacts.
  293. Iknaian Russell (Groton MA) Watson ; Jr. Richard B. (Harvard MA), Method and apparatus for complete functional testing of a complex signal path of a semiconductor chip.
  294. Collins David R. (Eau Claire WI) Franz Perry D. (Elk Mound WI) Taylor Pamela W. (Eau Claire WI), Method and apparatus for cooling an integrated circuit chip during testing.
  295. Chapman, Robert G.; Hefti, John; Bartell, Barrett J.; Rhodes, Mark A.; Zhao, Min; Palmer, Tyler, Method and apparatus for detection of molecular events using temperature control of detection environment.
  296. Kaplan Russell ; Scherp Ralph, Method and apparatus for direct probe sensing.
  297. Thomas S. Tarter ; Nhon T. Do, Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station.
  298. Engelking Steven ; Deckert Richard Allan ; Evans Joey Dean, Method and apparatus for electrically testing semiconductor devices fabricated on a wafer.
  299. Chen Kuo-Chun (Birmingham MI), Method and apparatus for electromagnetic radiation of biological material.
  300. Horner Gregory S. ; Kleefstra Meindert J. ; Verkuil Roger L. ; Miles Robert A., Method and apparatus for establishing electrical contact between a wafer and a chuck.
  301. James Michael (Sunrise FL) Frazer James T. (Coral Springs FL) Scott David (Coral Springs FL), Method and apparatus for facilitating loop take time adjustment in multi-needle quilting machine.
  302. Lide Edward N. (Atlanta GA) Glidewell Samuel R. (Marietta GA), Method and apparatus for fastener hole inspection with a capacitive probe.
  303. Cheng David (711 Hibernia Ct. Sunnyvale CA 94087), Method and apparatus for handling wafers.
  304. Klingenbeck Klaus (Hessdorf DEX) Regn Judith (Nuremberg DEX), Method and apparatus for identifying the distribution of the dielectric constants in an object.
  305. Stewart John P. (King County WA) Seubert Ronald C. (King County WA) Snow Donald B. (King County WA), Method and apparatus for inspecting integrated circuit probe cards.
  306. Blaess Gerhard (Olching DEX), Method and apparatus for measurement of attenuation and distortion by a test object.
  307. Fryer Michael O. ; Hills Andrea J. ; Morrison John L., Method and apparatus for measuring butterfat and protein content using microwave absorption techniques.
  308. Martin Samuel Suresh, Method and apparatus for measuring electrical noise in devices.
  309. Heffner Brian L. (Redwood City CA), Method and apparatus for measuring polarization sensitivity of optical devices.
  310. Misra Devendra K. (Whitefish Bay WI), Method and apparatus for measuring the permittivity of materials.
  311. Adamian Vahe A. (Lexington MA), Method and apparatus for providing and calibrating a multiport network analyzer.
  312. Palkuti Leslie J. (Sunnyvale CA), Method and apparatus for radiation testing of electron devices.
  313. Milesky Lawrence (Needham MA) AbiChaker David G. (West Roxbury MA), Method and apparatus for sensing a fluid handling.
  314. Matsumoto, Chiaki, Method and apparatus for testing BGA-type semiconductor devices.
  315. Abercrombie David A. (Cedar Park TX) Waldo Whitson G. (Hutto TX), Method and apparatus for testing an integrated circuit.
  316. Hidehira,Yorio, Method and apparatus for testing circuit boards.
  317. Chiang Cheng-Lien,TWX, Method and apparatus for testing dies.
  318. Stratmann Martin (Meerbusch DEX) Streckel Heinz (Mettmann DEX), Method and apparatus for the measurement of the corrosion potential between a coated metal surface and a reference elect.
  319. Brady Michael John ; Duan Dah-Weih, Method and apparatus for wireless radio frequency testing of RFID integrated circuits.
  320. Burns Mark A. (Garland TX), Method and apparatus of eliminating interference in an undersettled electrical signal.
  321. Burns Mark, Method and apparatus to measure non-coherent signals.
  322. Lipp Robert J. (15881 Rose Ave. Los Gatos CA 95030), Method and apparatus to test for current in an integrated circuit.
  323. Nelson, Michael D.; Lesea, Austin H.; Agatep, Antolin S., Method and apparatus using a semiconductor die integrated antenna structure.
  324. Ross Guy (Quebec CAX), Method and electrical measuring apparatus for analyzing the impedance of the source of an actual alternating voltage.
  325. Nelson Randall D. (Sun Lakes AZ) Westbrook Gregory L. (Chandler AZ), Method and means for controlling movement of a chuck in a test apparatus.
  326. Mathieu,Gaetan L., Method and system for compensating thermally induced motion of probe cards.
  327. Hartman Peri ; Bezos Jeffrey P. ; Kaphan Shel ; Spiegel Joel, Method and system for placing a purchase order via a communications network.
  328. Hembree, David R., Method for aligning and connecting semiconductor components to substrates.
  329. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method for constructing a membrane probe using a depression.
  330. Abiko Tohru,JPX, Method for detecting a contact position between an object to be measured and measuring pins.
  331. John Hefti, Method for detecting and classifying nucleic acid hybridization.
  332. Feldberg Simon,ILX, Method for enumerating bacterial populations.
  333. Matsunaga,Noriaki; Shibata,Hideki; Hayasaka,Nobuo, Method for fabricating a probe pin for testing electrical characteristics of an apparatus.
  334. Kouji Matsunaga JP; Hirobumi Inoue JP; Masao Tanehashi JP; Toru Taura JP; Masahiko Nikaidou JP; Yuuichi Yamagishi JP; Satoshi Hayakawa JP, Method for fabricating probe tip portion composed by coaxial cable.
  335. Elder Richard A. (Dallas TX) Wilson Arthur M. (Dallas TX) Bagen Susan V. (Dallas TX) Miller Juanita G. (Richardson TX), Method for fabrication of probe card for testing of semiconductor devices.
  336. Anderson Karl F., Method for guarding electrical regions having potential gradients.
  337. Smyth ; Jr. John B. (Corvallis OR) Tappon Ellen R. (Corvallis OR), Method for making flexible circuit card with laser-contoured vias and machined capacitors.
  338. Singles David T. (Newark DE) Walter Grant (Newark DE) Mortimer ; Jr. William P. (Conowing MD), Method for making low noise signal transmission cable.
  339. Mautz Karl Emerson, Method for measuring a characteristic of a semiconductor wafer using cylindrical control.
  340. Fyfield, Margaret S., Method for probing a semiconductor wafer.
  341. Thomas M. Moore ; Rocky D. Kruger ; Cheryl Hartfield, Method for sample separation and lift-out with one cut.
  342. Reginald Hunter, Method for sensing conditions within a substrate processing system.
  343. Arwin ; Hans R. ; Lundstrom ; Kurt I., Method for studying enzymatic and other biochemical reactions.
  344. Strunk Timothy L. (Lexington KY) Westerman Glenn S. (Lexington KY), Method for testing DC motors.
  345. Swapp Mavin C. (Gilbert AZ), Method for testing integrated devices.
  346. Peter Nayler FR; Nicholas Smears FR; Philippe Planelle FR, Method for the calibration of an RF integrated circuit probe.
  347. Cheng David (711 Hibernia Ct. Sunnyvale CA 94087), Method for transporting and testing wafers.
  348. Kouno Motohiro (Kyoto JPX) Nakatani Ikuyoshi (Kyoto JPX) Sakai Takamasa (Kyoto JPX), Method of and apparatus for measuring electric characteristics of semiconductor wafer.
