초록 ▼

Methods are provided for making a reservoir-based sensor device. The method may include fabricating a first substrate portion which comprises an upper surface, an opposed lower surface, a plurality of through holes defining reservoirs between said upper surface and said lower surface, and a pluralit

Methods are provided for making a reservoir-based sensor device. The method may include fabricating a first substrate portion which comprises an upper surface, an opposed lower surface, a plurality of through holes defining reservoirs between said upper surface and said lower surface, and a plurality of reservoir caps closing off one end of said through holes at said upper surface; fabricating a plurality of sensors on an upper surface of a second substrate portion; aligning the first and second substrate portions such that each of said plurality of sensors is in alignment with each of said plurality of reservoirs; and bonding together the lower surface of said first substrate portion and the upper surface of said second substrate portion to seal each of said sensors inside the reservoir with which it is aligned.

대표청구항 ▼

We claim: 1. A method for making a reservoir-based sensor device, comprising: fabricating a first substrate portion which comprises an upper surface, an opposed lower surface, a plurality of through holes defining reservoirs between said upper surface and said lower surface, and a plurality of rese

We claim: 1. A method for making a reservoir-based sensor device, comprising: fabricating a first substrate portion which comprises an upper surface, an opposed lower surface, a plurality of through holes defining reservoirs between said upper surface and said lower surface, and a plurality of reservoir caps closing off one end of said through holes at said upper surface; fabricating a plurality of sensors on an upper surface of a second substrate portion; aligning the first and second substrate portions such that each of said plurality of sensors is in alignment with each of said plurality of reservoirs; and bonding together the lower surface of said first substrate portion and the upper surface of said second substrate portion to seal each of said sensors inside the reservoir with which it is aligned, wherein the reservoir caps each comprise a metal membrane operable to be selectively disintegrated to open one end of the through hole closed off by the reservoir cap. 2. The method of claim 1, wherein the sensors are biosensors. 3. The method of claim 1, wherein the first and second substrate portions comprise silicon, glass, or a combination thereof 4. The method of claim 1, wherein the bonding comprises a molecular-scale bond at the interface between the materials forming the first and second substrate portions. 5. The method of claim 1, wherein the bonding comprises melting and re-solidification of the material forming the interfacing surface of one or both of the first and second substrate portions. 6. The method of claim 1, wherein the bonding comprises the use of a chemical adhesive, epoxy, or cement. 7. The method of claim 1, wherein the metal membrane comprises gold. 8. The method of claim 1, wherein the selective disintegration of the metal membrane comprises a phase change in the metal membrane by application of an electric field or current. 9. The method of claim 1, wherein the step of fabrication of the first substrate portion comprises fabricating electrical circuitry on the upper surface of the first substrate portion, wherein the electrical circuitry is used in the selective disintegration of the metal membrane. 10. The method of claim 9, wherein the electrical circuitry comprises at least one electrode tat is connected to the reservoir cap on the upper surface of the first substrate portion. 11. The method of claim 9, wherein the electrical circuitry is fabricated by a deposition, patterning, and etching process; by microcontact printing; or by soft lithography methods. 12. A method for making an implantable reservoir-based sensor device, comprising: fabricating a first substrate portion which comprises an upper surface, an opposed lower surface, a plurality of through holes defining reservoirs between said upper surface and said lower surface, and a plurality of metal reservoir caps closing off one end of said through holes at said upper surface; fabricating a plurality of biosensors on an upper surface of a second substrate portion, the biosensors comprising an enzyme or antibody; aligning the first and second substrate portions such that each of said plurality of biosensors is in alignment with each of said plurality of reservoirs; bonding together the lower surface of said first substrate portion and the upper surface of said second substrate portion to seal each of said biosensors inside the reservoir with which it is aligned; and packaging the bonded first and second substrate portions together with control circuitry and a power source into a package suitable for implantation into a patient. 13. The method of claim 12, wherein the metal reservoir caps are operable to be selectively disintegrated to open one end of the though hole closed off by the reservoir cap. 14. The method of claim 13, wherein the control circuitry and power source are operable to induce a phase change in the reservoir caps. 15. The method of claim 12, wherein the metal reservoir caps comprise gold.