$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Assembly for extracting heat from a housing for electronic equipment 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-005/00
  • F25D-023/12
  • H05K-007/20
출원번호 UP-0412430 (2006-04-27)
등록번호 US-7604535 (2009-11-10)
발명자 / 주소
  • Germagian, Mark
  • Prunier, John
  • Olsen, Martin
출원인 / 주소
  • Wright Line, LLC
대리인 / 주소
    Dingman, Brian M.
인용정보 피인용 횟수 : 52  인용 특허 : 21

초록

An assembly for extracting heat from a housing for electronic equipment, the housing having a front, a back, two sides and a top. The assembly is defined by a back for the housing that defines an open area proximate the top, and an air passageway in fluid communication with the open area in the back

대표청구항

What is claimed is: 1. An assembly comprising: a housing with an interior that is adapted to hold heat-generating electronic equipment, the housing comprising a generally rectangular vertical front portion, two generally rectangular vertical side portions coupled to the front portion, an essentiall

이 특허에 인용된 특허 (21)

  1. Nakazato Hideaki,JPX ; Hayama Hirofumi,JPX ; Kishita Manabu,JPX ; Nakao Masaki,JPX, Air conditioning method in machine room having forced air-cooling equipment housed therein.
  2. Tajima Tsuneaki (Tokyo JPX) Matsuo Yohichi (Tokyo JPX), Air cooling equipment for electronic systems.
  3. Tanaka Tetsuya,JPX ; Hatada Toshio,JPX ; Atarashi Takayuki,JPX ; Kobayashi Junichi,JPX ; Takanashi Akihiro,JPX ; Daikoku Takahiro,JPX ; Watanabe Yutaka,JPX ; Zushi Shizuo,JPX, Air-cooled electronic apparatus with condensation prevention.
  4. Campbell,Levi A.; Chu,Ricahrd C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region.
  5. R. Stephen Spinazzola ; Dennis L. Peltz, Computer rack heat extraction device.
  6. R. Stephen Spinazzola ; Dennis L. Peltz, Computer rack heat extraction device.
  7. Spinazzola, R. Stephen; Peltz, Dennis L., Computer rack heat extraction device.
  8. Spinazzola, R. Stephen; Peltz, Dennis L., Computer rack heat extraction device.
  9. Spinazzola, R. Stephen; Peltz, Dennis L., Computer room air flow method and apparatus.
  10. Spinazzola, R. Stephen; Peltz, Dennis L., Computer room air flow method and apparatus.
  11. Yamada,Satoru, Cooling structure of electronic equipment and information processing equipment using the cooling structure.
  12. Okuyama Katsuo (Kawasaki JPX) Arai Susumu (Machida JPX) Ishiwata Masao (Yokohama JPX) Takada Hirotoshi (Kawasaki JPX), Cooling structure of electronic equipment rack.
  13. Koike Norihiro (Tokyo JPX), Cooling system for cooling electronic apparatus.
  14. Takahashi Tsuyoshi (Odawara JPX) Nakagoshi Kazuo (Odawara JPX) Naruse Jun (Odawara JPX) Ogawa Takuji (Odawara JPX) Hayakawa Takeo (Kanagawa JPX), Disk apparatus having an improved cooling structure.
  15. French F. William ; Tilley Lisa D., Electronic cabinet door air mixing dam.
  16. Sugiyama Akira,JPX ; Hoshino Tsutomu,JPX ; Yoshida Shinichi,JPX ; Joeng Tan Tjang,JPX, Electronic equipment.
  17. John McKeen ; Willie Braun, Equipment enclosure having separate compartments cooled by separate cooling airflows.
  18. Sthl Lennart (Stallarholmen SEX) Karstrom Anders (Bandhagen SEX), Method and device for cooling in closed spaces.
  19. Rasmussen,Neil, Rack enclosure.
  20. Rasmussen,Neil; Germagian,Mark H.; Avelar,Victor P.; Donovan,James Edward, Rack enclosure.
  21. Greenslade,Michael D.; Hendrix,A. Fred; Martinez Ponce,Francisco, System and method for venting air from a computer casing.

이 특허를 인용한 특허 (52)