  349. Taraci Brian, Method of batch testing surface mount devices using a substrate edge connector.
  350. Kamitani, Gaku, Method of correcting measurement error and electronic component characteristic measurement apparatus.
  351. Hyakudomi, Takanori, Method of delivering target object to be processed, table mechanism of target object and probe apparatus.
  352. Martin,Samuel S.; Baker,Brian R., Method of establishing benchmark for figure of merit indicative of amplifier flicker noise.
  353. Strid Eric W. (Portland OR) Schappacher Jerry B. (Portland OR) Carlton Dale E. (Portland OR) Gleason K. Reed (Portland OR), Method of evaluating signal conditions in a probe measurement network having a plurality of separate measurement channel.
  354. Yamaguchi Masao (Tokyo JPX), Method of identifying probe position and probing method in prober.
  355. Woith Blake F. (Orange CA) Pasiecznik ; Jr. John (Malibu CA) Crumly William R. (Anaheim CA) Betz Robert K. (Long Beach CA), Method of making a cast elastomer/membrane test probe assembly.
  356. Ackerman David A. (Hopewell NJ) Camarda Renato M. (Fanwood NJ) Hartman Robert L. (Warren NJ) Spector Magaly (Wyomissing PA), Method of manufacturing high-quality semiconductor light-emitting devices.
  357. Nishioka Tadashi (Itami JPX), Method of mounting a semiconductor element for analyzing failures thereon.
  358. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
  359. Takahashi Hironori (Hamamatsu JPX) Aoshima Shinichiro (Hamamatsu JPX) Hirano Isuke (Hamamatsu JPX) Tsuchiya Yutaka (Hamamatsu JPX), Method of positioning an electrooptic probe of an apparatus for the measurement of voltage.
  360. Lee William T. (San Jose CA) Soetarman Ronny (San Jose CA) Talbot Christopher G. (Menlo Park CA), Method of probing a net of an IC at an optimal probe-point.
  361. Lefever Douglas D. ; Bustos Larry James, Method of processing a substrate including measuring for planarity and probing the substrate.
  362. Collins Kenneth S. ; Buchberger Douglas, Method of processing a wafer within a reaction chamber.
  363. Khoury Theodore Andrew ; Goode Raun L. ; Bustos Larry J., Method of testing a semiconductor device by automatically measuring probe tip parameters.
  364. Pearce Charles Walter ; Billig Michael Steven, Method to selectively heat semiconductor wafers.
  365. Aitren, John M.; Chen, Fen; Condon, Kevin L.; Dionne, Mark F.; Nuttall, Gregory E., Methodology and apparatus using real-time optical signal for wafer-level device dielectrical reliability studies.
  366. Swartz Harold M. ; Goda Fuminori ; Walczak Tadeusz ; Liu Ke Jian, Methodology for determining oxygen in biological systems.
  367. Hershel, Ron; Campbell, Rich; Killeen, Timothy S.; Snow, Donald B., Methods and apparatus for determining the relative positions of probe tips on a printed circuit board probe card.
  368. Wach Michael Leonard ; Marple Eric Todd, Methods and apparatus for filtering an optical fiber.
  369. Gordon Gary B. ; Dellinger Douglas J., Methods and devices for carrying out chemical reactions.
  370. Hefti, John, Methods for analyzing protein binding events.
  371. McLean, James S., Metrology antenna system utilizing two-port, sleeve dipole and non-radiating balancing network.
  372. Cherian,Gabe, Micro probe.
  373. Roch Jacques Leon (Half Moon Bay CA), Micro-circuit test probe.
  374. Miller Vernon R. (Atlanta GA) Roberts Lincoln E. (Decatur GA), Microelectronic burn-in system.
  375. DeNure Charles R., Microscope collision protection apparatus.
  376. Marzan Jose M. (Northridge CA), Microstrip probe.
  377. Murphy Earl R. (Scottsdale AZ), Microstrip to waveguide transition.
  378. Lo Chiwoei Wayne ; Perez Pierre, Microstructure defect detection.
  379. Faxvog Frederick R. (Rochester MI) Krage Mark K. (Royal Oak MI), Microwave acoustic spectrometer.
  380. Bridges Jack E. ; Taflov Allen ; Hagness Susan C. ; Sahakian Alan, Microwave antenna for cancer detection system.
  381. Kasevich Raymond S. ; Selkowitz Stuart M., Microwave devices for medical hyperthermia, thermotherapy and diagnosis.
  382. Bridges Jack E., Microwave method and system to detect and locate cancers in heterogenous tissues.
  383. Kashima Yukiro,JPX, Microwave mixing circuit.
  384. King Ray J. (Pleasanton CA) King Karl V. (Pleasanton CA), Microwave needle dielectric sensors.
  385. Bereskin Alexander B. (452 Riddle Rd. Cincinnati OH 45220), Microwave test fixtures for determining the dielectric properties of a material.
  386. Larsen Lawrence E. (Silver Spring MD) Jacobi John H. (Bowie MD), Microwave time delay spectroscopic methods and apparatus for remote interrogation of biological targets.
  387. Svenson Robert H. ; Semenov Serguei Y.,RUX ; Baranov Vladimir Y.,RUX, Microwave tomographic spectroscopy system and method.
  388. Gleason K. Reed (Portland OR) Jones Keith E. (Beaverton OR) Strid Eric W. (Portland OR), Microwave wafer probe having replaceable probe tip.
  389. Dalman G. Conrad (Ithaca NY) Kondoh Hiroshi (Ithaca NY), Millimeter wave vector network analyzer.
  390. Lo Jiann-Chang ; Servedio Michael ; Hammond James Michael, Miniature probe positioning actuator.
  391. Eager George (Cambridge MA) Schey Thomas J. (Woonsocket RI) Selverstone Peter (Cambridge MA), Mixing valve air source.
  392. Adams Leon K. (San Jose CA) Aleshi Rassoul R. (San Jose CA), Modifiable IC board.
  393. Clarke Norman B. (Pleasant Valley NY) Cook Lawrence G. (Poughkeepsie NY) Doyle Robert G. (Poughkeepsie NY) Renner Michael (Highland NY), Molded test probe assembly.
  394. Eggers Mitchell D. (10 Plum Ct. The Woodlands TX 77381) Hogan Michael E. (103 Golden Shadow Cir. The Woodlands TX 77381) Beattie Kenneth Loren (2 Hollymead Dr. The Woodlands TX 77381) Shumaker John (, Multi site molecule detection method.
  395. Buchoff Leonard S. (Bloomfield NJ) Dalamangas Chris A. (Union NJ), Multi-conductor probe.
  396. Satya, Akella V. S.; Adler, David L.; Tsai, Bin-Ming Benjamin; Walker, David J., Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices.
  397. Phillips James P. (Lake in the Hills IL) Krenz Eric L. (Crystal Lake IL), Multi-port radio frequency signal transformation network.
  398. Leong Tony P. (San Jose CA) North Edward S. (Los Altos CA) Herbst Richard L. (Palo Alto CA), Multi-wavelength laser system, probe station and laser cutter system using the same.
  399. Leong Tony P. ; North Edward S. ; Herbst Richard Linsley, Multi-wavelength laser system, probe station and laser cutter system using the same.
