A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a bottom face. The base has a bottom surface and a top surface. The heat pipe comprises an evaporation porti
A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a bottom face. The base has a bottom surface and a top surface. The heat pipe comprises an evaporation portion thermally engaging with the top surface of the base plate and a curved portion extending from the evaporation portion and projecting beyond the base plate. The heat spreader has a first face engaging with the bottom face of the fin assembly and a second face thermally engaging with the condensation portion of the heat pipe. The heat spreader has a profile on the bottom face of the fin assembly, which is in compliance with at least a portion of the heat pipe.
대표청구항▼
What is claimed is: 1. A heat dissipation device comprising: a fin assembly comprising a plurality of fins having a bottom face at a bottom thereof; a base plate being smaller than the bottom face of the fin assembly, having a first surface adapted for contacting with a heat-generating electronic c
What is claimed is: 1. A heat dissipation device comprising: a fin assembly comprising a plurality of fins having a bottom face at a bottom thereof; a base plate being smaller than the bottom face of the fin assembly, having a first surface adapted for contacting with a heat-generating electronic component and a second surface opposite to the first surface; a heat pipe comprising an evaporation portion thermally engaging with the second surface of the base plate, and a curved portion extending from the evaporation portion and projecting beyond the base plate; and a heat spreader being curved and comprising a curved section thereof having a profile similar to the curved portion of the heat pipe, the curved section having a first face engaging with the bottom face of the fin assembly and a second face thermally engaging with the curved portion of the heat pipe; wherein the heat spreader defines a groove at the second face thereof, the groove thermally receiving the curved portion of the heat pipe therein; wherein the curved portion of the heat pipe is L-shaped, the curved section of the heat spreader is L-shaped corresponding to the curved portion of the heat pipe; wherein the heat pipe is U-shaped, the curved portion of the heat pipe comprises a condensation portion parallel to the evaporating portion of the heat pipe and a connecting section connecting the evaporation portion and the condensation portion; wherein the heat spreader comprises an additional section extending from the curved section thereof and cooperating with the curved section to define a U-shaped profile, the evaporation portion of the heat pipe is sandwiched between the additional section of the heat spreader and the base plate. 2. The heat dissipation device as described in claim 1, wherein the evaporation portion of the heat pipe extends beyond the heat spreader. 3. The heat dissipation device as described in claim 1, further comprising an additional heat pipe similar to the heat pipe, wherein the additional heat pipe is so oriented that it opens to a direction opposite to that of the heat pipe. 4. The heat dissipation device as described in claim 3, further comprising an additional heat spreader matching the additional heat pipe, wherein the additional heat spreader is sandwiched between the fin assembly and the additional heat pipe and thermally contacts the additional heat pipe. 5. The heat dissipation device as described in claim 1, further comprising two locking members soldered on two opposite sides of the bottom of the fin assembly. 6. The heat dissipation device as described in claim 5, wherein each of the two locking members comprises a beam and two fixing boards extending from two ends of the beam, each board defining a fixing hole, the fin assembly defining four cutouts at four corners thereof corresponding to the fixing holes, respectively. 7. A heat dissipation device for an electronic component, comprising: a fin assembly having a bottom face; a heat spreader attached to the bottom face of the fin assembly; a heat pipe having at least a portion being attached to the heat spreader; and a base plate having a first face attached to an evaporation portion of the heat pipe and an opposite second face adapted for contacting with the electronic component; wherein the heat spreader has a profile on the bottom face of the fin assembly which is substantially the same as that of the heat pipe in whole. 8. The heat dissipation device as described in claim 7 further comprising at least a locking member attached to the bottom surface of the fin assembly, wherein the fin assembly defines four cutouts in four corners thereof, respectively, the at least a locking member having four through holes located corresponding to the four cutouts, respectively. 9. The heat dissipation device as described in claim 7, wherein the base plate defines a groove in the first face thereof, the groove receiving the evaporation portion of the heat pipe therein. 10. The heat dissipation device as described in claim 7, wherein the evaporation portion of the heat pipe is sandwiched between the heat spreader and the base plate and thermally contacts the heat spreader. 11. The heat dissipation device as described in claim 7, wherein the heat spreader is sandwiched between the fin assembly and the heat pipe. 12. The heat dissipation device as described in claim 7, wherein the heat pipe is U-shaped and the heat spreader has a U-shaped configuration. 13. A heat dissipation device comprising: a fin assembly comprising a plurality of fins having a bottom face at a bottom thereof; a base plate being smaller than the bottom face of the fin assembly, having a first surface adapted for contacting with a heat-generating electronic component and a second surface opposite to the first surface; a heat pipe comprising an evaporation portion thermally engaging with the second surface of the base plate, and a curved portion extending from the evaporation portion and projecting beyond the base plate; a heat spreader being curved and comprising a curved section thereof having a profile similar to the curved portion of the heat pipe, the curved section having a first face engaging with the bottom face of the fin assembly and a second face thermally engaging with the curved portion of the heat pipe; an additional heat pipe similar to the heat pipe, wherein the additional heat pipe is so oriented that it opens to a direction opposite to that of the heat pipe; and an additional heat spreader matching the additional heat pipe, wherein the additional heat spreader is sandwiched between the fin assembly and the additional heat pipe and thermally contacts the additional heat pipe; wherein the heat spreader defines a groove at the second face thereof, the groove thermally receiving the curved portion of the heat pipe therein; wherein the curved portion of the heat pipe is L-shaped, the curved section of the heat spreader is L-shaped corresponding to the curved portion of the heat pipe; and wherein the heat pipe is U-shaped, the curved portion of the heat pipe comprises a condensation portion parallel to the evaporating portion of the heat pipe and a connecting section connecting the evaporation portion and the condensation portion. 14. The heat dissipation device as described in claim 13, wherein the evaporation portion of the heat pipe extends beyond the heat spreader. 15. The heat dissipation device as described in claim 13, further comprising two locking members soldered on two opposite sides of the bottom of the fin assembly. 16. The heat dissipation device as described in claim 15, wherein each of the two locking members comprises a beam and two fixing boards extending from two ends of the beam, each board defining a fixing hole, the fin assembly defining four cutouts at four corners thereof corresponding to the fixing holes, respectively.
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이 특허에 인용된 특허 (10)
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