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A method of encapsulating a display device between substrates with a glass frit. The method includes depositing a frit having an optical absorption α which is a function of wavelength onto a first substrate wherein the deposited frit has a height h, placing a second substrate in contact with th

A method of encapsulating a display device between substrates with a glass frit. The method includes depositing a frit having an optical absorption α which is a function of wavelength onto a first substrate wherein the deposited frit has a height h, placing a second substrate in contact with the frit, sealing together the substrates by traversing a laser light having a wavelength λ over the frit at a speed greater than about 5 mm/s, and wherein α·h at λ is between 0.4 and about 1.75.

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What is claimed is: 1. A method for encapsulating a display element comprising: depositing a frit having an optical absorption α which is a function of wavelength onto a first substrate in the shape of a wall having a height h; sandwiching the frit between the first substrate and a second subs

What is claimed is: 1. A method for encapsulating a display element comprising: depositing a frit having an optical absorption α which is a function of wavelength onto a first substrate in the shape of a wall having a height h; sandwiching the frit between the first substrate and a second substrate having a display element and at least one electrode disposed thereon, the at least one electrode extending between the frit and the second substrate; heating the frit by traversing a laser light having a wavelength λ over the frit through the first substrate at a speed greater than about 40 mm/s to melt the frit and seal together the first and second substrates; and wherein α·h at λ is greater than or equal to about 0.4. 2. The method according to claim 1 wherein the display element comprises an organic material. 3. The method according to claim 1 further comprising prior to the step of sandwiching, pre-sintering the frit. 4. The method according to claim 1 wherein a spot diameter 2ω of the laser beam at a surface of the frit is equal to or greater than a width of the frit. 5. The method according to claim 1 wherein α·h is between about 0.5 and about 1.3 at λ. 6. The method according to claim 1 wherein h is between 12 and 15 μm. 7. The method according to claim 1 wherein a thermal conductivity of the frit is greater than about 500 μm2/s. 8. The method according to claim 1 wherein the laser beam has a peak optical power at λ, and the peak optical power is less than 45 W. 9. A method of encapsulating a display element comprising: depositing a frit selected to have an optical absorption α at a wavelength λ onto a first substrate as a wall having a height h between 10 μm and 30 μm; pre-sintering the frit; placing the first substrate overtop a second substrate having one or more display elements comprising an organic material and at least one metallic electrode disposed thereon, such that the display element is encircled by the wall and the at least one electrode passes beneath the frit; heating the frit through the first substrate by traversing a laser beam having a peak optical power at wavelength λ over the frit at a speed greater than 20 mm/s to melt the frit and form a hermetic seal between the first and second substrates; and wherein the frit is selected such that α·h at λ is greater than or equal to about 0.4. 10. The method according to claim 9 wherein α·h is between about 0.5 and about 1.3 at λ. 11. The method according to claim 9 wherein a thermal conductivity of the frit is greater than about 500 μm2/s. 12. The method according to claim 9 wherein the peak optical power of the laser beam is between about 0.5 W and 1.5 kW. 13. The method according to claim 9 wherein the laser beam is traversed at a speed greater than about 40 mm/s. 14. The method according to claim 9 wherein the frit has a thermal conductivity greater than about 800 mm2/s. 15. The method according to claim 9 wherein the laser beam peak optical power is less than 45 W.