  400. Leong Tony P. ; North Edward S. ; Herbst Richard Linsley, Multi-wavelength variable attenuator and half wave plate.
  401. Arnold Allen J. (LaGrangeville NY) Bariether Michael E. (LaGrangeville NY) Chiang Shin-Wu (Hopewell Junction NY) Dalal Hormazdyar M. (Wappingers Falls NY) Miller Robert A. (Walden NY) Montegari Frank, Multilayer capacitor.
  402. Hafeman Dean G. (San Bruno CA) McConnell Harden M. (Stanford CA), Multiple chemically modulated capacitance determination.
  403. Hunter, Bradley L., Multiple degree of freedom substrate manipulator.
  404. Altmann, Stephen Maximilian; Hörber, Johann Karl Heinrich, Multiple local probe measuring device and method.
  405. Hwang,David, Multiple two axis floating probe block assembly using split probe block.
  406. Rincon,Reynaldo M.; Arnold,Richard W., Multiple-chip probe and universal tester contact assemblage.
  407. Schaper Charles D. ; El-Awady Khalid A. ; Kailath Thomas, Multizone bake/chill thermal cycling module.
  408. Choma ; Jr. John (Hacienda Heights CA), NPN Operational amplifier.
  409. Mitsuoka,Yasuyuki; Chiba,Norio; Kasama,Nobuyuki; Niwa,Takashi; Nakajima,Kunio, Near-field optical probe.
  410. Yu, Hyun-Sik; Choi, Ji-Man; Shin, In-Dae, Needle fixture of a probe card in semiconductor inspection equipment and needle fixing method thereof.
  411. Smith Thane (Middletown MD) Huang Ho-Chung (Potomac MD) Lee Chi Hsiang (Potomac MD), Non-destructive semiconductor wafer probing system using laser pulses to generate and detect millimeter wave signals.
  412. Bridges Jack E., Non-invasive system for breast cancer detection.
  413. Chiron Bernard (Paris Cedex FR) DE Vecchis Michel (Paris Cedex FR), Non-reciprocal broadband slot line device.
  414. Sawyer David E. (Rockville MD), Nondestructive method for detecting defects in photodetector and solar cell devices.
  415. Abe Keietsu (Noda JPX) Hashiba Hironaga (Noda JPX) Uchida Kinji (Nagareyama JPX), Novel variant and process for producing light colored soy sauce using such variant.
  416. Wang,Changting; Plotnikov,Yuri Alexeyevich; Nath,Shridhar Champaknath; McKnight,William Stewart; Gambrell,Gigi Olive, Omnidirectional eddy current probe and inspection system.
  417. Hollis Mark A. (Concord MA) Ehrlich Daniel J. (Lexington MA) Murphy R. Allen (Boxboro MA) Kosicki Bernard B. (Acton MA) Rathman Dennis D. (Ashland MA) Chen Chang-Lee (Sudbury MA) Mathews Richard H. (, Optical and electrical methods and apparatus for molecule detection.
  418. Hollis Mark A. ; Ehrlich Daniel J. ; Murphy R. Allen ; Kosicki Bernard B. ; Rathman Dennis D. ; Mathews Richard H. ; Burke Barry E. ; Eggers Mitch D. ; Hogan Michael E. ; Varma Rajender Singh, Optical and electrical methods and apparatus for molecule detection.
  419. Ravel Mihir K. (Portland OR) Jones Michael D. (Portland OR) Pepper Steven H. (Portland OR), Optical module for an optically based measurement system.
  420. Johannessen,Kjetil, Optical probe for wafer testing.
  421. Harris, Daniel L.; McCann, Peter R., Optical testing device.
  422. Lee William T. (San Jose CA) Soetarman Ronny (San Jose CA) Talbot Christopher Graham (Menlo Park CA), Optimal probe point placement.
  423. Mullen Ruth A. (Malibu CA), Opto-electronic membrane probe.
  424. Nikawa Kiyoshi,JPX, Parasitic MIM structural spot analysis method for semiconductor device and parasitic MIM structure spot analysis method for silicon semiconductor device.
  425. Godfrey Mark K. ; Crane Jesse G. ; Zadworniak Paul ; Marinac Daniel C, Peripherally leaded package test contactor.
  426. Fichtenbaum Matthew L. (Chelmsford MA), Phase change detection method of and apparatus for current-tracing the location of faults on printed circuit boards and.
  427. Rauscher Christen (Alexandria VA), Photoconductive circuit element reflectometer.
  428. Smith ; III Richard S., Photonic field probe and calibration means thereof.
  429. Viswanath Ram S., Pickup chuck with an integral heat pipe.
  430. Knibbe Jan C. (Detroit MI) McPhee Willard J. (Bloomfield Hills MI), Piercing apparatus.
  431. Veenendaal Cornelis T. (Cornelius OR), Piezoelectric pressure sensing apparatus for integrated circuit testing stations.
  432. Bryson Stephen W. (Cupertino CA) Kondo Alan T. (Cupertino CA) Lee Don N. (San Jose CA), Pin driver amplifier.
  433. Mahler,Wolfgang; Landstorfer,Friedrich; Motzer,J체rgen, Planar antenna and antenna system.
  434. Gaspari Russell A. (6656 W. 87th Place Los Angeles CA 90045), Planar balun.
  435. Carney Eric Lane, Planarity verification system for integrated circuit test probes.
  436. Mauney Terry Lee (25 Cross Ridge Ct. Germantown MD 20874), Plant growing system.
  437. Anderson Richard L. (Austin TX), Pneumatic energy fluxmeter.
  438. Anderson Richard L. (Austin TX), Pneumatic energy fluxmeter.
  439. Lass Bennett D. (85 Harman Rd. Edison NJ 08837), Portable collapsible darkroom.
  440. Colvin James Barry, Portable emission microscope workstation for failure analysis.
  441. Wardwell Robert H., Portable wedge probe for perusing signals on the pins of an IC.
  442. Inoue Mitsuru (Utsunomiya JPX), Positioning stage device exposure apparatus and device manufacturing method utilizing the same.
  443. Li Du ; Zou Rose, Preparation of transmission electron microscope samples.
  444. Rath Dale R. (Gales Creek OR), Pressure control apparatus for use in an integrated circuit testing station.
  445. Aksu Akin (739 E. 223rd St. Carson CA 90745), Printed circuit board testing means.
  446. Yamashita Satoru (Kofu JPX), Probe apparatus.
  447. Takebuchi, Ryuichi, Probe apparatus and method of alignment for the same.
  448. Mori, Shigeoki; Karasawa, Wataru, Probe apparatus for probing an object held above the probe card.
  449. Abe Yuichi (Tokyo JPX) Yamaguchi Masao (Tokyo JPX) Nagasaka Munetosi (Yamanashi-ken JPX), Probe apparatus for testing multiple integrated circuit dies.
  450. Mochizuki Kohei (Tokyo JPX) Habu Satoshi (Tokyo JPX), Probe apparatus for use in both high and low frequency measurements.
  451. Mochizuki Kohei,JPX ; Habu Satoshi,JPX, Probe apparatus with RC circuit connected between ground and a guard.
  452. Mori Shigeoki (Ayase CA JPX) Karasawa Wataru (Cupertino CA) Fujihara Hitoshi (Yamanashi JPX) Suzuki Masaru (Kofu JPX) Yokota Keiichi (Nirasaki JPX), Probe apparatus with a swinging holder for an object of examination.
