IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0317348
(2005-12-22)
|
등록번호 |
US-7599194
(2009-10-20)
|
발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
6 |
초록
▼
A redundant pair of interconnected board sub-assemblies have substantially the same dimensions and level of functionality. A module interconnect card is configured to mechanically and electronically connect to the first and second board sub-assemblies. Each sub-assembly is configured (e.g., via a pr
A redundant pair of interconnected board sub-assemblies have substantially the same dimensions and level of functionality. A module interconnect card is configured to mechanically and electronically connect to the first and second board sub-assemblies. Each sub-assembly is configured (e.g., via a properly configured microcontroller) to compensate for a loss of functionality in the other sub-assembly. Each subassembly preferably includes a re-usable adapter card that interfaces with a first card such that components requiring a lower certification level--e.g., commercial off-the-shelf (COTS) components or the like--may be isolated on the first card, wherein the adapter card includes high certification-level parts and communicates with the first card. The two cards are electronically and mechanically coupled to form the finished board assembly. The interface card may be re-used in a variety of current or future cabinet specifications, including, for example, cabinets manufactured in accordance with the Compact PCI (cPCI) 3U and 6U specifications.
대표청구항
▼
What is claimed is: 1. A redundant board assembly comprising: a first board sub-assembly and a second board sub-assembly, said first and second board sub-assemblies each having a first functionality; a module interconnect card configured to mechanically and electronically interconnect said first an
What is claimed is: 1. A redundant board assembly comprising: a first board sub-assembly and a second board sub-assembly, said first and second board sub-assemblies each having a first functionality; a module interconnect card configured to mechanically and electronically interconnect said first and second board sub-assemblies; said first board sub-assembly configured to compensate for a loss of functionality when said second board sub-assembly exhibits a second functionality that is different from said first functionality; said first board sub-assembly comprising: a first card having a first end configured to interface with a backplane, and a second end; and a second card configured to removeably attach, mechanically and electrically, to said second end of said first card, said second card being configured to communicate with said first card and the backplane; and said second board sub-assembly comprising: a third card having a third end configured to interface with the backplane, and a fourth end; and a fourth card configured to removeably attach, mechanically and electrically, to said fourth end of said third card, said fourth card being configured to communicate with said third card and the backplane. 2. The redundant board assembly of claim 1, said first and second board sub-assemblies conforming to 3U dimensions, and said redundant board assembly conforming to 6U dimensions. 3. The redundant board assembly of claim 1, said first card including a first set of components conforming to a first certification level, and said second card including a second set of components conforming to a second certification level. 4. The redundant board assembly of claim 3, said second certification level being higher than said first certification level. 5. The redundant board assembly of claim 4, said first certification level being a commercial off the-shelf (COTS) level. 6. The redundant board assembly of claim 1, said first board sub-assembly including an extender card. 7. The redundant board assembly of claim 1, said first card and said second card, when coupled, having a combined length of about 160 mm, and a combined height of about 100 mm. 8. The redundant board assembly of claim 1, said second board including an expansion connection. 9. The redundant board assembly of claim 1, said second board including a memory and a microcontroller, said microcontroller being configured to execute software resident within said memory in order to achieve said communication with said first card, said backplane, and said second sub-assembly. 10. The redundant board assembly of claim 1, wherein said communication with said first card and said backplane is accomplished via bus communications and discrete addressing. 11. The redundant board assembly of claim 1, said second board including a voltage converter, a power controller, and a voltage monitor. 12. The redundant board assembly of claim 9, said second board including a temperature monitor configured to communicate with said microcontroller. 13. The redundant board assembly of claim 9, further including a health monitor bus, said microcontroller being configured to provide health information via said health monitor bus. 14. A method of producing a first board sub-assembly, said method comprising the steps of: providing a first card having a first and second end, said first end being configured to interface with a backplane; and providing a second card configured to removeably attach, mechanically and electrically, to said second end of said first card, said second card being configured to communicate with said first card and said backplane; identifying a set of components to be attached to said board assembly; isolating a first set of components that require conformance to a first certification level; said first certification level being a commercial off-the-shelf (COTS) certification level; isolating a second set of components that require conformance to a second certification level; attaching said first set of components to said first card; attaching said second set of components to said second card; and configuring said second card to communicate with a second board sub-assembly having a first functionality and to compensate for a loss of functionality when said second board sub-assembly exhibits a second functionality that is different than said first functionality. 15. The method of claim 14, said first card and said second card, when coupled, having a combined length of about 160 mm, and a combined height of about 100 mm. 16. The method of claim 14, further including connecting the first board sub-assembly with said second board sub-assembly. 17. The method of claim 14, wherein the first board sub-assembly as connected to said second board sub-assembly conforms to 6U dimensions. 18. A redundant board assembly comprising: a first board sub-assembly and a second board sub-assembly, said first and second board sub-assemblies each having a first functionality; a module interconnect card configured to mechanically and electronically interconnect said first and second board sub-assemblies; said first board sub-assembly configured to compensate for a loss of functionality when said second board sub-assembly exhibits a second functionality that is different from said first functionality; and said first board sub-assembly further comprising: a first card having a first end configured to interface with a backplane and a second end, wherein the first card includes a first set of components conforming to a first certification level; and a second card configured to removeably attach, mechanically and electrically, to said second send of said first card, said second card being configured to communicate with said first card and the backplane, wherein the second card includes a set of components conforming to a second certification level.
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