IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0869753
(2007-10-10)
|
등록번호 |
US-7599182
(2009-10-20)
|
우선권정보 |
CN-2006 1 0201132(2006-11-23) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Hon Hai Precision Industry Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
10 인용 특허 :
6 |
초록
▼
An exemplary heat dissipation device is provided for removing heat from a first electronic element and a second electronic element attached to a circuit board. The first electronic element is arranged at a side of the second electronic element. The heat dissipation device includes a heat sink attach
An exemplary heat dissipation device is provided for removing heat from a first electronic element and a second electronic element attached to a circuit board. The first electronic element is arranged at a side of the second electronic element. The heat dissipation device includes a heat sink attached to the CPU, a fan attached to the heat sink, and an air guide member attached to the second electronic element. The air guide member includes a guiding portion to guide air from the fan to the second electronic element.
대표청구항
▼
What is claimed is: 1. A heat dissipation device for removing heat from a first electronic element and a second electronic element attached to a circuit board, the first electronic element being disposed adjacent the second electronic element, the second electronic element comprising a first surfac
What is claimed is: 1. A heat dissipation device for removing heat from a first electronic element and a second electronic element attached to a circuit board, the first electronic element being disposed adjacent the second electronic element, the second electronic element comprising a first surface facing the first electric element, and a second surface opposite to the first surface, the heat dissipation device comprising: a heat sink attached to the first electronic element, the heat sink comprising an air outlet; a fan attached to the heat sink and generating an airflow directed out from the air outlet; and an air guide member attached to and abutting against the second surface of the second electronic element and facing the air outlet of the heat sink, the air guide member comprising a guiding portion changing a direction of the airflow from a first direction perpendicular to the first surface of the second electronic element, to a second direction along the first surface. 2. The heat dissipation device as described in claim 1, wherein the air guide member comprises a main portion attached to the second surface in parallel, the guiding portion slantingly extending from a top edge of the main portion towards the first electronic element. 3. The heat dissipation device as described in claim 2, wherein the air guide member further comprises a pair of folded flanges respectively extending from opposite sides of the main portion, and engaging with the second electronic element. 4. The heat dissipation assembly as described in claim 1, wherein the first direction is substantially perpendicular to the circuit board, the second direction is substantially perpendicular to the circuit board. 5. The heat dissipation as described in claim 1, wherein the guiding portion guides the air flow to flow through the first surface of the second electronic element. 6. A heat dissipation assembly comprising: a circuit board comprising a CPU, and a plurality of memory cards located at a side of the CPU, the memory cards extending upright from the circuit board, with bottoms of the memory cards connected to the circuit board; a heat sink attached to a top of the CPU and comprising a plurality of fins and a plurality of airflow passages defined between adjacent fins, the passages directed toward the memory cards; a fan attached to a top of the heat sink, and generating an airflow, the airflow being directed to the heat sink and directed outward by the passages of the heat sink; and a plurality of air guide members respectively attached to tops of the memory cards and each of the guide members comprising a guiding portion guiding the airflow directed out from the passages to flow from the top of the corresponding memory card to the bottom of the corresponding memory card. 7. The heat dissipation assembly as described in claim 6, wherein each of the air guide members comprises a main portion connected to the second electronic element, the guiding portion slantingly extends out from an end edge of the main portion, and is slantwise related to the circuit board and an extending direction of the heat sink. 8. The heat dissipation assembly as described in claim 7, wherein each of the air guide members further comprises a pair of folded flanges extending from opposite sides of the main portion, and the folded flanges and the main portion sandwich the corresponding memory card therebetween. 9. The heat dissipation assembly as described in claim 6, wherein the memory cards are substantially perpendicular to the passages of the heat sink, the farther the memory card is away from the CPU, the bigger the air guide member is, to make sure the airflow can be guided to all of the memory cards by the plurality of the air guide members. 10. The heat dissipation assembly as described in claim 8, wherein the folded flanges each comprise at least one protrusion extending toward the main portion configured to engage in at least one dent of the corresponding memory card. 11. The heat dissipation assembly as described in claim 8, wherein the guiding portion comprises a pair of tabs extending slantingly outward from opposite side edges thereof, configured for further guiding airflow blowing from the fan to the corresponding memory card. 12. A heat dissipation assembly comprising: a circuit board comprising an electronic component, and a plurality of parallel memory cards located at a side of the electronic component; a heat sink attached to a top of the electronic component and comprising a plurality of parallel fins with parallel airflow passages defined between every two adjacent thereof, the passages directed toward the memory cards; a fan attached to the heat sink and generating a airflow; and a plurality of air guide members respectively attached to tops of the memory cards and each of the air guide members comprising a guiding portion arranged slanted relative to the passages and changing the direction of airflow from a first direction parallel with the passages of the heat sink to a second direction towards the circuit board. 13. The heat dissipation assembly as described in claim 12, wherein each of the air guide members comprises a main portion attached to the corresponding memory card, the main portion being perpendicular to the passages, the guiding portion slantingly extending from an edge of the main portion. 14. The heat dissipation assembly as described in claim 13, wherein each of the air guide members further comprises a pair of flanges folded from opposite sides of the main portion, the folded flanges and the main portion sandwich the corresponding memory card therebetween. 15. The heat dissipation assembly as described in claim 13, wherein the memory cards substantially perpendicularly faces the passages of the heat sink, the farther the memory card is away from the electronic component, the higher the main body of the air guide member relative to the circuit board is, to make sure the airflow can be guided to all of the memory cards by the plurality of the air guide members. 16. The heat dissipation assembly as described in claim 13, wherein the folded flanges each comprise at least one protrusion extending toward the main portion configured to engage in at least one dent of the corresponding memory card. 17. The heat dissipation assembly as described in claim 13, wherein the guiding portion comprises a pair of tabs extending slantingly from opposite side edges thereof, configured for further guiding airflow blowing from the fan to the corresponding memory card. 18. The heat dissipation assembly as described in claim 12, wherein the first direction is substantially parallel with the circuit board, the second direction is substantially perpendicular to the circuit board.
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