  453. Nakajima Hisashi,JPX ; Yoshioka Haruhiko,JPX, Probe apparatus with tilt correction mechanisms.
  454. Kvaternik Joseph (Belmont CA), Probe arm.
  455. Sharif, Adam K., Probe card and probe needle for high frequency testing.
  456. David R. Hembree ; Warren M. Farnworth ; Salman Akram ; Alan G. Wood ; C. Patrick Doherty ; Andrew J. Krivy, Probe card and test system for semiconductor wafers.
  457. Higgins H. Dan, Probe card apparatus.
  458. Perry Charles H. (Poughkeepsie NY) Bauer Tibor L. (Hopewell Junction NY) Long David C. (Wappingers Falls NY) Pickering Bruce C. (Wappingers Falls NY) Vittori Pierre C. (Cold Spring NY), Probe card assembly.
  459. Perry Charles H. (Poughkeepsie NY) Bauer Tibor L. (Hopewell Junction NY) Long David C. (Wappingers Falls NY) Pickering Bruce C. (Wappingers Falls NY) Vittori Pierre C. (Cold Spring NY), Probe card assembly having a ceramic probe card.
  460. Yamagata Kazumi,JPX, Probe card attaching mechanism.
  461. Sinsheimer Roger (Petaluma CA) Richards Tom (Petaluma CA), Probe card changer system and method.
  462. Boll, Harry J.; Boll, Gregory G., Probe card for high speed testing.
  463. Hembree David R. ; Farnworth Warren M. ; Akram Salman ; Wood Alan G. ; Doherty C. Patrick ; Krivy Andrew J., Probe card for semiconductor wafers and method and system for testing wafers.
  464. Yoon,Soo, Probe card for testing semiconductor device.
  465. Mochizuki Jun,JPX, Probe card having separated upper and lower probe needle groups.
  466. Anderson James C. (Santa Rosa CA) Phillips Brian P. (Glenn Ellen CA) Honek Charles (Santa Rosa CA), Probe card system and method.
  467. Fink,Steven T.; Windhorn,Thomas H., Probe cartridge assembly and multi-probe assembly.
  468. Matsumoto,Toshiko; Nakashige,Ryo; Nozaki,Yasuyuki; Ueno,Shingo; Tamura,Takuro, Probe designing apparatus and probe designing method.
  469. Kawaguchi, Koji; Shimizu, Masashi, Probe device.
  470. Sano Kunio (Nakakoma-gun JPX), Probe device.
  471. Tarzwell John W. (Phoenix AZ), Probe device for integrated circuit wafers.
  472. Hayden, Leonard; Rumbaugh, Scott; Andrews, Mike, Probe for combined signals.
  473. Hayden, Leonard; Rumbaugh, Scott; Andrews, Mike, Probe for combined signals.
  474. Furuta Masaji,JPX ; Yanagawa Koichi,JPX, Probe for measuring signals.
  475. McMurtry David R. (Wotton-Under-Edge GBX) Thomas David K. (Stinchcombe GBX), Probe for measuring surface roughness by sensing fringe field capacitance effects.
  476. Kreiger Walter C. (Underhill VT) Wilder Donald L. (South Hero VT), Probe for wafer burn-in test system.
  477. Aksu ; Akin, Probe head for testing printed circuit boards.
  478. Schwindt Randy, Probe holder for low current measurements.
  479. Costello Matthew J., Probe holder for low voltage, low current measurements in a water probe station.
  480. Sorna Michael A. (Poughkeepsie NY) Papae Donald J. (Hopewell Junction NY), Probe interface assembly.
  481. Chaya,Hiromi; Hayashi,Takahisa; Komatsu,Shigekazu, Probe mark reading device and probe mark reading method.
  482. Tanaka Hideaki,JPX ; Akaike Shinji,JPX ; Marumo Yoshihito,JPX, Probe method and apparatus with improved probe contact.
  483. Mizuta Masaharu,JPX, Probe needle for vertical needle type probe card and fabrication thereof.
  484. Okumura,Katsuya; Furuya,Kunihiro, Probe pins zero-point detecting method, and prober.
  485. Navratil, Peter; Froemke, Brad; Stewart, Craig; Lord, Anthony; Spencer, Jeff; Runbaugh, Scott; Fisher, Gavin; McCann, Pete; Jones, Rod, Probe station.
  486. Tracy ; John M., Probe station.
  487. Brown John ; Costello Matthew J. ; DosSantos Luciano P. ; Ruck Robin, Probe station adapter for backside emission inspection.
  488. Streib George H. ; Schwindt Randy J., Probe station for low current, low voltage parametric measurements using multiple probes.
  489. Schwindt Randy (Portland OR), Probe station having conductive coating added to thermal chuck insulator.
  490. Peters Ron A., Probe station having environment control chamber with bendably extensible and retractable lateral wall assembly.
  491. Peters Ron A., Probe station having environment control chambers with orthogonally flexible lateral wall assembly.
  492. Peters Ron A. ; Hayden Leonard A. ; Hawkins Jeffrey A. ; Dougherty R. Mark, Probe station having inner and outer shielding.
  493. Peters Ron A. ; Hayden Leonard A. ; Hawkins Jeffrey A. ; Dougherty R. Mark, Probe station having inner and outer shielding.
  494. Peters, Ron A.; Hayden, Leonard A.; Hawkins, Jeffrey A.; Dougherty, R. Mark, Probe station having multiple enclosures.
  495. Peters, Ron A.; Hayden, Leonard A.; Hawkins, Jeffrey A.; Dougherty, R. Mark, Probe station having multiple enclosures.
  496. Ron A. Peters ; Leonard A. Hayden ; Jeffrey A. Hawkins ; R. Mark Dougherty, Probe station having multiple enclosures.
  497. Ron A. Peters ; Leonard A. Hayden ; Jeffrey A. Hawkins ; R. Mark Dougherty, Probe station having multiple enclosures.
  498. Clarence E. Cowan ; Paul A. Tervo ; John L. Dunklee, Probe station thermal chuck with shielding for capacitive current.
  499. Cowan, Clarence E.; Tervo, Paul A.; Dunklee, John L., Probe station thermal chuck with shielding for capacitive current.
  500. Dunklee,John; Cowan,Clarence E., Probe station with low inductance path.
  501. Lesher, Timothy; Miller, Brad; Cowan, Clarence E.; Simmons, Michael; Gray, Frank; McDonald, Cynthia L., Probe station with low noise characteristics.
  502. Hiroshi Noda JP, Probe stylus.
  503. Kuji Motohiro (Yamanashi-ken JPX) Yoshioka Haruhiko (Yamanashi-ken JPX) Akaike Shinji (Kofu JPX) Takahashi Shigeaki (Yamanashi-ken JPX), Probe system and probe method.
  504. Boll Gregory George ; Boll Harry Joseph, Probe tip structure.
  505. Donald A Whiteman, Probe tip terminating device providing an easily changeable feed-through termination.
  506. Kitahata, Hideki, Prober and apparatus for semiconductor chip analysis.
  507. Kanao Tsuyoshi,JPX ; Eguchi Koji,JPX ; Yamaguchi Toru,JPX, Prober and electric evaluation method of semiconductor device.
  508. Watts Michael P. C. (Portola Valley CA) Hendler Lawrence (Cupertino CA), Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane.