  1. Lewis, II, Richard Evans; Proulx, Joseph Charles, Air directing device.
  2. Roy, Rob, Air handling unit with a canopy thereover for use with a data center and method of using the same.
  3. Zeighami, Roy; Lankston, Robert, Cooling system.
  4. Roy, Rob, Data center air handling unit including uninterruptable cooling fan with weighted rotor and method of using the same.
  5. Roy, Rob, Data center facility design configuration.
  6. LeFebvre, Dale; Choi, Kenneth, Data center heat removal systems and methods.
  7. LeFebvre, Dale; Choi, Kenneth, Data center heat removal systems and methods.
  8. Belady, Christian L.; Larus, James R.; Reed, Danny A.; Borgs, Christian H.; Chayes, Jennifer Tour; Lobel, Ilan; Menache, Ishai; Nazerzadeh, Hamid; Jain, Navendu, Data center system that accommodates episodic computation.
  9. North, Travis; Bornfield, Steven; Rodriguez, Samuel, Data processing equipment structure.
  10. Krietzman, William, Ducted exhaust equipment enclosure.
  11. Krietzman, William, Ducted exhaust equipment enclosure.
  12. Krietzman, William; Lewis, II, Richard Evans; Vanlith, Dennis W., Ducted exhaust equipment enclosure.
  13. Krietzman, William; Lewis, II, Richard Evans; Vanlith, Dennis W., Ducted exhaust equipment enclosure.
  14. Krietzman, William; Lewis, II, Richard Evans; Vanlith, Dennis W., Ducted exhaust equipment enclosure.
  15. Krietzman, William; Lewis, II, Richard Evans; Vanlith, Dennis W., Ducted exhaust equipment enclosure.
  16. Krietzman, William; Lewis, II, Richard Evans; Vanlith, Dennis W., Ducted exhaust equipment enclosure.
  17. Jain, Navendu, Dynamic application placement based on cost and availability of energy in datacenters.
  18. Jain, Navendu; Buchbinder, Niv; Menache, Ishai, Dynamically placing computing jobs.
  19. Roy, Rob, Electronic equipment data center and server co-location facility configurations and method of using the same.
  20. Roy, Rob, Electronic equipment data center and server co-location facility configurations and method of using the same.
  21. Roy, Rob, Electronic equipment data center or co-location facility designs and methods of making and using the same.
  22. Roy, Rob, Electronic equipment data center or co-location facility designs and methods of making and using the same.
  23. Roy, Rob, Electronic equipment data center or co-location facility designs and methods of making and using the same.
  24. Donowho, D. Brian; Lewis, II, Richard Evans, Electronic equipment enclosure with exhaust air duct and adjustable filler panel assemblies.
  25. Donowho, D. Brian; Lewis, II, Richard Evans, Electronic equipment enclosure with exhaust air duct and adjustable filler panel assemblies.
  26. Donowho, D. Brian; Lewis, II, Richard Evans, Exhaust air duct with adjustable filler panel assemblies.
  27. Donowho, D. Brian; Lewis, II, Richard Evans, Exhaust air duct with adjustable filler panel assemblies.
  28. Roy, Rob, Facility including externally disposed data center air handling units.
  29. Roy, Rob, Facility including externally disposed data center air handling units.
  30. Krietzman, William Drew, Header panel assembly for preventing air circulation above electronic equipment enclosure.
  31. Krietzman, William; Garza, Jr., Jose Arturo; Lewis, II, Richard Evans, Header panel assembly for preventing air circulation above electronic equipment enclosure.
  32. Krietzman, William; Garza, Jr., Jose Arturo; Lewis, II, Richard Evans, Header panel assembly for preventing air circulation above electronic equipment enclosure.
  33. Roy, Rob, Integrated wiring system for a data center.
  34. Borowsky, Erez; Fink, James R., Internal seals for server racks.
  35. Behrens, Edward; Vanlith, Dennis W., Magnetic filler panel for use in airflow control system in electronic equipment enclosure.
  36. Liu, Jie; Janous, Brian; McKnight, Gregory Joseph; James, Sean; Bianchini, Ricardo, Management of computing devices using modulated electricity.
  37. Clidaras, Jimmy; Whitted, William; Hamburgen, William; Sykora, Montgomery; Leung, Winnie; Aigner, Gerald; Beaty, Donald L., Modular computing environments.
  38. Kimura, Shotaro; Usui, Masahiko; Funatsu, Junichi, Operation processor.
  39. Germagian, Mark, Plenum pressure control system.
  40. Campbell, Joseph Kyle, Rack level hot aisle containment system.
  41. Jain, Navendu; Menache, Ishai, Resource management for cloud computing platforms.
  42. Jain, Navendu; Menache, Ishai, Resource management for cloud computing platforms.
  43. Lewis, II, Richard Evans, Selectively routing air within an electronic equipment enclosure.
  44. Janous, Brian; McKnight, Gregory Joseph; James, Sean; Bianchini, Ricardo; Liu, Jie, Server installation as a grid condition sensor.
  45. Germagian, Mark, System and method for cooling electronic equipment.
  46. Ghadiri Moghaddam, Davood; LePoudre, Philip Paul; Gerber, Manfred, Systems and methods for managing conditions in enclosed space.
  47. Arflack, Brian K.; Adducci, Samuel J., Systems and methods for managing heat generated by electronic equipment in an electronic equipment enclosure.
  48. Arflack, Brian K.; Adducci, Samuel J., Systems and methods for managing heat generated by electronic equipment in an electronic equipment enclosure.
  49. Ong, Tony, Thermal control system.
  50. Lewis, II, Richard Evans; VanLith, Dennis W., Vertical exhaust duct.
  51. Lewis, II, Richard Evans; Vanlith, Dennis W., Vertical exhaust duct.
  52. Lewis, II, Richard Evans; Vanlith, Dennis W., Vertical exhaust duct for electronic equipment enclosure.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로