A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. Th
A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.
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What is claimed is: 1. A heat dissipation device for removing heat from at least two adjacent first and second electronic devices in a computer enclosure, the computer enclosure having a plurality of connecting panels, each of the panels defining a plurality of ventilating openings, the heat dissip
What is claimed is: 1. A heat dissipation device for removing heat from at least two adjacent first and second electronic devices in a computer enclosure, the computer enclosure having a plurality of connecting panels, each of the panels defining a plurality of ventilating openings, the heat dissipation device comprising: a first heat sink mounted on the first electronic device and forming an annular structure to encircle the second electronic device, the first heat sink comprising: a base thermally engaging with the first electronic device; a first fin unit consisting of a plurality of first fins arranged on the base; a fin assembly located adjacent to the openings of two adjacent ones of the panels of the computer enclosure; and a first heat pipe connecting the base and the fin assembly, wherein the second electronic device is located among the first fin unit, the first heat pipe and the fin assembly. 2. The heat dissipation device as described in claim 1, wherein the fin assembly comprises a second fin unit consisting of a plurality of parallel second fins and a third fin unit consisting of a plurality of parallel third fins, the second fins of the second fin unit being parallel to the first fins of the first fin unit, the third fins of the third fin unit being perpendicular to the first fins of the first fin unit. 3. The heat dissipation device as described in claim 2, wherein the first heat pipe comprises an evaporation section thermally engaging with the base and a condensation section connecting one of the second fin unit and the third fin unit. 4. The heat dissipation device as described in claim 3 further comprising a second heat pipe extending from the base outwardly, wherein the second heat pipe connects the other of the second fin unit and the third fin unit, and the second heat pipe comprises an evaporation section and a condensation section. 5. The heat dissipation device as described in claim 4, wherein the first heat pipe has one end thereof in intimately contact with the base, and the other end thereof engaging with the third fin unit, the second heat pipe has one end thereof in intimately contact with the base, and the other end thereof engaging with the second fin unit. 6. The heat dissipation device as described in claim 4, wherein the first heat pipe and the second heat pipe respectively extend outwardly from two adjacent sides of the base. 7. The heat dissipation device as described in claim 4, wherein a heat-absorbing board is intimately attached to a bottom of the base, the evaporation sections of the first and second heat pipes sandwiched between the base and the heat-absorbing board, and the condensation section of the first heat pipe engaging with the third fin unit, the condensation section of the second heat pipe engaging with the second fin unit. 8. The heat dissipation device as described in claim 7, wherein the bottom of the base defines a first groove receiving the evaporation section of the first heat pipe therein, a second groove receiving the evaporation section of the second heat pipe therein, and a third groove in communication with the second groove and receiving the evaporation section of the second heat pipe therein. 9. The heat dissipation device as described in claim 8, wherein the second groove is adjacent and parallel to the first groove, the third groove extending from the second groove in a direction outwardly away from the first groove, and the third groove being joined with the second groove and defining an obtuse angle with the second groove. 10. The heat dissipation device as described in claim 4, wherein the evaporation section of the first heat pipe and the evaporation section of the second heat pipe are flat. 11. A heat dissipation device for removing heat from at least two adjacent first and second electronic devices in a computer enclosure, the heat dissipation device comprising: a first heat sink mounted on the first electronic device and the first heat sink comprising a base for thermally engaging with the first electronic device, a first fin unit consisting of a plurality of first fins arranged on the base, a fin assembly located adjacent to a plurality of openings of the computer enclosure, and a first heat pipe extending from the base outwardly and thermally engaging with the base and the fin assembly; and a second heat sink mounted on the second the electronic device, the second heat sink being surrounded by the first heat pipe, the fin assembly and the first fin unit of the first heat sink. 12. The heat dissipation device as described in claim 1, wherein the fin assembly comprises a second fin unit and a third fin unit, and the first heat pipe comprises an evaporation section thermally engaging with the base and a condensation section extending through the third fin unit. 13. The heat dissipation device as described in claim 12 further comprising a second heat pipe extending outwardly from the base, wherein the second heat pipe comprises an evaporation section thermally engaging with the base and a condensation section extending through the second fin unit. 14. The heat dissipation device as described in claim 13, wherein the first heat pipe and the second heat pipe respectively extend outwardly from the two adjacent sides of the base. 15. The heat dissipation device as described in claim 12, wherein the second fin unit partially overlaps on the second heat sink. 16. A computer system comprising: a computer enclosure having first and second parallel panels and a third panel interconnecting the first and second panels, wherein the first panel defining an air exhaust therein, the second panel defining a first air intake therein and the third panel defining a second air intake therein; a printed circuit board received in the computer enclosure; first and second electronic devices mounted on the printed circuit board; a first heat sink having a base mounted on the first electronic device, a first fin unit mounted on the base, a second fin unit located adjacent to the second air intake and a third fin unit located adjacent to the air exhaust; and heat transferring means thermally connecting the base, the second fin unit and the third fin unit together for transferring heat from the base to the second fin unit and the third fin unit; and a second heat sink mounted on the second electronic device; wherein when a first airflow flows from the first air intake to the air exhaust, the first airflow flows through the first fin unit, the second heat sink and the third fin unit to the air exhaust and wherein when a second airflow flows from the second air intake to the air exhaust, the second airflow flows through the second fin unit, the second heat sink and the third fin unit to the air exhaust. 17. The computer system of claim 16, wherein the heat transferring means comprises first heat pipe connecting the base and the second fin unit and a second heat pipe connecting the base and the third fin unit. 18. The computer system of claim 16, wherein the heat transferring means comprises a heat pipe having an evaporation section connecting with the base and two condensation sections extending from the evaporation section and thermally connecting with the second and third fin units.
Tissot, Serge; Demonchaux, Thierry; Oconte, Philippe; Vanneuville, Guy, Device for cooling an electronic card by conduction comprising heat pipes, and corresponding method of fabrication.
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