  509. Sinsheimer Roger, Prober-tester electrical interface for semiconductor test.
  510. Sakai Takamasa (Kusatsu JPX) Kono Motohiro (Kyoto JPX) Umaba Takayuki (Kusatsu JPX) Nakagawa Yoshiyuki (Kyoto JPX) Koyama Yoshihiro (Takatsuki JPX), Probing apparatus for measuring electrical characteristics of semiconductor device formed on wafer.
  511. Kasukabe, Susumu; Hasebe, Akio, Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof.
  512. Fujihara Hitoshi (Yamanashi JPX) Takao Itaru (Yamanashi JPX), Probing device setting a probe card parallel.
  513. Kobayashi,Masahito; Ishii,Kazunari, Probing method and probing apparatus.
  514. Sun, Luen-Chian, Probing of device elements.
  515. Ohno Akira (Yamanashi JPX) Ohtsuka Tetsuo (Kawasaki JPX) Matsumoto Naotaka (Tama JPX), Probing test device.
  516. Nosov Eugene (Omaha NE), Process and apparatus for microwave diagnostics and therapy.
  517. Mate Jean-Luc (Toulouse FRX), Process and processing circuit for the analog output signal of a sensor.
  518. Higgins J. Aiden (Westlake Village CA) Walton ; Jr. Emory R. (Thousand Oaks CA), Process for making a probe for high speed integrated circuits.
  519. Wakabayashi Hidechika,JPX ; Takahashi Toru,JPX ; Sakamoto Masaru,JPX ; Sano Rieko,JPX, Process for preparing water-soluble tricarboxypolysaccharide.
  520. Verkuil Roger L., Product wafer junction leakage measurement using corona and a kelvin probe.
  521. Paul Bryant ; Martin Silverstein ; Larry W. Fullerton, Programmable active microwave ultrafine resonance spectrometer (PAMURS) method and systems.
  522. Akins ; Jr. Robert E. (Ashford CT) Tuan Rocky S. (Chester Springs PA), Protein assay using microwave energy.
  523. Richard K. Williams ; Robert Blattner, Pseudo-Schottky diode.
  524. Thornton ; Jr. Max C. (Palm Bay FL) Kuntz Paul (Melbourne FL) Meyer Russell L. (Melbourne FL) Rosier Kenneth M. (Rockledge FL), Pulsed linear integrated circuit tester.
  525. Michael R. Bruce ; Victoria J. Bruce ; Jeffrey D. Birdsley ; Rosalinda M. Ring ; Rama R. Goruganthu ; Brennan V. Davis, Quadrant avalanche photodiode time-resolved detection.
  526. Guo Wendy W. (10618 Tanager La. Potomac MD 20854) Guo Theodore C. (10618 Tanager La. Potomac MD 20854), Quantitative dielectric imaging system.
  527. Anlage, Steven Mark; Steinhauer, David E.; Vlahacos, Constantine P.; Wellstood, Frederick C., Quantitative imaging of dielectric permittivity and tunability.
  528. Hopkins,Michael; Heynen,Paul, Radio frequency Langmuir probe.
  529. Tsukii Toshikazu (Santa Barbara CA), Radio frequency energy launcher.
  530. Ishikawa Osamu (Soraku-gun JPX) Takehara Hiroyasu (Katano JPX), Radio frequency probe and probe card including a signal needle and grounding needle coupled to a microstrip transmission.
  531. Fuller Milton E. ; Deamer David W. ; Iverson Mark N. ; Koshy ; deceased Ajit J., Radio frequency spectral analysis for in-vitro or in-vivo environments.
  532. Davis, Brennan V., Real-time photoemission detection system.
  533. Strid, Eric W.; Schappacher, Jerry B.; Carlton, Dale E.; Gleason, K. Reed, Reference transmission line junction for probing device.
  534. Heaton Dale A. (Garland TX) Bartling James E. (Allen TX), Relayless interconnections in high performance signal paths.
  535. Fenton Jay Thomas, Repeatably positionable nozzle assembly.
  536. Lee Jerry L. (South San Gabriel CA), Replaceable tip test probe.
  537. John Hefti, Resonant bio-assay device and test system for detecting molecular binding events.
  538. Inuta Kazuo (Yokaichi JPX), Rotary board treating apparatus.
  539. Yanagisawa Ken (Matsumoto JPX), Rotary drive positioning system for an indexing table.
  540. Sago Hiroyoshi (Kanagawa JPX) Mizuki Hideyuki (Kanagawa JPX) Kudo Katsuhiko (Kanagawa JPX), Rotary-cup coating apparatus.
  541. Demand Erhart E. (Boston MA), Rotatable inspection table.
  542. Teramachi Hiroshi (34-8 ; Higashitamagawa 2-chome Setagaya-ku ; Tokyo JPX), Rotational positioning device.
  543. Talambiras Robert P. (Springfield NJ), Sampling network analyzer with stored correction of gain errors.
  544. Mahant-Shetti Shivaling S. (Richardson TX) Aton Thomas J. (Dallas TX) Gale Rebecca J. (Richardson TX), Scanning electron microscope based parametric testing method and apparatus.
  545. Linker Frederick I. (Menlo Park CA) Kirk Michael D. (San Jose CA) Alexander John D. (Sunnyvale CA) Park Sang-il (Palo Alto CA) Park Sung-il (San Jose CA) Smith Ian R. (Los Gatos CA), Scanning probe microscope.
  546. Peach Robert,CAX ; Svensson Nicholas,CAX ; Vo Thai,CAX, Scattering parameter calibration system and method.
  547. Falk Robert Aaron, Schlieren method for imaging semiconductor device properties.
  548. McPherson Hugh (Milnathort GB6), Security system and signal carrying member thereof.
  549. Huff Richard E. (Belmont CA) Matta Farid (Mountain View CA), Self-leveling membrane probe.
  550. Nikawa Kiyoshi,JPX, Semiconductor device evaluation system using optical fiber.
  551. Kang,Tae Jin; Lee,Woon Bok, Semiconductor device for reducing the number of probing pad used during wafer test and method for testing the same.
  552. Akram Salman ; Hembree David R., Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect.
  553. Takahashi Kazuo (Tokyo JPX), Semiconductor printing apparatus with multiple independent temperature control.
  554. Hembree David R. ; Akram Salman, Semiconductor probe card having resistance measuring circuitry and method fabrication.
  555. Manku Tajinder (Nepean CAX) Song Wenyi (Ottawa CAX), Semiconductor test chip with on wafer switching matrix.
  556. Obikane Tadashi,JPX ; Hayashi Eiji,JPX ; Koshi Ryoichiro,JPX, Semiconductor wafer probing apparatus.
  557. Davis ; Jr. James C. (Carlisle MA), Sensor for articles such as wafers on end effector.
  558. Wirz Arno (Bammental DEX), Sheet-fed rotary printing machine with printing units arranged in tandem.
  559. Coccioli, Roberto; Megahed, Mohamed A.; Trinh, Trang N.; Vittorini, Larry D.; Walley, John S., Shielded antenna in a semiconductor package.
  560. Rabinowitz Mario (Redwood City CA) Perry E. Robert (Portola Valley CA), Shielded electrical cable.
  561. Smith Kenneth L. (23 Barberry La. Meriden CT 06450), Shielded radio frequency transmission cable.
  562. Ryan Carl R. (Gilbert AZ), Signal probe.
  563. Lahr Roy J. (Sierra Madre CA), Signal processing system.
  564. Bruce, Michael R.; Goruganthu, Rama R., Single point high resolution time resolved photoemission microscopy system and method.
