Semiconductor device having variable parameter selection based on temperature and test method
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01K-013/00
출원번호
UP-0708184
(2007-02-20)
등록번호
US-7603249
(2009-10-28)
발명자
/ 주소
Walker, Darryl
대리인 / 주소
Walker, Darryl G.
인용정보
피인용 횟수 :
24인용 특허 :
26
초록▼
A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage. In this way, operating specifications of a s
A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.
대표청구항▼
What is claimed is: 1. A semiconductor device, comprising: a first temperature sensing circuit including a first temperature threshold value and providing a first temperature indication signal, the first temperature sensing circuit coupled to receive a temperature detect enable signal having a temp
What is claimed is: 1. A semiconductor device, comprising: a first temperature sensing circuit including a first temperature threshold value and providing a first temperature indication signal, the first temperature sensing circuit coupled to receive a temperature detect enable signal having a temperature detect enable logic level and a temperature detect disable logic level; and a first latch coupled to receive the first temperature indication signal and providing a latched first temperature indication signal. 2. The semiconductor device of claim 1, wherein: the first temperature sensing circuit being disabled when the temperature detect enable signal has the temperature detect disable logic level and the first latch prevents the latched first temperature indication signal from changing when the temperature detect enable signal has the temperature detect disable logic level. 3. The semiconductor device of claim 1, wherein: the first temperature threshold value is programmable. 4. The semiconductor device of claim 1, further including: a voltage generator coupled to receive the first temperature indication signal. 5. The semiconductor device of claim 1, further including: a refresh circuit coupled to receive the first temperature indication signal. 6. The semiconductor device of claim 1, wherein: the semiconductor device is a random access memory device. 7. The semiconductor device of claim 1, wherein: the semiconductor device is a dynamic random access memory device. 8. The semiconductor device of claim 1, wherein: the first temperature sensing circuit includes a first temperature hysteresis value. 9. The semiconductor device of claim 8, wherein: the first temperature hysteresis value is programmable. 10. The semiconductor device of claim 1, wherein: the first latch is coupled to receive a latch enable signal having a latch enable logic level and a latch disable logic level. 11. The semiconductor device of claim 10, wherein: the latch enable signal transitions to a latch enable logic level a time delay after the temperature detect signal transitions to a temperature detect enable logic level. 12. The semiconductor device of claim 10, wherein: the first latch maintains a previously detected first temperature indication signal value as the latched first temperature indication signal when the latch enable signal is in the latch disable logic level. 13. The semiconductor device of claim 12, wherein: the first latch outputs a currently first temperature indication signal value as the latched first temperature indication signal when the latch enable signal is in the latch enable logic level. 14. The semiconductor device of claim 1, further including: a second temperature sensing circuit including a second temperature threshold value and providing a second temperature indication signal, the second temperature sensing circuit coupled to receive the temperature detect enable signal; and a second latch coupled to receive the second temperature indication signal and providing a latched second temperature indication signal. 15. The semiconductor device of claim 14, wherein: the second temperature sensing circuit being disabled when the temperature detect enable signal has the temperature detect disable logic level and the second latch prevents the latched second temperature indication signal from changing when the temperature detect enable signal has the disable logic level. 16. The semiconductor device of claim 14, wherein: the second temperature threshold value is programmable. 17. The semiconductor device of claim 14, further including: a control section coupled to receive the latched first temperature indication signal and the latched second temperature indications signal and provide a temperature range signal. 18. The semiconductor device of claim 14, wherein: the second temperature sensing circuit includes a second temperature hysteresis value. 19. The semiconductor device of claim 18, wherein: the second temperature hysteresis value is programmable.
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