초록 ▼

An object of the present invention is to provide a curing composition which is practically curable and highly adhesive even though a non-organotin compound is included as a curing catalyst. Problems involved are solved by a curing composition characterized by including (A) an organic polymer having

An object of the present invention is to provide a curing composition which is practically curable and highly adhesive even though a non-organotin compound is included as a curing catalyst. Problems involved are solved by a curing composition characterized by including (A) an organic polymer having one or more silicon-containing groups capable of cross linking by forming siloxane bonds, (B) a metal carboxylate and/or carboxylic acid, and (C) a silicon compound having a hetero atom on the carbon atom in the α or β position with respect to the silicon atom.

대표청구항 ▼

The invention claimed is: 1. A curing composition which comprises: (A) an organic polymer having one or more silicon-containing groups capable of cross linking by forming siloxane bonds and being one or more polymers selected from the group consisting of a polyoxyalkylene polymer, a saturated hydro

The invention claimed is: 1. A curing composition which comprises: (A) an organic polymer having one or more silicon-containing groups capable of cross linking by forming siloxane bonds and being one or more polymers selected from the group consisting of a polyoxyalkylene polymer, a saturated hydrocarbon polymer and a (meth)acrylate polymer, (B) a tin carboxylate which is a non-organotin compound and in which the carbon atom adjacent to the carbonyl group is a quaternary carbon atom and/or a monocarboxylic acid, and (C) a silicon compound having a hetero atom on the carbon atom in the α or β position with respect to the silicon atom. 2. The curing composition according to claim 1, in which the organic polymer as the component (A) has a number average molecular weight falling within a range from 500 to 50000, and has on average one or more silicon-containing groups per molecule thereof, each of the silicon-containing groups represented by the general formula (1): --(SiR12-bXbO)1--SiR2 3-aXa (1) wherein R1 and R2 are each independently an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or a triorganosiloxy group represented by (R')3SiO--, wherein R's are each independently a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms; Xs are each independently a hydroxyl or hydrolyzable group; a represents 0, 1, 2 or 3 and b represents 0, 1 or 2 with the proviso that a and b are not simultaneously 0; and 1 represents 0 or an integer of 1 to 19. 3. The curing composition according to claim 2, in which X is an alkoxy group. 4. The curing composition according to claim 1, wherein the polyoxyalkylene polymer is a polyoxypropylene polymer. 5. The curing composition according to claim 1, in which the organic polymer as the component (A) does not substantially comprise amide segments in the main chain skeleton thereof. 6. The curing composition according to claim 1, wherein the component (B) is a tin carboxylate which is a non-organotin compound and in which the carbon atom adjacent to the carbonyl group is a quaternary carbon atom and/or a monocarboxylic acid in which the carbon atom adjacent to the carbonyl group constituting the carboxylic acid is a quaternary carbon atom. 7. The curing composition according to claim 1, wherein the component (B) is tin carboxylate which is a non-organotin compound and in which the carbon atom adjacent to the carbonyl group is a quaternary carbon atom. 8. The curing composition according to claim 1, wherein the component (B) is a monocarboxylic acid. 9. The curing composition according to claim 1, wherein the component (C) is a silicon compound represented by the general formula (2): wherein R3 to R6 are each independently a hydrogen atom, or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; R7 and R8 are each independently an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or a triorganosiloxy group represented by (R")3SiO--, wherein R"s are each independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; Y is a substituent bonded to an adjacent carbon atom (C1) through a hetero bond; Zs are each independently a hydroxyl or hydrolyzable group; c represents 0, 1, 2 or 3 and d represents 0, 1 or 2 with the proviso that c and d are not 0 simultaneously; m represents 0 or 1; and n represents 0 or an integer of 1 to 19. 10. The curing composition according to claim 9, wherein Y in the general formula (2) is a hetero substituent represented by--NR92,--OR10 or--SR11, wherein two R9s, R10 and R11 are each independently a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, or by--N═R12 wherein R12 is a substituted or unsubstituted divalent hydrocarbon group. 11. The curing composition according to claim 10, wherein Y in the general formula (2) is a nitrogen substituent represented by--NR92 or--N═R12 wherein two R9s and R12 are the same as described above. 12. The curing composition according to claim 9, wherein m in the general formula (2) is 0. 13. The curing composition according to claim 1, in which the curing composition comprises 0.01 to 20 parts by weight of the component (B) and 0.01 to 10 parts by weight of the component (C) in relation to 100 parts by weight of the component (A). 14. The curing composition according to claim 1, which further comprises a component (D), wherein component (D) is an amine compound. 15. The curing composition according to claim 14, in which the curing composition comprises 0.01 to 20 parts by weight of the component (D) in relation to 100 parts by weight of the component (A). 16. A one-part curing composition which comprises the curing composition according to claim 1.