  565. Self, Bob J.; Hall, Kevin M, Single point probe structure and method.
  566. Edward J. Hager ; Rondal K. Harmon, Jr., Single tip Kelvin probe.
  567. Rahmel Richard J. (Monroe NY) Strinkovsky Leonid (Spring Valley NY), Slide positioning and holding device.
  568. MacGee Andrew (Cincinnati OH), Sliding duct seal.
  569. Drake Robert E. (Somers NY) Faris Sadeg M. (Pleasantville NY) Patt Roy M. (Walden NY) Shen Zhi-Yuan (Ossining NY), Soft probe for providing high speed on-wafer connections to a circuit.
  570. Mazur Robert G. ; Stephenson Robert C. ; Andy Mark J. ; Hartford Catherine L. ; Rogers John R., Spreading resistance profiling system.
  571. Satya, Akella V. S.; Adler, David L.; Richardson, Neil; Pinto, Gustavo A.; Walker, David J., Stepper type test structures and methods for inspection of semiconductor integrated circuits.
  572. Mehltretter, Ludwig, Structural antenna for flight aggregates or aircraft.
  573. Platz Albin (Ried-Baindlkirch DEX) Schweitzer Klaus (Niederpoecking DEX) Adam Peter (Dachau DEX), Structural component with a protective coating having a nickel or cobalt basis and method for making such a coating.
  574. Coccioli, Roberto; Megahed, Mohamed; Hashemi, Hassan S., Structure and method for fabrication of a leadless chip carrier with embedded antenna.
  575. Yuasa,Mitsuhiro, Substrate processing device and processing method.
  576. Cadwallader Robert H. ; Morrison Thomas ; Probst Klaus,DEX ; Yager William A., Substrate tester location clamping, sensing, and contacting method and apparatus.
  577. Leich, Martin; Schlectweg, Michael, Supply voltage decoupling device for HF amplifier circuits.
  578. Dunklee,John, Switched suspended conductor and connection.
  579. Woollam, John A.; Pfeiffer, Galen L.; Thompson, Daniel W.; Johs, Blaine D.; Herzinger, Craig M., System and method enabling simultaneous investigation of sample with two beams of electromagnetic radiation.
  580. Piety Richard W. ; Bowers ; III Stewart V. ; Gaddis David Q., System and method for measuring and analyzing electrical signals on the shaft of a machine.
  581. Boe Barbara J. ; Hamrick Julia M. ; Aarant Marjorie L., System and method for profiling customers for targeted marketing.
  582. Godfrey Gary M., System and method for tasking processing modules based upon temperature.
  583. Johnsgard Kristian E. ; Mattson Brad S. ; McDiarmid James ; Zeitlin Vladimir J., System and method for thermal processing of a semiconductor substrate.
  584. Cook, Donald J.; Allard, Harvey, System for and method of testing a microelectronic device using a dual probe technique.
  585. Shibata, Atsushi; Koike, Takeshi, System for driving rotary member in vacuum.
  586. Strid Eric W. (Portland OR) Schappacher Jerry B. (Portland OR) Carlton Dale E. (Portland OR) Gleason K. Reed (Portland OR), System for evaluating probing networks.
  587. Strid Eric W. ; Schappacher Jerry B. ; Carlton Dale E. ; Gleason K. Reed, System for evaluating probing networks.
  588. Strid Eric W. ; Schappacher Jerry B. ; Carlton Dale E. ; Gleason K. Reed, System for evaluating probing networks.
  589. Strid Eric W. ; Schappacher Jerry B. ; Carlton Dale E. ; Gleason K. Reed, System for evaluating probing networks that have multiple probing ends.
  590. Carlton Dale E. (Portland OR) Jones Keith E. (Aloha OR) Myers Thomas A. (Beaverton OR), System for facilitating planar probe measurements of high-speed interconnect structures.
  591. Sigler Michael R. (Colorado Springs CO), System for locating probe tips on an integrated circuit probe card and method therefor.
  592. Strid Eric W. (Portland OR) Jones Keith E. (Beaverton OR), System for setting reference reactance for vector corrected measurements.
  593. Kreimer, David I.; Yevin, Oleg A.; Weber, Robert, Systems and methods for filter based spectrographic analysis.
  594. Das,Gobinda; Motika,Franco, TFI probe I/O wrap test method.
  595. Hadwin Matthew J. (Battleground WA) Garcia John D. (Vancouver WA) Harry Emory J. (Aloha OR), Telescoping pin probe.
  596. Nolan Charles C. (Sunnyvale CA) Sahr Stuart (Wickenburg AZ), Temperature conditioner for tests of unpackaged semiconductors.
  597. Moulene, Daniel; Gourdon, Pierre, Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support.
  598. Eager George (Cambridge MA) Selverstone Pater (Cambridge MA), Temperature control for device under test.
  599. Burton David P. (Parteen IEX) Dillon Paul A. (Foxrock IEX) Stephenson Malcolm I. (Adare IEX), Temperature control instrument for electronic components under test.
  600. Paul A. Getchel ; Kenneth M. Cole, Sr. ; Henry A. Lyden, Temperature control system for a workpiece chuck.
  601. Costello, Simon; Pham, Tuyen Paul, Temperature controlled wafer chuck system with low thermal resistance.
  602. Blanz John H. (Carlisle MA), Temperature stable cryogenic probe station.
  603. McGhee James M. ; O'Hara Tetsuya, Tent material product and method of making tent material product.
  604. Ishii Tatsuya (Itami JPX) Miyamoto Kazutoshi (Itami JPX), Test analysis apparatus and analysis method for semiconductor wafer using OBIC analysis.
  605. Costello Simon ; Ryan Louis ; Pham Paul ; Motora Mircea, Test apparatus for electronic components.
  606. Swart Mark A. (Upland CA) Johnston Charles J. (Walnut CA) Van Loan David R. (Diamond Bar CA), Test fixture alignment system for printed circuit boards.
  607. Stanford ; Melvin E., Test fixture employing plural platens for advancing some or all of the probes of the test fixture.
  608. Flatley Robert (Ashland MA) Hobson David (Waltham MA), Test fixture for tab circuits and devices.
  609. Jenkins Jack E. (Redwood City CA) Maillet William R. (Fremont CA), Test fixture wiring integrity verification device.
  610. Fujimoto Akihiro (Meiwa-mura JPX), Test head cooling system.
  611. Fujimoto Akihiro,JPX, Test head cooling system.
  612. Fujimoto Akihiro,JPX, Test head cooling system.
  613. Kwong, Herman; Goulette, Richard R.; Marcanti, Larry, Test point monitor using embedded passive resistance.
  614. Hancock Robert D. (Carson City NV) Hollman Kenneth F. (Carson City NV) Porter Gene A. (Carson City NV), Test station.
  615. O\Connor R. Bruce (San Diego CA) Toth Thomas E. (El Cajon CA) Ross James A. (Poway CA), Test station.
  616. Blanz John H. (Carlisle MA), Test station having vibrationally stabilized X, Y and Z movable integrated circuit receiving support.
  617. Henley Francois J. (Mountain View CA), Test system for VLSI digital circuit and method of testing.
  618. Bhangu Labh S. (Hopewell Junction NY) Morrison Thomas (Pleasant Valley NY) Probst Klaus (Herrenberg DEX), Test system with reduced test contact interface resistance.
  619. Gergin Emile (New York NY), Testing apparatus for plated through-holes on printed circuit boards, and probe therefor.
  620. Lau James C. K. (Torrance CA) Malmgren Richard P. (Castaic CA) Lui Kenneth (Fountain Valley CA), Testing device for integrated circuits on wafer.
  621. Jones Elmer R. (North Reading MA), Thermal control system for a semi-conductor burn-in.
  622. Carrieri, Arthur H.; Roese, Erik S.; Colclough, Stephen J.; Schlitzkus, Peter J.; Younger, V. Kenneth; Orndoff, James R., Thermal luminescence liquid monitoring system and method.
  623. Jeremy A. Walraven ; Edward I. Cole, Jr., Thermally-induced voltage alteration for analysis of microelectromechanical devices.
  624. Cole ; Jr. Edward I., Thermally-induced voltage alteration for integrated circuit analysis.
  625. Nbedi Sylvain L. (Rochester NY) Bobo Robert D. (Rochester NY) Hryhorenko Socrates (Sodus NY), Thermostatic device for fuser.
  626. Stanbro William D. (Columbia MD), Three dimensional binding site array for interfering with an electrical field.
  627. Donecker S. Bruce (Sebastopol CA) Botka Julius K. (Santa Rosa CA), Three section termination for an R.F. triaxial directional bridge.
  628. Sullivan Mark T. (1661 18th Ave. San Francisco CA 94122) Mansfield Joseph A. (531 NW. Canyon Dr. Redmond OR 097756), Tilting kinematic mount.
  629. Matsunaga Kouji,JPX ; Inoue Hirobumi,JPX ; Tanehashi Masao,JPX ; Taura Toru,JPX ; Nikaidou Masahiko,JPX ; Yamagishi Yuuichi,JPX ; Hayakawa Satoshi,JPX, Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable.
  630. Robb S. Gillespie ; Steven A. Rogacki, Tool tip conductivity contact sensor and method.
  631. Iwakura Kenichi (Kawasaki JPX) Ohtsuka Tetsuo (Kawasaki JPX), Touch sensor unit of prober for testing electric circuit and electric circuit testing apparatus using the touch sensor u.
  632. Masaru Suzuki JP, Transfer mechanism for use in exchange of probe card.
  633. Schmidt Ewald,DEX ; Voigtlander Klaus,DEX ; Mayer Hermann,DEX ; Lucas Bernhard,DEX ; Dennerlein Gerd,DEX ; Beez Thomas,DEX ; Muller Roland,DEX ; Olbrich Herbert,DEX ; Martin Siegbert,DEX ; Dutzi Joac, Transition from a waveguide to a strip transmission line.
  634. Jacobs,Lawrence W.; Campbell,Julie A., Transmission line input structure test probe.
  635. Ledger Anthony (Newfairfield CT) Power Michael (Newtown CT), Transparent optical chuck incorporating optical monitoring.
  636. Hurley Daniel T. (San Ramon CA) Chiang Ching-Lang (San Jose CA) Khurana Neeraj (Monte Sereno CA), Transportable image emission microscope.
  637. Federlin Peter (Austin TX) Chen Lee (Austin TX) Wright D. Rex (Bastrop TX), Tri-polar electrostatic chuck.
  638. Dechene Ronald L. (Boxford MA) Newton Robert E. (Tewksbury MA) Swartzentruber Ron L. (Somerville MA), Triboelectric instrument with DC drift compensation.
  639. Rabjohn Gordon G. (Kanata CAX), Tunable microwave wafer probe.
  640. Faz Albert (San Antonio TX) Coronado Rodolfo U. (San Antonio TX), Turntable for rotating a wafer carrier.
  641. Meaney Paul M. ; Paulsen Keith D., Two-dimensional microwave imaging apparatus and methods.
  642. Capps,Charles P.; Johnson,Brian W.; Gloudemans,Jeffrey M.; Lane,John A., Ultra-broadband differential voltage probes.
  643. Tam, Alan K.; Lao, Binneg Y., Ultra-wideband power amplifier module apparatus and method for optical and electronic communications.
  644. Lindemann Gert,DEX ; Schmoll Klaus-Peter,DEX ; Keuper Gerhard,DEX ; Wallaschek Jorg,DEX, Ultrasonic driving element.
  645. Sleva Michael Z. (Atlanta GA) Hunt William D. (Decatur GA) Connuck David M. (Augusta GA) Briggs Ronald D. (Duluth GA), Ultrasonic transducer and method for using same.
  646. Inouye Alan T. (Ventura CA) Wilson Jeffrey V. (Camarillo CA) Tausig Wayne R. (Oxnard CA) Roe ; Jr. Thorndyke (Oxnard CA), Underwater splice for submarine coaxial cable.
  647. Aigo Seiichiro (3-15-13 Negishi ; Daito-Ku Tokyo JPX), Unitary probe assembly.
  648. Matrone John L. (Guilderland NY), Universal test fixture employing interchangeable wired personalizers.
  649. Sobhani Mohi, Unpackaged semiconductor testing using an improved probe and precision X-Y table.
  650. Cook Stephen J. (Loveland CO) Kanack Kris J. (Loveland CO), Vacuum actuated test fixture.
  651. Lee Hyung-seok,KRX, Vacuum chuck.
  652. Avneri Israel,ILX ; Duzi Eyal,ILX ; Keren Dvir,ILX ; Regev Avner,ILX, Vacuum chuck having vacuum-nipples wafer support.
  653. Frommes T. Michael (Minnetonka MN), Vacuum-actuated top access test probe fixture.
  654. Lenz Seymour S. (P.O. Box 669 Longwood FL 32750), Variable flexure test probe for microelectronic circuits.
  655. Jen, Hung-Min; Su, David K., Variable gain amplifier.
  656. Chheda, Sachin Navin; Dobbs, Robert William; Barr, Andrew, Variable impedance test probe.
  657. Hopfer Samuel (Brooklyn NY), Variable microwave attenuator.
  658. Cannon Wayne C. (Forestville CA) Barr ; IV John T. (Santa Rosa CA), Vector network analyzer with integral processor.
  659. Sharrit David D. (Santa Rosa CA), Vector network analyzer with integral processor.
  660. Kapetanic, Peter; Martens, Jon; Rangel, David, Vector network measurement system.
  661. Mizuta Masaharu,JPX, Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card.
  662. Bargett Charley B. (Santa Barbara CA) Osgood Roderic L. (Goleta CA) Davis Joseph L. (Santa Barbara CA) Joyce Richard J. (Thousand Oaks CA), Voltage calibration in E-beam probe using optical flooding.
  663. Tsuchiya Yutaka (Shizuoka JPX) Aoshima Shinichiro (Shizuoka JPX) Nakamura Takuya (Shizuoka JPX), Voltage detector.
  664. McTigue, Michael Thomas, Voltage probe.
  665. Reeds John W. (Thousand Oaks CA), Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy.
  666. Chen, Fu-Sheng, Wafer chuck system.
  667. Niori Yusuke (Nagoya JPX) Nobori Kazuhiro (Haguri JPX) Ushikoshi Ryusuke (Handa JPX) Umemoto Koichi (Toyota JPX), Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means.
  668. Akagawa Masayuki (Kawaguchi JPX), Wafer inspecting apparatus.
  669. Carbone, Mark Charles; Uher, Frank Otto; Andberg, John William; Lobacz, Jerzy; Richmond, II, Donald Paul, Wafer level burn-in and test methods.
  670. Lockwood Larry R. (McMinnville OR) Gleason Kimberly R. (Portland OR) Strid Eric W. (Portland OR), Wafer probe.
  671. Strid Eric W. (Portland OR) Gleason Kimberly R. (Portland OR), Wafer probe.
  672. Kenneth F. Hollman ; Daniel L. Harrison, Wafer probe station.
  673. Randy J. Schwindt ; Warren K. Harwood ; Paul A. Tervo ; Kenneth R. Smith ; Richard H. Warner, Wafer probe station for low-current measurements.
  674. Randy J. Schwindt ; Warren K. Harwood ; Paul A. Tervo ; Kenneth R. Smith ; Richard H. Warner, Wafer probe station for low-current measurements.
  675. Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Smith Kenneth R. (Portland OR) Warner Richard H. (Portland OR), Wafer probe station for low-current measurements.
  676. Schwindt Randy J. ; Harwood Warren K. ; Tervo Paul A. ; Smith Kenneth R. ; Warner Richard H., Wafer probe station for low-current measurements.
  677. Schwindt, Randy J.; Harwood, Warren K.; Tervo, Paul A.; Smith, Kenneth R.; Warner, Richard H., Wafer probe station for low-current measurements.
  678. Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Warner Richard H. (Portland OR), Wafer probe station having auxiliary chucks.
  679. Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Koxxy Martin J. (Hillsboro OR), Wafer probe station having environment control enclosure.
  680. Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Koxxy Martin J. (Hillsboro OR), Wafer probe station having environment control enclosure.
  681. Harwood Warren K. ; Tervo Paul A. ; Koxxy Martin J., Wafer probe station having environment control enclosure.
  682. Harwood, Warren K.; Tervo, Paul A.; Koxxy, Martin J., Wafer probe station having environment control enclosure.
  683. Harwood, Warren K.; Tervo, Paul A.; Koxxy, Martin J., Wafer probe station having environment control enclosure.
  684. Harwood,Warren K.; Tervo,Paul A.; Koxxy,Martin J., Wafer probe station having environment control enclosure.
  685. Warren K. Harwood ; Paul A. Tervo ; Martin J. Koxxy, Wafer probe station having environment control enclosure.
  686. Warren K. Harwood ; Paul A. Tervo ; Martin J. Koxxy, Wafer probe station having environment control enclosure.
  687. Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA), Wafer probe station having full guarding.
  688. Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Smith Kenneth R. (Portland OR) Warner Richard H. (Portland OR) Andrews Peter D. (Tigard OR), Wafer probe station having integrated guarding, Kelvin connection and shielding systems.
  689. Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Smith Kenneth R. (Portland OR) Warner Richard H. (Portland OR) Andrews Peter D. (Tigard OR), Wafer probe station having integrated guarding, Kelvin connection and shielding systems.
  690. Harwood Warren K. (Vancouver WA) Koxxy Martin J. (Hillsboro OR) Tervo Paul A. (Vancouver WA), Wafer probe station with integrated environment control enclosure.
  691. Grace Martin I. ; Oldfield William W., Wafer probe with built in RF frequency conversion module.
  692. Okada Kazuhisa (Itami JPX) Kusumoto Ichirou (Kawanishi JPX), Wafer prober.
  693. Sato Mitsuya (Yokohama JPX), Wafer prober.
  694. Sato Mitsuya (Yokohama JPX) Ukaji Takao (Yokohama JPX) Yamaguchi Nobuhito (Yokohama JPX) Ohmori Taro (Yokohama JPX) Murakami Eiichi (Yokohama JPX), Wafer prober.
  695. Yamatsu Yasuyoshi (Yokohama JPX), Wafer prober.
  696. Sato Mitsuya (Yokohama JPX), Wafer prober and a probe card to be used therewith.
  697. Markowski Paul S. ; Cosby Theodore J., Wafer prober having sub-micron alignment accuracy.
  698. Gleason Kimberly R. (Portland OR) Strid Eric W. (Portland OR) Flegal Robert T. (Beaverton OR) McCamant Angus J. (Aloha OR), Wafer probes.
  699. Obigane Tadashi (Kofu JPX), Wafer probing test machine.
  700. Yassine Abdullah M., Wafer shielding chamber for probe station.
  701. Mallory Roy E. (Bedford MA) Domenicali Peter (Montepelier VT) Poduje Noel S. (Needham Heights MA) Belyaev Alexander (Wayland MA) Harvey Peter A. (Wilmington MA) Smith Richard S. (Harvard MA), Wafer testing and self-calibration system.
  702. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.
  703. Frank Otto Uher ; John William Andberg ; Mark Charles Carbone ; Donald Paul Richmond, II, Wafer-level burn-in and test cartridge.
  704. Blackwood,Jeffrey, Wafer-mounted micro-probing platform.
  705. Hatazawa Kenji (Minamikawachi JPX) Mukai Hiroyuki (Yao JPX) Somei Junichi (Yamatokoriyama JPX), Waveguide to microstrip conversion means in a satellite broadcasting adaptor.
  706. du Toit, Cornelis Frederik; Ramesh, Mangipudi, Waveguide to microstrip transition.
  707. Sedivec Darrel F. (Lawrence MA), Waveguide to stripline transition assembly.
  708. Weinreb Sander ; Bowyer Dean N., Waveguide to transmission line transition.
  709. Martin, John T., Waveguide with adjustable backshort.
  710. Igarashi Sadao (Soma JPX), Waveguide-microstrip line converter.
  711. Wu You-Sun (Hamilton NJ), Waveguide-to-microstrip transition.
  712. Satomura,Hiroaki; Fujita,Shinya; Ukita,Junichi; Watanabe,Katsuhiko, Wavelength dispersion probing system.
  713. Nozaki, Masahiro; Kubo, Yoshihisa; Inoue, Tomonori, Weather strip including core-removal slot.
  714. Kleinberg Robert L. (Ridgefield CT) Clark Brian (Missouri City TX) Chew Weng C. (Champaign IL) Mariani David (Darien CT), Well logging apparatus for determining dip, azimuth, and invaded zone conductivity.
  715. Zamborelli Thomas J. (Colorado Springs CO), Wide bandwidth passive probe.
  716. Harry Emory J. (Aloha OR) Hadwin Matthew J. (Battleground WA) Garcia John D. (Vancouver WA), Wideband high impedance card mountable probe.
  717. Howland, Jr.,William H.; Hillard,Robert J.; Hung,Steven Chi Shin, Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof.
  718. Hassan Javathu Kutikaran (Hopewell Junction NY) Rabstejnek Carl Vincent (Wappingers Falls NY), Workpiece positioning apparatus.

이 특허를 인용한 특허 (5)

  1. Stewart, Craig; Lord, Anthony; Spencer, Jeff; Burcham, Terry; McCann, Peter; Jones, Rod; Dunklee, John; Lesher, Tim; Newton, David, Chuck for holding a device under test.
  2. Andrews, Peter; Froemke, Brad; Dunklee, John, Chuck with integrated wafer support.
  3. Lesher, Timothy E., Probe testing structure.
  4. Negishi, Kazuki; Hansen, Mark, Test apparatus for measuring a characteristic of a device under test.
  5. Magill, Richard, Wood kiln moisture measurement calibration and metering methods.
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